FR2848023B1 - Isolation de puce par depot isolant dans des chemins d'individualisation partielle avant amincissement - Google Patents
Isolation de puce par depot isolant dans des chemins d'individualisation partielle avant amincissementInfo
- Publication number
- FR2848023B1 FR2848023B1 FR0215094A FR0215094A FR2848023B1 FR 2848023 B1 FR2848023 B1 FR 2848023B1 FR 0215094 A FR0215094 A FR 0215094A FR 0215094 A FR0215094 A FR 0215094A FR 2848023 B1 FR2848023 B1 FR 2848023B1
- Authority
- FR
- France
- Prior art keywords
- paths before
- chip insulation
- insulating deposit
- deposit chip
- individualization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
- H10W20/069—Manufacture or treatment of conductive parts of the interconnections by forming self-aligned vias or self-aligned contact plugs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P54/00—Cutting or separating of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0215094A FR2848023B1 (fr) | 2002-11-28 | 2002-11-28 | Isolation de puce par depot isolant dans des chemins d'individualisation partielle avant amincissement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0215094A FR2848023B1 (fr) | 2002-11-28 | 2002-11-28 | Isolation de puce par depot isolant dans des chemins d'individualisation partielle avant amincissement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2848023A1 FR2848023A1 (fr) | 2004-06-04 |
| FR2848023B1 true FR2848023B1 (fr) | 2005-02-18 |
Family
ID=32309874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR0215094A Expired - Fee Related FR2848023B1 (fr) | 2002-11-28 | 2002-11-28 | Isolation de puce par depot isolant dans des chemins d'individualisation partielle avant amincissement |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2848023B1 (fr) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5691248A (en) * | 1995-07-26 | 1997-11-25 | International Business Machines Corporation | Methods for precise definition of integrated circuit chip edges |
| US5889104A (en) * | 1996-01-11 | 1999-03-30 | W. L. Gore & Associates, Inc. | Low dielectric constant material for use as an insulation element in an electronic device |
| FR2804796B1 (fr) * | 2000-02-04 | 2004-11-19 | Gemplus Card Int | Procede pour la realisation de connexions electriques notamment pour un dispositif electronique |
| FR2818802B1 (fr) * | 2000-12-21 | 2003-11-28 | Gemplus Card Int | Connexion par isolant decoupe et cordon imprime en plan |
-
2002
- 2002-11-28 FR FR0215094A patent/FR2848023B1/fr not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| FR2848023A1 (fr) | 2004-06-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |
Effective date: 20090731 |