FR2862425B1 - Procede de fixation d'un module de puce - Google Patents

Procede de fixation d'un module de puce

Info

Publication number
FR2862425B1
FR2862425B1 FR0412117A FR0412117A FR2862425B1 FR 2862425 B1 FR2862425 B1 FR 2862425B1 FR 0412117 A FR0412117 A FR 0412117A FR 0412117 A FR0412117 A FR 0412117A FR 2862425 B1 FR2862425 B1 FR 2862425B1
Authority
FR
France
Prior art keywords
fixing
chip module
chip
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0412117A
Other languages
English (en)
Other versions
FR2862425A1 (fr
Inventor
Georg Drescher
Klaus Holzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient Mobile Security GmbH
Original Assignee
Giesecke and Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient GmbH filed Critical Giesecke and Devrient GmbH
Publication of FR2862425A1 publication Critical patent/FR2862425A1/fr
Application granted granted Critical
Publication of FR2862425B1 publication Critical patent/FR2862425B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
FR0412117A 2003-11-17 2004-11-16 Procede de fixation d'un module de puce Expired - Fee Related FR2862425B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10353648A DE10353648A1 (de) 2003-11-17 2003-11-17 Verfahren zum Fixieren eines Chipmoduls

Publications (2)

Publication Number Publication Date
FR2862425A1 FR2862425A1 (fr) 2005-05-20
FR2862425B1 true FR2862425B1 (fr) 2006-07-14

Family

ID=34485226

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0412117A Expired - Fee Related FR2862425B1 (fr) 2003-11-17 2004-11-16 Procede de fixation d'un module de puce

Country Status (2)

Country Link
DE (1) DE10353648A1 (fr)
FR (1) FR2862425B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1395263B1 (it) * 2009-07-29 2012-09-05 Osai A S S R L Metodo e dispositivo di condizionamento in temperatura di un elemento

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0312067B1 (fr) * 1987-10-16 1993-09-08 Sumitomo Metal Industries, Ltd. Boîte métallique pour circuit intégré et son procédé de fabrication
FR2701139B1 (fr) * 1993-02-01 1995-04-21 Solaic Sa Procédé pour l'implantation d'un micro-circuit sur un corps de carte intelligente et/ou à mémoire, et carte comportant un micro-circuit ainsi implanté.
DE4401458A1 (de) * 1994-01-19 1995-07-20 Ods Gmbh & Co Kg Verfahren und Vorrichtung zum Herstellen von Chipkarten
DE4444789C3 (de) * 1994-12-15 2001-05-10 Ods Landis & Gyr Gmbh & Co Kg Verfahren zum Herstellen von Chipkarten, Chipkarte und Vorrichtung zum Durchführen des Verfahrens
DE19705934C2 (de) * 1997-02-15 2001-05-17 Cubit Electronics Gmbh Verfahren und Vorrichtung zum Einbringen von drahtförmigen Leiterdrähten in ein Substrat
JP3627090B2 (ja) * 1997-09-17 2005-03-09 株式会社名機製作所 積層成形方法および積層成形装置
EP1033677A1 (fr) * 1999-03-04 2000-09-06 ESEC Management SA Procédé pour la fabrication d'un objet à puce
TW475227B (en) * 1999-12-28 2002-02-01 Nissei Plastics Ind Co IC-card manufacturing apparatus
DE10110939B4 (de) * 2001-03-07 2004-07-08 Mühlbauer Ag Verfahren und Vorrichtung zum Heißpressverbinden eines Chipmoduls mit einem Trägersubstrat
JP2003300222A (ja) * 2002-04-10 2003-10-21 Yamashiro Seiki Seisakusho:Kk 薄肉被覆層による樹脂被覆方法及び樹脂被覆装置

Also Published As

Publication number Publication date
DE10353648A1 (de) 2005-06-16
FR2862425A1 (fr) 2005-05-20

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Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 13

PLFP Fee payment

Year of fee payment: 14

TP Transmission of property

Owner name: GIESECKE+DEVRIENT MOBILE SECURITY GMBH, DE

Effective date: 20180619

PLFP Fee payment

Year of fee payment: 15

ST Notification of lapse

Effective date: 20200914