FR2888253B1 - Alliage d'assemblage sans plomb, a base d'etain et dont l'oxydation a l'air est retardee et utilisation d'un tel alliage. - Google Patents

Alliage d'assemblage sans plomb, a base d'etain et dont l'oxydation a l'air est retardee et utilisation d'un tel alliage.

Info

Publication number
FR2888253B1
FR2888253B1 FR0507235A FR0507235A FR2888253B1 FR 2888253 B1 FR2888253 B1 FR 2888253B1 FR 0507235 A FR0507235 A FR 0507235A FR 0507235 A FR0507235 A FR 0507235A FR 2888253 B1 FR2888253 B1 FR 2888253B1
Authority
FR
France
Prior art keywords
alloy
unleaded
delayed
tin
oxidation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0507235A
Other languages
English (en)
Other versions
FR2888253A1 (fr
Inventor
Frank Becue
Meur Jean Pierre Le
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IND DES POUDRES SPHERIQUES SA
Original Assignee
IND DES POUDRES SPHERIQUES SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IND DES POUDRES SPHERIQUES SA filed Critical IND DES POUDRES SPHERIQUES SA
Priority to FR0507235A priority Critical patent/FR2888253B1/fr
Publication of FR2888253A1 publication Critical patent/FR2888253A1/fr
Application granted granted Critical
Publication of FR2888253B1 publication Critical patent/FR2888253B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
FR0507235A 2005-07-07 2005-07-07 Alliage d'assemblage sans plomb, a base d'etain et dont l'oxydation a l'air est retardee et utilisation d'un tel alliage. Expired - Fee Related FR2888253B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0507235A FR2888253B1 (fr) 2005-07-07 2005-07-07 Alliage d'assemblage sans plomb, a base d'etain et dont l'oxydation a l'air est retardee et utilisation d'un tel alliage.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0507235A FR2888253B1 (fr) 2005-07-07 2005-07-07 Alliage d'assemblage sans plomb, a base d'etain et dont l'oxydation a l'air est retardee et utilisation d'un tel alliage.

Publications (2)

Publication Number Publication Date
FR2888253A1 FR2888253A1 (fr) 2007-01-12
FR2888253B1 true FR2888253B1 (fr) 2007-11-23

Family

ID=36071990

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0507235A Expired - Fee Related FR2888253B1 (fr) 2005-07-07 2005-07-07 Alliage d'assemblage sans plomb, a base d'etain et dont l'oxydation a l'air est retardee et utilisation d'un tel alliage.

Country Status (1)

Country Link
FR (1) FR2888253B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150266137A1 (en) * 2012-10-09 2015-09-24 Alpha Metals, Inc. Lead-free and antimony-free tin solder reliable at high temperatures
CN117066619A (zh) * 2023-08-04 2023-11-17 桂林电子科技大学 一种微电子用Sn58Bi钎料合金微互连焊点的时效强化工艺

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000197988A (ja) * 1998-03-26 2000-07-18 Nihon Superior Co Ltd 無鉛はんだ合金
GB2346383B (en) * 1999-01-28 2001-01-17 Murata Manufacturing Co Lead-free solder and soldered article
US6139979A (en) * 1999-01-28 2000-10-31 Murata Manufacturing Co., Ltd. Lead-free solder and soldered article
US6365097B1 (en) * 1999-01-29 2002-04-02 Fuji Electric Co., Ltd. Solder alloy
JP3262113B2 (ja) * 1999-01-29 2002-03-04 富士電機株式会社 はんだ合金
JP2000288772A (ja) * 1999-02-02 2000-10-17 Nippon Genma:Kk 無鉛はんだ
JP3544904B2 (ja) * 1999-09-29 2004-07-21 株式会社トッパンＮｅｃサーキットソリューションズ はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法
US6517602B2 (en) * 2000-03-14 2003-02-11 Hitachi Metals, Ltd Solder ball and method for producing same
JP2001287082A (ja) * 2000-04-05 2001-10-16 Fuji Electric Co Ltd はんだ合金
JP3786251B2 (ja) * 2000-06-30 2006-06-14 日本アルミット株式会社 無鉛半田合金
EP2942410A1 (fr) * 2001-03-01 2015-11-11 Senju Metal Industry Co., Ltd. Pâte à souder sans plomb

Also Published As

Publication number Publication date
FR2888253A1 (fr) 2007-01-12

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20100331