FR2893183B1 - Procede de protection d'un composant electronique contre les attaques par injection de faute - Google Patents

Procede de protection d'un composant electronique contre les attaques par injection de faute

Info

Publication number
FR2893183B1
FR2893183B1 FR0553434A FR0553434A FR2893183B1 FR 2893183 B1 FR2893183 B1 FR 2893183B1 FR 0553434 A FR0553434 A FR 0553434A FR 0553434 A FR0553434 A FR 0553434A FR 2893183 B1 FR2893183 B1 FR 2893183B1
Authority
FR
France
Prior art keywords
protecting
electronic component
fault injection
component against
injection attacks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0553434A
Other languages
English (en)
Other versions
FR2893183A1 (fr
Inventor
Bruno Rouchouze
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus SCA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus SCA filed Critical Gemplus SCA
Priority to FR0553434A priority Critical patent/FR2893183B1/fr
Priority to PCT/EP2006/068197 priority patent/WO2007057325A1/fr
Publication of FR2893183A1 publication Critical patent/FR2893183A1/fr
Application granted granted Critical
Publication of FR2893183B1 publication Critical patent/FR2893183B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/40—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR0553434A 2005-11-10 2005-11-10 Procede de protection d'un composant electronique contre les attaques par injection de faute Expired - Fee Related FR2893183B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0553434A FR2893183B1 (fr) 2005-11-10 2005-11-10 Procede de protection d'un composant electronique contre les attaques par injection de faute
PCT/EP2006/068197 WO2007057325A1 (fr) 2005-11-10 2006-11-07 Procede de protection d'un composant electronique contre les attaques par injection de faute

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0553434A FR2893183B1 (fr) 2005-11-10 2005-11-10 Procede de protection d'un composant electronique contre les attaques par injection de faute

Publications (2)

Publication Number Publication Date
FR2893183A1 FR2893183A1 (fr) 2007-05-11
FR2893183B1 true FR2893183B1 (fr) 2008-01-25

Family

ID=36933375

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0553434A Expired - Fee Related FR2893183B1 (fr) 2005-11-10 2005-11-10 Procede de protection d'un composant electronique contre les attaques par injection de faute

Country Status (2)

Country Link
FR (1) FR2893183B1 (fr)
WO (1) WO2007057325A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012220392B4 (de) * 2012-11-08 2025-04-24 Bundesdruckerei Gmbh Wert- und/oder Sicherheitsprodukt mit einem Schutzelement für einen Halbleiter-Chip
FR3119252B1 (fr) 2021-01-26 2023-01-06 Commissariat A L’Energie Atomique Et Aux Energies Alternatives Dispositif de protection et de supervision d’un système électronique comprenant au moins un composant électronique. Procédé associé de protection et de supervision de l’intégrité du système électronique et du dispositif, et de brouillage d’attaques.

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5258334A (en) * 1993-01-15 1993-11-02 The U.S. Government As Represented By The Director, National Security Agency Process of preventing visual access to a semiconductor device by applying an opaque ceramic coating to integrated circuit devices
TW502286B (en) * 1999-12-09 2002-09-11 Koninkl Philips Electronics Nv Semiconductor device comprising a security coating and smartcard provided with such a device
DE10105725B4 (de) * 2001-02-08 2008-11-13 Infineon Technologies Ag Halbleiterchip mit einem Substrat, einer integrierten Schaltung und einer Abschirmvorrichtung
US6731011B2 (en) * 2002-02-19 2004-05-04 Matrix Semiconductor, Inc. Memory module having interconnected and stacked integrated circuits
US7758911B2 (en) * 2003-05-08 2010-07-20 Honeywell International Inc. Microelectronic security coatings

Also Published As

Publication number Publication date
FR2893183A1 (fr) 2007-05-11
WO2007057325A1 (fr) 2007-05-24

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20090731