FR2908926B1 - Module optique - Google Patents

Module optique

Info

Publication number
FR2908926B1
FR2908926B1 FR0758759A FR0758759A FR2908926B1 FR 2908926 B1 FR2908926 B1 FR 2908926B1 FR 0758759 A FR0758759 A FR 0758759A FR 0758759 A FR0758759 A FR 0758759A FR 2908926 B1 FR2908926 B1 FR 2908926B1
Authority
FR
France
Prior art keywords
stem
piercing hole
optical module
lead
top surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0758759A
Other languages
English (en)
Other versions
FR2908926A1 (fr
Inventor
Hiromitsu Itamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2908926A1 publication Critical patent/FR2908926A1/fr
Application granted granted Critical
Publication of FR2908926B1 publication Critical patent/FR2908926B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0427—Electrical excitation ; Circuits therefor for applying modulation to the laser
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
FR0758759A 2006-11-21 2007-10-31 Module optique Expired - Fee Related FR2908926B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006314563A JP2008130834A (ja) 2006-11-21 2006-11-21 光モジュール

Publications (2)

Publication Number Publication Date
FR2908926A1 FR2908926A1 (fr) 2008-05-23
FR2908926B1 true FR2908926B1 (fr) 2010-12-24

Family

ID=39357727

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0758759A Expired - Fee Related FR2908926B1 (fr) 2006-11-21 2007-10-31 Module optique

Country Status (3)

Country Link
US (1) US7813649B2 (fr)
JP (1) JP2008130834A (fr)
FR (1) FR2908926B1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5312358B2 (ja) * 2009-04-24 2013-10-09 京セラ株式会社 電子部品搭載用パッケージおよびそれを用いた電子装置
DE102013114547B4 (de) * 2013-01-18 2020-01-16 Schott Ag TO-Gehäuse
JP6654364B2 (ja) * 2015-06-12 2020-02-26 日本ルメンタム株式会社 光モジュール
EP3965146B1 (fr) 2020-09-03 2025-04-09 Schott Ag Embase pour un composant électronique
EP3965147A1 (fr) * 2020-09-03 2022-03-09 Schott Ag Embase pour un composant électronique ou opto-électronique et son procédé de fabrication
EP3965145B1 (fr) 2020-09-03 2025-04-16 Schott Ag Embase de transistor pour boîtier optoélectronique à grande vitesse
DE102021112740A1 (de) * 2021-05-17 2022-11-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische baugruppe und verfahren

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04365381A (ja) 1991-06-13 1992-12-17 Nec Kagoshima Ltd 半導体受光素子搭載用ステム
EP0893861A3 (fr) 1997-07-25 2000-01-12 Oki Electric Industry Co., Ltd. Module optique
KR100464342B1 (ko) * 2003-04-14 2005-01-03 삼성전자주식회사 티오-캔 구조의 광 모듈
JP4493285B2 (ja) * 2003-05-28 2010-06-30 京セラ株式会社 光半導体素子収納用パッケージおよび光半導体装置
JP3990674B2 (ja) * 2004-02-10 2007-10-17 日本オプネクスト株式会社 光送信機
JP4756840B2 (ja) * 2004-09-13 2011-08-24 三菱電機株式会社 キャンパッケージ型光半導体装置および光モジュール
JP4951989B2 (ja) * 2006-02-09 2012-06-13 富士通セミコンダクター株式会社 半導体装置
JP4365381B2 (ja) 2006-04-05 2009-11-18 株式会社エヌ・ティ・ティ・ドコモ 通信制御方法及び通信制御装置

Also Published As

Publication number Publication date
US20080118251A1 (en) 2008-05-22
FR2908926A1 (fr) 2008-05-23
US7813649B2 (en) 2010-10-12
JP2008130834A (ja) 2008-06-05

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20130628