FR2914406B1 - Echangeur de chaleur hybride - Google Patents

Echangeur de chaleur hybride

Info

Publication number
FR2914406B1
FR2914406B1 FR0802567A FR0802567A FR2914406B1 FR 2914406 B1 FR2914406 B1 FR 2914406B1 FR 0802567 A FR0802567 A FR 0802567A FR 0802567 A FR0802567 A FR 0802567A FR 2914406 B1 FR2914406 B1 FR 2914406B1
Authority
FR
France
Prior art keywords
heat exchanger
hybrid heat
hybrid
exchanger
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0802567A
Other languages
English (en)
Other versions
FR2914406A1 (fr
Inventor
Charles D Hood
Ioan Sauciuc
Mohammed Tantoush
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dell Products LP
Original Assignee
Dell Products LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dell Products LP filed Critical Dell Products LP
Priority to FR0802567A priority Critical patent/FR2914406B1/fr
Publication of FR2914406A1 publication Critical patent/FR2914406A1/fr
Application granted granted Critical
Publication of FR2914406B1 publication Critical patent/FR2914406B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0251—Removal of heat by a gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/0408—Multi-circuit heat exchangers, e.g. integrating different heat exchange sections in the same unit or heat exchangers for more than two fluids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Air-Conditioning For Vehicles (AREA)
FR0802567A 2006-10-13 2008-05-13 Echangeur de chaleur hybride Active FR2914406B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0802567A FR2914406B1 (fr) 2006-10-13 2008-05-13 Echangeur de chaleur hybride

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/580,671 US8453467B2 (en) 2006-10-13 2006-10-13 Hybrid heat exchanger
FR0707125A FR2907201B1 (fr) 2006-10-13 2007-10-11 Echangeur de chaleur hybride
FR0802567A FR2914406B1 (fr) 2006-10-13 2008-05-13 Echangeur de chaleur hybride

Publications (2)

Publication Number Publication Date
FR2914406A1 FR2914406A1 (fr) 2008-10-03
FR2914406B1 true FR2914406B1 (fr) 2015-11-27

Family

ID=38787877

Family Applications (2)

Application Number Title Priority Date Filing Date
FR0707125A Active FR2907201B1 (fr) 2006-10-13 2007-10-11 Echangeur de chaleur hybride
FR0802567A Active FR2914406B1 (fr) 2006-10-13 2008-05-13 Echangeur de chaleur hybride

Family Applications Before (1)

Application Number Title Priority Date Filing Date
FR0707125A Active FR2907201B1 (fr) 2006-10-13 2007-10-11 Echangeur de chaleur hybride

Country Status (9)

Country Link
US (2) US8453467B2 (fr)
CN (2) CN101175392A (fr)
BR (1) BRPI0703896B1 (fr)
DE (1) DE102007048645B4 (fr)
FR (2) FR2907201B1 (fr)
GB (1) GB2442864B (fr)
MY (1) MY149481A (fr)
SG (1) SG142246A1 (fr)
TW (1) TWI386154B (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8453467B2 (en) 2006-10-13 2013-06-04 Dell Products, Lp Hybrid heat exchanger
CN105247300A (zh) * 2012-11-08 2016-01-13 B/E航空公司 具有液体和空气热交换器的热电装置
DE102012222635A1 (de) * 2012-12-10 2014-06-12 Behr Gmbh & Co. Kg Wärmeübertrager, insbesondere für ein Kraftfahrzeug
US20160161998A1 (en) * 2014-12-05 2016-06-09 Corsair Memory, Inc. Actively Cooled Liquid Cooling System
US10295229B2 (en) 2015-09-18 2019-05-21 Hamilton Sundstrand Corporation Thermoelectric cooling system
US9968010B2 (en) 2015-12-21 2018-05-08 Dell Products, L.P. Information handling system having flexible chassis block radiators
TWI663903B (zh) * 2015-12-30 2019-06-21 Micro-Star Int'l Co.,Ltd. 熱電致冷模組與包含熱電致冷模組的散熱裝置
US11249522B2 (en) * 2016-06-30 2022-02-15 Intel Corporation Heat transfer apparatus for a computer environment
US10077682B2 (en) 2016-12-21 2018-09-18 General Electric Company System and method for managing heat duty for a heat recovery system
CN107763900A (zh) * 2017-11-14 2018-03-06 广州番禺速能冷暖设备有限公司 一种紧凑型壳管式换热器
TWI662402B (zh) * 2018-06-06 2019-06-11 酷碼科技股份有限公司 冷卻系統及水冷排
CN109944806B (zh) * 2019-04-23 2024-08-13 迎新科技(中国)有限公司 并联双泵导液装置及其液冷散热系统
TWM575882U (zh) * 2018-11-22 2019-03-21 訊凱國際股份有限公司 外接式水冷裝置
US20220205690A1 (en) * 2019-07-31 2022-06-30 Hewlett-Packard Development Company, L.P. Temperature control of thermoelectric cooling for liquid cooling systems
US11825628B2 (en) * 2020-08-19 2023-11-21 Baidu Usa Llc Hybrid cooling system for electronic racks
US11849562B2 (en) 2022-02-24 2023-12-19 International Business Machines Corporation Hybrid in-drawer computer equipment cooling device

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1071999A (en) * 1912-08-05 1913-09-02 Nat Metal Molding Company Lock.
US4090145A (en) * 1969-03-24 1978-05-16 Webb Joseph A Digital quadrature demodulator
US4306313A (en) * 1979-10-11 1981-12-15 International Telephone And Telegraph Corporation High reliability optical fiber communication system
US4546408A (en) * 1983-05-16 1985-10-08 Illinois Tool Works Inc. Electrically insulated heat sink assemblies and insulators used therein
US4893316A (en) * 1985-04-04 1990-01-09 Motorola, Inc. Digital radio frequency receiver
US5457342A (en) * 1994-03-30 1995-10-10 Herbst, Ii; Gerhardt G. Integrated circuit cooling apparatus
US5754412A (en) * 1995-10-04 1998-05-19 Hartwell Corporation Circuit board standoff connector
EP0837290B1 (fr) * 1996-10-16 2003-04-23 Thermovonics Co., Ltd Refroidisseur d'eau
US6002924A (en) * 1996-12-31 1999-12-14 Aor, Ltd. Full-spectrum all-mode radio receiver apparatus and method
GB2322732A (en) 1997-02-24 1998-09-02 W S Atkins Consultants Limited Controlling the temperature of dispensed liquids
DE19733455B4 (de) * 1997-08-02 2012-03-29 Curamik Electronics Gmbh Wärmetauscheranordnung sowie Kühlsystem mit wenigstens einer derartigen Wärmetauscheranordnung
US6058009A (en) * 1998-07-14 2000-05-02 Dell Usa, L.P. Computer with improved internal cooling system
US6038128A (en) * 1998-07-14 2000-03-14 Dell U.S.A., L.P. Computer and computer/docking assembly with improved internal cooling
US6125035A (en) * 1998-10-13 2000-09-26 Dell Usa, L.P. Heat sink assembly with rotating heat pipe
US6226178B1 (en) * 1999-10-12 2001-05-01 Dell Usa, L.P. Apparatus for cooling a heat generating component in a computer
US20030175091A1 (en) * 2000-03-10 2003-09-18 Aukzemas Thomas V. Floating captive screw
US6726505B2 (en) * 2000-07-20 2004-04-27 Silicon Graphics, Inc. Memory daughter card apparatus, configurations, and methods
US6471310B2 (en) * 2001-01-22 2002-10-29 Sun Microsystems, Inc. Circuit board retaining assembly
US6543098B2 (en) * 2001-03-02 2003-04-08 Tektronix, Inc. Printed circuit board mounting facility
US6341490B1 (en) * 2001-03-03 2002-01-29 Gilson, Inc. Heat transfer apparatus for sample containing well plates
US6567262B2 (en) * 2001-06-01 2003-05-20 Active Cool Ltd. Liquid cooled TEC based system and method for cooling heat sensitive elements
US6971442B2 (en) * 2001-06-29 2005-12-06 Intel Corporation Method and apparatus for dissipating heat from an electronic device
TW543828U (en) * 2001-07-12 2003-07-21 Foxconn Prec Components Co Ltd Assembly of heating-tube heat sink
CA2352997A1 (fr) * 2001-07-13 2003-01-13 Coolit Systems Inc. Appareil de refroidissement par ordinateur
KR100404430B1 (ko) * 2001-07-28 2003-11-05 한국표준과학연구원 열전소자를 이용한 고안정도의 항온장치
US6549410B1 (en) * 2001-11-20 2003-04-15 Hewlett-Packard Company Heatsink mounting system
IL146838A0 (en) * 2001-11-29 2002-07-25 Active Cool Ltd Active cooling system for cpu
US6666031B2 (en) * 2002-03-14 2003-12-23 Komatsu, Ltd. Fluid temperature control apparatus
US6705089B2 (en) * 2002-04-04 2004-03-16 International Business Machines Corporation Two stage cooling system employing thermoelectric modules
JP3936308B2 (ja) * 2002-07-12 2007-06-27 古河電気工業株式会社 フィン一体型ヒートシンクおよびその製造方法
KR200311170Y1 (ko) * 2003-02-05 2003-04-21 이영아 도장
TW560835U (en) * 2003-02-25 2003-11-01 Datech Technology Co Ltd Heat sink assembly with heat pipe
US6845622B2 (en) * 2003-03-27 2005-01-25 Intel Corporation Phase-change refrigeration apparatus with thermoelectric cooling element and methods
JP2005026642A (ja) * 2003-07-04 2005-01-27 Furukawa Electric Co Ltd:The 熱交換器
DE10334798B4 (de) * 2003-07-30 2005-06-23 Fujitsu Siemens Computers Gmbh Anordnung zur Kühlung von wärmeentwickelnden Computerkomponenten
US6837063B1 (en) * 2003-07-31 2005-01-04 Dell Products L.P. Power management of a computer with vapor-cooled processor
CA2476251A1 (fr) * 2003-08-12 2005-02-12 Coolit Systems Inc. Dissipateur de chaleur
US7042727B2 (en) * 2003-09-26 2006-05-09 Intel Corporation Heat sink mounting and interface mechanism and method of assembling same
US7082031B2 (en) * 2003-09-30 2006-07-25 Intel Corporation Heatsink device and method
US7280362B2 (en) * 2003-12-04 2007-10-09 Dell Products L.P. Method and apparatus for attaching a processor and corresponding heat sink to a circuit board
US6917522B1 (en) * 2003-12-29 2005-07-12 Intel Corporation Apparatus and method for cooling integrated circuit devices
US20050145371A1 (en) * 2003-12-31 2005-07-07 Eric Distefano Thermal solution for electronics cooling using a heat pipe in combination with active loop solution
CN2689323Y (zh) * 2004-03-11 2005-03-30 鸿富锦精密工业（深圳）有限公司 主板固定装置
US7220951B2 (en) * 2004-04-19 2007-05-22 Surgrx, Inc. Surgical sealing surfaces and methods of use
GB2416243B (en) * 2004-07-09 2006-05-24 Giga Byte Tech Co Ltd Two stage radiation thermoelectric cooling apparatus
US7227761B2 (en) * 2004-10-13 2007-06-05 Lenovo Singapore Pte, Ltd. Apparatus for resiliently mounting a circuit board within a device housing
US7423876B2 (en) * 2004-10-15 2008-09-09 Dell Products L.P. System and method for heat dissipation in an information handling system
US7650757B2 (en) 2005-01-24 2010-01-26 Delphi Technologies, Inc. Thermoelectric heat transfer system
JP4804901B2 (ja) * 2005-01-26 2011-11-02 古河スカイ株式会社 熱交換器及び当該熱交換器用フィン材
US20060238984A1 (en) * 2005-04-20 2006-10-26 Belady Christian L Thermal dissipation device with thermal compound recesses
US8453467B2 (en) 2006-10-13 2013-06-04 Dell Products, Lp Hybrid heat exchanger
US20080100521A1 (en) * 2006-10-30 2008-05-01 Derek Herbert Antenna assemblies with composite bases

Also Published As

Publication number Publication date
FR2907201A1 (fr) 2008-04-18
GB0719730D0 (en) 2007-11-21
MY149481A (en) 2013-08-30
US20130232995A1 (en) 2013-09-12
US9588554B2 (en) 2017-03-07
IE20070734A1 (en) 2008-06-11
US20080087024A1 (en) 2008-04-17
US8453467B2 (en) 2013-06-04
CN102230684A (zh) 2011-11-02
DE102007048645B4 (de) 2020-03-12
FR2907201B1 (fr) 2019-08-23
SG142246A1 (en) 2008-05-28
TW200830982A (en) 2008-07-16
GB2442864A (en) 2008-04-16
DE102007048645A1 (de) 2008-06-05
GB2442864B (en) 2009-08-19
BRPI0703896B1 (pt) 2021-05-25
CN101175392A (zh) 2008-05-07
TWI386154B (zh) 2013-02-11
FR2914406A1 (fr) 2008-10-03
BRPI0703896A2 (pt) 2010-08-31

Similar Documents

Publication Publication Date Title
EP2032929A4 (fr) Échangeur de chaleur
DK2176616T3 (da) Varmeveksler
EP1801532A4 (fr) Échangeur de chaleur
GB2442864B (en) Hybrid heat exchanger
GB2473986B (en) Heat exchanger
FR2954482B1 (fr) Echangeur de chaleur
EP2511644A4 (fr) Échangeur de chaleur
FR2954481B1 (fr) Echangeur de chaleur
EP2110635A4 (fr) Échangeur de chaleur
EP2423633A4 (fr) Échangeur de chaleur
EP1987297A4 (fr) Echangeur de chaleur de forme triangulaire
PL1867944T3 (pl) Wymiennik ciepła
EP1903286A4 (fr) Echangeur de chaleur
EP2505951A4 (fr) Échangeur de chaleur
EP1895256A4 (fr) Echangeur de chaleur
EP2031334A4 (fr) Échangeur de chaleur
EP1895257A4 (fr) Echangeur de chaleur
DK2097705T3 (da) Pladevarmeveksler
FR2950960B1 (fr) Echangeur de chaleur
FR2930333B3 (fr) Accumulateur latent de chaleur
FR2915792B1 (fr) Echangeur de chaleur extrude
EP2106520A4 (fr) Ailette d'échangeur de chaleur
ITUD20070025A1 (it) Scambiatore di calore
FR2938904B1 (fr) Echangeur de chaleur
FR2933179B1 (fr) Echangeur de chaleur

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 9

PLFP Fee payment

Year of fee payment: 10

PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 13

PLFP Fee payment

Year of fee payment: 14

PLFP Fee payment

Year of fee payment: 15

PLFP Fee payment

Year of fee payment: 16

PLFP Fee payment

Year of fee payment: 17

PLFP Fee payment

Year of fee payment: 18

PLFP Fee payment

Year of fee payment: 19