FR2952377B1 - Dispositif de contact pour ameliorer la dissipation thermique des appareils generateurs de chaleur - Google Patents
Dispositif de contact pour ameliorer la dissipation thermique des appareils generateurs de chaleurInfo
- Publication number
- FR2952377B1 FR2952377B1 FR0905377A FR0905377A FR2952377B1 FR 2952377 B1 FR2952377 B1 FR 2952377B1 FR 0905377 A FR0905377 A FR 0905377A FR 0905377 A FR0905377 A FR 0905377A FR 2952377 B1 FR2952377 B1 FR 2952377B1
- Authority
- FR
- France
- Prior art keywords
- heat generating
- contact device
- generating devices
- thermal dissipation
- improving thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0905377A FR2952377B1 (fr) | 2009-11-09 | 2009-11-09 | Dispositif de contact pour ameliorer la dissipation thermique des appareils generateurs de chaleur |
| PCT/FR2010/000705 WO2011055028A1 (fr) | 2009-11-09 | 2010-10-27 | Dispositif de contact pour améliorer la dissipation thermique des appareils générateurs de chaleur |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0905377A FR2952377B1 (fr) | 2009-11-09 | 2009-11-09 | Dispositif de contact pour ameliorer la dissipation thermique des appareils generateurs de chaleur |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2952377A1 FR2952377A1 (fr) | 2011-05-13 |
| FR2952377B1 true FR2952377B1 (fr) | 2012-05-04 |
Family
ID=42224831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR0905377A Active FR2952377B1 (fr) | 2009-11-09 | 2009-11-09 | Dispositif de contact pour ameliorer la dissipation thermique des appareils generateurs de chaleur |
Country Status (2)
| Country | Link |
|---|---|
| FR (1) | FR2952377B1 (fr) |
| WO (1) | WO2011055028A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103965839A (zh) * | 2013-02-05 | 2014-08-06 | 中国科学院上海微系统与信息技术研究所 | 一种柔性导热垫片的制备方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5459352A (en) * | 1993-03-31 | 1995-10-17 | Unisys Corporation | Integrated circuit package having a liquid metal-aluminum/copper joint |
| DE10015962C2 (de) * | 2000-03-30 | 2002-04-04 | Infineon Technologies Ag | Hochtemperaturfeste Lotverbindung für Halbleiterbauelement |
| LU90721B1 (en) * | 2001-01-25 | 2002-07-26 | Circuit Foil Luxembourg Trading Sarl | Method for producing metal foams and furnace for producing same |
| FR2847391A1 (fr) * | 2002-11-20 | 2004-05-21 | A M C | Dispositif de contact pour ameliorer la duree de vie des connexions electriques |
| JP4413649B2 (ja) * | 2004-03-03 | 2010-02-10 | 日産自動車株式会社 | 放熱構造体及びその製造方法 |
| KR100584304B1 (ko) * | 2004-04-30 | 2006-05-26 | 엘지전자 주식회사 | 흡열/발열 물품의 열전달 능력 향상 장치 |
| US7727815B2 (en) * | 2004-09-29 | 2010-06-01 | Intel Corporation | Reactive gettering in phase change solders to inhibit oxidation at contact surfaces |
-
2009
- 2009-11-09 FR FR0905377A patent/FR2952377B1/fr active Active
-
2010
- 2010-10-27 WO PCT/FR2010/000705 patent/WO2011055028A1/fr not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011055028A1 (fr) | 2011-05-12 |
| FR2952377A1 (fr) | 2011-05-13 |
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Legal Events
| Date | Code | Title | Description |
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| PLFP | Fee payment |
Year of fee payment: 7 |
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| PLFP | Fee payment |
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| PLFP | Fee payment |
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| PLFP | Fee payment |
Year of fee payment: 16 |
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| PLFP | Fee payment |
Year of fee payment: 17 |