FR2953329B1 - Procede et dispositif de fabrication d'une microstructure par transfert. - Google Patents

Procede et dispositif de fabrication d'une microstructure par transfert.

Info

Publication number
FR2953329B1
FR2953329B1 FR0958583A FR0958583A FR2953329B1 FR 2953329 B1 FR2953329 B1 FR 2953329B1 FR 0958583 A FR0958583 A FR 0958583A FR 0958583 A FR0958583 A FR 0958583A FR 2953329 B1 FR2953329 B1 FR 2953329B1
Authority
FR
France
Prior art keywords
transfer
manufacturing microstructure
microstructure
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0958583A
Other languages
English (en)
Other versions
FR2953329A1 (fr
Inventor
Sebastien Brault
Fabrice Verjus
Elisabeth Dufour-Gergam
Martial Desgeorges
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KFM Technology SRL
Original Assignee
KFM Technology SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KFM Technology SRL filed Critical KFM Technology SRL
Priority to FR0958583A priority Critical patent/FR2953329B1/fr
Priority to PCT/FR2010/052582 priority patent/WO2011067533A1/fr
Publication of FR2953329A1 publication Critical patent/FR2953329A1/fr
Priority to FR1253348A priority patent/FR2971619B1/fr
Application granted granted Critical
Publication of FR2953329B1 publication Critical patent/FR2953329B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0191—Transfer of a layer from a carrier wafer to a device wafer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/035—Soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/05—Aligning components to be assembled
    • B81C2203/051—Active alignment, e.g. using internal or external actuators, magnets, sensors, marks or marks detectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FR0958583A 2009-12-02 2009-12-02 Procede et dispositif de fabrication d'une microstructure par transfert. Expired - Fee Related FR2953329B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0958583A FR2953329B1 (fr) 2009-12-02 2009-12-02 Procede et dispositif de fabrication d'une microstructure par transfert.
PCT/FR2010/052582 WO2011067533A1 (fr) 2009-12-02 2010-12-01 Procede et dispositif de fabrication d'une microstructure par transfert.
FR1253348A FR2971619B1 (fr) 2009-12-02 2012-04-12 Procede et dispositif de fabrication d'une microstructure par transfert

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0958583A FR2953329B1 (fr) 2009-12-02 2009-12-02 Procede et dispositif de fabrication d'une microstructure par transfert.

Publications (2)

Publication Number Publication Date
FR2953329A1 FR2953329A1 (fr) 2011-06-03
FR2953329B1 true FR2953329B1 (fr) 2012-06-01

Family

ID=42342650

Family Applications (2)

Application Number Title Priority Date Filing Date
FR0958583A Expired - Fee Related FR2953329B1 (fr) 2009-12-02 2009-12-02 Procede et dispositif de fabrication d'une microstructure par transfert.
FR1253348A Expired - Fee Related FR2971619B1 (fr) 2009-12-02 2012-04-12 Procede et dispositif de fabrication d'une microstructure par transfert

Family Applications After (1)

Application Number Title Priority Date Filing Date
FR1253348A Expired - Fee Related FR2971619B1 (fr) 2009-12-02 2012-04-12 Procede et dispositif de fabrication d'une microstructure par transfert

Country Status (2)

Country Link
FR (2) FR2953329B1 (fr)
WO (1) WO2011067533A1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3576655B2 (ja) * 1995-09-14 2004-10-13 キヤノン株式会社 微小探針の製造方法及びその製造用雌型基板、並びにその微小探針を有するプローブの製造方法
JPH09229945A (ja) * 1996-02-23 1997-09-05 Canon Inc マイクロ構造体を支持するエアブリッジ型構造体の製造方法とその雌型基板、並びに、エアブリッジ型構造体とそれを用いたマイクロ構造体およびトンネル電流または微小力検出用のプローブ
US7682860B2 (en) * 2006-03-21 2010-03-23 Dalsa Semiconductor Inc. Protection capsule for MEMS devices
US7799656B2 (en) * 2007-03-15 2010-09-21 Dalsa Semiconductor Inc. Microchannels for BioMEMS devices
US8201325B2 (en) * 2007-11-22 2012-06-19 International Business Machines Corporation Method for producing an integrated device

Also Published As

Publication number Publication date
FR2953329A1 (fr) 2011-06-03
FR2971619A1 (fr) 2012-08-17
FR2971619B1 (fr) 2015-01-16
WO2011067533A1 (fr) 2011-06-09

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Year of fee payment: 7

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Effective date: 20180831