FR2957192B1 - Module electronique de puissance pour un actionneur pour aeronef - Google Patents
Module electronique de puissance pour un actionneur pour aeronefInfo
- Publication number
- FR2957192B1 FR2957192B1 FR1000866A FR1000866A FR2957192B1 FR 2957192 B1 FR2957192 B1 FR 2957192B1 FR 1000866 A FR1000866 A FR 1000866A FR 1000866 A FR1000866 A FR 1000866A FR 2957192 B1 FR2957192 B1 FR 2957192B1
- Authority
- FR
- France
- Prior art keywords
- aircraft
- power module
- electronic power
- actuator
- fastened
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/60—Seals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W95/00—Packaging processes not covered by the other groups of this subclass
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1000866A FR2957192B1 (fr) | 2010-03-03 | 2010-03-03 | Module electronique de puissance pour un actionneur pour aeronef |
| US13/037,671 US20110215194A1 (en) | 2010-03-03 | 2011-03-01 | Electronic power module for an aircraft actuator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1000866A FR2957192B1 (fr) | 2010-03-03 | 2010-03-03 | Module electronique de puissance pour un actionneur pour aeronef |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2957192A1 FR2957192A1 (fr) | 2011-09-09 |
| FR2957192B1 true FR2957192B1 (fr) | 2013-10-25 |
Family
ID=42667274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1000866A Active FR2957192B1 (fr) | 2010-03-03 | 2010-03-03 | Module electronique de puissance pour un actionneur pour aeronef |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20110215194A1 (fr) |
| FR (1) | FR2957192B1 (fr) |
Family Cites Families (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4147889A (en) * | 1978-02-28 | 1979-04-03 | Amp Incorporated | Chip carrier |
| JPS58154250A (ja) * | 1982-03-09 | 1983-09-13 | Sanyo Electric Co Ltd | 混成集積回路 |
| DE3604882A1 (de) * | 1986-02-15 | 1987-08-20 | Bbc Brown Boveri & Cie | Leistungshalbleitermodul und verfahren zur herstellung des moduls |
| US4953173A (en) * | 1987-08-08 | 1990-08-28 | Kabushiki Kaisha Toshiba | Semiconductor device |
| JP2600617B2 (ja) * | 1994-08-18 | 1997-04-16 | 日本電気株式会社 | 半導体装置およびその製造方法 |
| JP3236191B2 (ja) * | 1995-06-16 | 2001-12-10 | キヤノン株式会社 | 電子機器 |
| US5956576A (en) * | 1996-09-13 | 1999-09-21 | International Business Machines Corporation | Enhanced protection of semiconductors with dual surface seal |
| US6507116B1 (en) * | 1997-04-24 | 2003-01-14 | International Business Machines Corporation | Electronic package and method of forming |
| US5821161A (en) * | 1997-05-01 | 1998-10-13 | International Business Machines Corporation | Cast metal seal for semiconductor substrates and process thereof |
| US5901044A (en) * | 1997-07-10 | 1999-05-04 | Ilc Data Device Corporation | Mini-module with upwardly directed leads |
| US5990418A (en) * | 1997-07-29 | 1999-11-23 | International Business Machines Corporation | Hermetic CBGA/CCGA structure with thermal paste cooling |
| JP3462979B2 (ja) * | 1997-12-01 | 2003-11-05 | 株式会社東芝 | 半導体装置 |
| US6281573B1 (en) * | 1998-03-31 | 2001-08-28 | International Business Machines Corporation | Thermal enhancement approach using solder compositions in the liquid state |
| JP3445511B2 (ja) * | 1998-12-10 | 2003-09-08 | 株式会社東芝 | 絶縁基板、その製造方法およびそれを用いた半導体装置 |
| US6218730B1 (en) * | 1999-01-06 | 2001-04-17 | International Business Machines Corporation | Apparatus for controlling thermal interface gap distance |
| US6197619B1 (en) * | 1999-01-28 | 2001-03-06 | International Business Machines Corporation | Method for reinforcing a semiconductor device to prevent cracking |
| JP3269815B2 (ja) * | 1999-12-13 | 2002-04-02 | 富士通株式会社 | 半導体装置及びその製造方法 |
| JP2001189416A (ja) * | 1999-12-28 | 2001-07-10 | Mitsubishi Electric Corp | パワーモジュール |
| JP2001210761A (ja) * | 2000-01-24 | 2001-08-03 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| JP3459804B2 (ja) * | 2000-02-28 | 2003-10-27 | Necエレクトロニクス株式会社 | 半導体装置 |
| JP2002141463A (ja) * | 2000-10-31 | 2002-05-17 | Mitsubishi Electric Corp | 半導体モジュール |
| JP3400427B2 (ja) * | 2000-11-28 | 2003-04-28 | 株式会社東芝 | 電子部品ユニット及び電子部品ユニットを実装した印刷配線板装置 |
| US6459144B1 (en) * | 2001-03-02 | 2002-10-01 | Siliconware Precision Industries Co., Ltd. | Flip chip semiconductor package |
| US6486554B2 (en) * | 2001-03-30 | 2002-11-26 | International Business Machines Corporation | Molded body for PBGA and chip-scale packages |
| US6809937B2 (en) * | 2001-11-16 | 2004-10-26 | Hewlett-Packard Development Company, L.P. | Method and apparatus for shock and vibration isolation of a circuit component |
| JP2003289191A (ja) * | 2002-03-28 | 2003-10-10 | Denso Corp | 電子制御装置 |
| US6744640B2 (en) * | 2002-04-10 | 2004-06-01 | Gore Enterprise Holdings, Inc. | Board-level EMI shield with enhanced thermal dissipation |
| US7023699B2 (en) * | 2002-06-10 | 2006-04-04 | Visteon Global Technologies, Inc. | Liquid cooled metal thermal stack for high-power dies |
| US6781231B2 (en) * | 2002-09-10 | 2004-08-24 | Knowles Electronics Llc | Microelectromechanical system package with environmental and interference shield |
| JP4390541B2 (ja) * | 2003-02-03 | 2009-12-24 | Necエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
| US6921974B2 (en) * | 2003-03-28 | 2005-07-26 | United Test & Assembly Center Ltd. | Packaged device with thermal enhancement and method of packaging |
| US7180173B2 (en) * | 2003-11-20 | 2007-02-20 | Taiwan Semiconductor Manufacturing Co. Ltd. | Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC) |
| US7575956B2 (en) * | 2003-11-24 | 2009-08-18 | St Assembly Test Services Ltd. | Fabrication method for semiconductor package heat spreaders |
| WO2005059995A2 (fr) * | 2003-12-18 | 2005-06-30 | Rf Module And Optical Design Limited | Ameliorations apportees a des conditionnements electroniques |
| US6965171B1 (en) * | 2004-06-07 | 2005-11-15 | International Business Machines Corporation | Method and structure for selective thermal paste deposition and retention on integrated circuit chip modules |
| US7204737B2 (en) * | 2004-09-23 | 2007-04-17 | Temic Automotive Of North America, Inc. | Hermetically sealed microdevice with getter shield |
| JP2006156544A (ja) * | 2004-11-26 | 2006-06-15 | Denso Corp | 基板の実装構造およびその実装方法 |
| JP2006269639A (ja) * | 2005-03-23 | 2006-10-05 | Denso Corp | 放熱装置および車載電子機器 |
| US7268428B2 (en) * | 2005-07-19 | 2007-09-11 | International Business Machines Corporation | Thermal paste containment for semiconductor modules |
| JP2007184351A (ja) * | 2006-01-05 | 2007-07-19 | Nec Electronics Corp | 半導体装置及びその製造方法 |
| US20080067650A1 (en) * | 2006-09-15 | 2008-03-20 | Hong Kong Applied Science and Technology Research Institute Company Limited | Electronic component package with EMI shielding |
| US7498673B2 (en) * | 2006-11-21 | 2009-03-03 | International Business Machines Corporation | Heatplates for heatsink attachment for semiconductor chips |
| US8139364B2 (en) * | 2007-01-31 | 2012-03-20 | Robert Bosch Gmbh | Electronic control module assembly |
| US7709951B2 (en) * | 2007-03-16 | 2010-05-04 | International Business Machines Corporation | Thermal pillow |
| US7944033B2 (en) * | 2007-10-18 | 2011-05-17 | Infineon Technologies Ag | Power semiconductor module |
| US7763970B2 (en) * | 2008-02-27 | 2010-07-27 | Infineon Technologies Ag | Power module |
| JP2009290118A (ja) * | 2008-05-30 | 2009-12-10 | Toshiba Corp | 電子機器 |
| JP5171549B2 (ja) * | 2008-10-30 | 2013-03-27 | ルネサスエレクトロニクス株式会社 | 電子装置 |
| DE102009026558B3 (de) * | 2009-05-28 | 2010-12-02 | Infineon Technologies Ag | Leistungshalbleitermodul mit beweglich gelagerten Schaltungsträgern und Verfahren zur Herstellung eines solchen Leistungshalbleitermoduls |
| JP5071447B2 (ja) * | 2009-07-14 | 2012-11-14 | 株式会社デンソー | 電子制御装置 |
| US8143110B2 (en) * | 2009-12-23 | 2012-03-27 | Intel Corporation | Methods and apparatuses to stiffen integrated circuit package |
| US8354747B1 (en) * | 2010-06-01 | 2013-01-15 | Amkor Technology, Inc | Conductive polymer lid for a sensor package and method therefor |
-
2010
- 2010-03-03 FR FR1000866A patent/FR2957192B1/fr active Active
-
2011
- 2011-03-01 US US13/037,671 patent/US20110215194A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| FR2957192A1 (fr) | 2011-09-09 |
| US20110215194A1 (en) | 2011-09-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TP | Transmission of property |
Owner name: LABINAL POWER SYSTEMS, FR Effective date: 20150312 |
|
| PLFP | Fee payment |
Year of fee payment: 7 |
|
| PLFP | Fee payment |
Year of fee payment: 8 |
|
| CA | Change of address |
Effective date: 20171002 |
|
| CA | Change of address |
Effective date: 20171218 |
|
| CD | Change of name or company name |
Owner name: SAFRAN ELECTRICAL & POWER, FR Effective date: 20171218 |
|
| PLFP | Fee payment |
Year of fee payment: 9 |
|
| PLFP | Fee payment |
Year of fee payment: 10 |
|
| PLFP | Fee payment |
Year of fee payment: 11 |
|
| PLFP | Fee payment |
Year of fee payment: 12 |
|
| PLFP | Fee payment |
Year of fee payment: 13 |
|
| PLFP | Fee payment |
Year of fee payment: 14 |
|
| PLFP | Fee payment |
Year of fee payment: 15 |
|
| PLFP | Fee payment |
Year of fee payment: 16 |
|
| PLFP | Fee payment |
Year of fee payment: 17 |