FR2957459B1 - Procede de fabrication d'un circuit integre contenant un condensateur metal - isolant - metal et circuit integre correspondant - Google Patents

Procede de fabrication d'un circuit integre contenant un condensateur metal - isolant - metal et circuit integre correspondant

Info

Publication number
FR2957459B1
FR2957459B1 FR1051687A FR1051687A FR2957459B1 FR 2957459 B1 FR2957459 B1 FR 2957459B1 FR 1051687 A FR1051687 A FR 1051687A FR 1051687 A FR1051687 A FR 1051687A FR 2957459 B1 FR2957459 B1 FR 2957459B1
Authority
FR
France
Prior art keywords
integrated circuit
metal
insulating
manufacturing
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1051687A
Other languages
English (en)
Other versions
FR2957459A1 (fr
Inventor
Simon Jeannot
Michel Marty
Jean-Christophe Giraudin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR1051687A priority Critical patent/FR2957459B1/fr
Priority to US13/034,373 priority patent/US20110221035A1/en
Publication of FR2957459A1 publication Critical patent/FR2957459A1/fr
Application granted granted Critical
Publication of FR2957459B1 publication Critical patent/FR2957459B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/495—Capacitive arrangements or effects of, or between wiring layers
    • H10W20/496—Capacitor integral with wiring layers
FR1051687A 2010-03-09 2010-03-09 Procede de fabrication d'un circuit integre contenant un condensateur metal - isolant - metal et circuit integre correspondant Expired - Fee Related FR2957459B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1051687A FR2957459B1 (fr) 2010-03-09 2010-03-09 Procede de fabrication d'un circuit integre contenant un condensateur metal - isolant - metal et circuit integre correspondant
US13/034,373 US20110221035A1 (en) 2010-03-09 2011-02-24 Process for fabricating an integrated circuit including a metal-insulator-metal capacitor and corresponding integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1051687A FR2957459B1 (fr) 2010-03-09 2010-03-09 Procede de fabrication d'un circuit integre contenant un condensateur metal - isolant - metal et circuit integre correspondant

Publications (2)

Publication Number Publication Date
FR2957459A1 FR2957459A1 (fr) 2011-09-16
FR2957459B1 true FR2957459B1 (fr) 2013-09-27

Family

ID=42813326

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1051687A Expired - Fee Related FR2957459B1 (fr) 2010-03-09 2010-03-09 Procede de fabrication d'un circuit integre contenant un condensateur metal - isolant - metal et circuit integre correspondant

Country Status (2)

Country Link
US (1) US20110221035A1 (fr)
FR (1) FR2957459B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9559158B2 (en) * 2015-01-12 2017-01-31 The Hong Kong University Of Science And Technology Method and apparatus for an integrated capacitor

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US662404A (en) * 1899-12-04 1900-11-27 Buckeye Fish Company Process of extracting oil.
TW479311B (en) * 2000-05-26 2002-03-11 Ibm Semiconductor high dielectric constant decoupling capacitor structures and process for fabrication
US6833604B2 (en) * 2000-10-03 2004-12-21 Broadcom Corporation High density metal capacitor using dual-damascene copper interconnect
US6653681B2 (en) * 2000-12-30 2003-11-25 Texas Instruments Incorporated Additional capacitance for MIM capacitors with no additional processing
US6624040B1 (en) * 2002-09-20 2003-09-23 Chartered Semiconductor Manufacturing Ltd. Self-integrated vertical MIM capacitor in the dual damascene process
US7553736B2 (en) * 2006-07-13 2009-06-30 Taiwan Semiconductor Manufacturing Company, Ltd. Increasing dielectric constant in local regions for the formation of capacitors
CN101246910B (zh) * 2007-02-13 2012-06-06 中芯国际集成电路制造(上海)有限公司 金属-绝缘-金属型电容器及其制作方法

Also Published As

Publication number Publication date
FR2957459A1 (fr) 2011-09-16
US20110221035A1 (en) 2011-09-15

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20151130