FR2964111B1 - Procede de collage direct entre deux plaques, comprenant une etape de formation d'une couche de protection temporaire a base d'azote - Google Patents
Procede de collage direct entre deux plaques, comprenant une etape de formation d'une couche de protection temporaire a base d'azoteInfo
- Publication number
- FR2964111B1 FR2964111B1 FR1003495A FR1003495A FR2964111B1 FR 2964111 B1 FR2964111 B1 FR 2964111B1 FR 1003495 A FR1003495 A FR 1003495A FR 1003495 A FR1003495 A FR 1003495A FR 2964111 B1 FR2964111 B1 FR 2964111B1
- Authority
- FR
- France
- Prior art keywords
- plates
- formation
- protective layer
- nitrogen protective
- collage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W95/00—Packaging processes not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
- H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
- H10P14/6518—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by introduction of substances into an already-existing insulating layer
- H10P14/6524—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by introduction of substances into an already-existing insulating layer the substance being nitrogen
- H10P14/6526—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by introduction of substances into an already-existing insulating layer the substance being nitrogen introduced into an oxide material, e.g. changing SiO to SiON
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
- H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
- H10P14/6529—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to a gas or vapour
- H10P14/6532—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to a gas or vapour by exposure to a plasma
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/19—Preparing inhomogeneous wafers
- H10P90/1904—Preparing vertically inhomogeneous wafers
- H10P90/1906—Preparing SOI wafers
- H10P90/1914—Preparing SOI wafers using bonding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/10—Isolation regions comprising dielectric materials
- H10W10/181—Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1003495A FR2964111B1 (fr) | 2010-08-31 | 2010-08-31 | Procede de collage direct entre deux plaques, comprenant une etape de formation d'une couche de protection temporaire a base d'azote |
| US13/818,843 US9064863B2 (en) | 2010-08-31 | 2011-08-31 | Method for directly adhering two plates together, including a step of forming a temporary protective nitrogen |
| EP11758494.6A EP2612353A1 (fr) | 2010-08-31 | 2011-08-31 | Procédé de collage direct entre deux plaques, comprenant une étape de formation d'une couche de protection temporaire à base d'azote |
| PCT/FR2011/000483 WO2012028792A1 (fr) | 2010-08-31 | 2011-08-31 | Procédé de collage direct entre deux plaques, comprenant une étape de formation d'une couche de protection temporaire à base d'azote |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1003495A FR2964111B1 (fr) | 2010-08-31 | 2010-08-31 | Procede de collage direct entre deux plaques, comprenant une etape de formation d'une couche de protection temporaire a base d'azote |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2964111A1 FR2964111A1 (fr) | 2012-03-02 |
| FR2964111B1 true FR2964111B1 (fr) | 2013-01-25 |
Family
ID=43859729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1003495A Expired - Fee Related FR2964111B1 (fr) | 2010-08-31 | 2010-08-31 | Procede de collage direct entre deux plaques, comprenant une etape de formation d'une couche de protection temporaire a base d'azote |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9064863B2 (fr) |
| EP (1) | EP2612353A1 (fr) |
| FR (1) | FR2964111B1 (fr) |
| WO (1) | WO2012028792A1 (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106159114A (zh) * | 2015-04-23 | 2016-11-23 | 上海和辉光电有限公司 | 柔性显示器的封装方法 |
| US10892156B2 (en) * | 2017-05-08 | 2021-01-12 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film on a substrate and related semiconductor device structures |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2896618B1 (fr) * | 2006-01-23 | 2008-05-23 | Soitec Silicon On Insulator | Procede de fabrication d'un substrat composite |
| CN101529578B (zh) * | 2006-10-27 | 2012-01-11 | 硅绝缘体技术有限公司 | 用于转移在具有空位团的基片中形成的薄层的改进方法 |
| JP2009135430A (ja) * | 2007-10-10 | 2009-06-18 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| US7842583B2 (en) * | 2007-12-27 | 2010-11-30 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor substrate and method for manufacturing semiconductor device |
| US8003483B2 (en) * | 2008-03-18 | 2011-08-23 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing SOI substrate |
| US8871610B2 (en) * | 2008-10-02 | 2014-10-28 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing SOI substrate |
-
2010
- 2010-08-31 FR FR1003495A patent/FR2964111B1/fr not_active Expired - Fee Related
-
2011
- 2011-08-31 EP EP11758494.6A patent/EP2612353A1/fr not_active Withdrawn
- 2011-08-31 US US13/818,843 patent/US9064863B2/en not_active Expired - Fee Related
- 2011-08-31 WO PCT/FR2011/000483 patent/WO2012028792A1/fr not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US9064863B2 (en) | 2015-06-23 |
| US20130217207A1 (en) | 2013-08-22 |
| EP2612353A1 (fr) | 2013-07-10 |
| FR2964111A1 (fr) | 2012-03-02 |
| WO2012028792A1 (fr) | 2012-03-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |
Effective date: 20160429 |