FR2977984B1 - Generateur thermoelectrique integre, et circuit integre comprenant un tel generateur - Google Patents

Generateur thermoelectrique integre, et circuit integre comprenant un tel generateur

Info

Publication number
FR2977984B1
FR2977984B1 FR1156417A FR1156417A FR2977984B1 FR 2977984 B1 FR2977984 B1 FR 2977984B1 FR 1156417 A FR1156417 A FR 1156417A FR 1156417 A FR1156417 A FR 1156417A FR 2977984 B1 FR2977984 B1 FR 2977984B1
Authority
FR
France
Prior art keywords
generator
integrated
conductivity
integrated circuit
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1156417A
Other languages
English (en)
Other versions
FR2977984A1 (fr
Inventor
Pascal Fornara
Christian Rivero
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Rousset SAS
Original Assignee
STMicroelectronics Rousset SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Rousset SAS filed Critical STMicroelectronics Rousset SAS
Priority to FR1156417A priority Critical patent/FR2977984B1/fr
Priority to US13/549,248 priority patent/US9177994B2/en
Publication of FR2977984A1 publication Critical patent/FR2977984A1/fr
Application granted granted Critical
Publication of FR2977984B1 publication Critical patent/FR2977984B1/fr
Priority to US14/930,204 priority patent/US9490415B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/42Vias, e.g. via plugs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/43Layouts of interconnections

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR1156417A 2011-07-13 2011-07-13 Generateur thermoelectrique integre, et circuit integre comprenant un tel generateur Expired - Fee Related FR2977984B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR1156417A FR2977984B1 (fr) 2011-07-13 2011-07-13 Generateur thermoelectrique integre, et circuit integre comprenant un tel generateur
US13/549,248 US9177994B2 (en) 2011-07-13 2012-07-13 Integrated thermoelectric generator
US14/930,204 US9490415B2 (en) 2011-07-13 2015-11-02 Integrated thermoelectric generator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1156417A FR2977984B1 (fr) 2011-07-13 2011-07-13 Generateur thermoelectrique integre, et circuit integre comprenant un tel generateur

Publications (2)

Publication Number Publication Date
FR2977984A1 FR2977984A1 (fr) 2013-01-18
FR2977984B1 true FR2977984B1 (fr) 2013-07-05

Family

ID=45350858

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1156417A Expired - Fee Related FR2977984B1 (fr) 2011-07-13 2011-07-13 Generateur thermoelectrique integre, et circuit integre comprenant un tel generateur

Country Status (2)

Country Link
US (2) US9177994B2 (fr)
FR (1) FR2977984B1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2972571A1 (fr) * 2011-03-09 2012-09-14 St Microelectronics Crolles 2 Générateur thermoélectrique
WO2014057543A1 (fr) * 2012-10-10 2014-04-17 富士通株式会社 Appareil de conversion thermoélectrique et appareil électronique
DE112013006978B4 (de) * 2013-06-18 2021-12-16 Intel Corporation Integrierte thermoelektrische Kühlung
US11424399B2 (en) * 2015-07-07 2022-08-23 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated thermoelectric devices in Fin FET technology
CN108615697B (zh) * 2016-12-09 2020-11-03 矽电半导体设备(深圳)股份有限公司 自动上下芯片装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01245549A (ja) * 1988-03-26 1989-09-29 Matsushita Electric Works Ltd 半導体装置およびその製法
US6597051B2 (en) * 2001-05-22 2003-07-22 Yeda Research And Development Co. Ltd. Thermoelectric infrared detector
US7205675B2 (en) * 2003-01-29 2007-04-17 Hewlett-Packard Development Company, L.P. Micro-fabricated device with thermoelectric device and method of making
US20040155251A1 (en) * 2003-02-07 2004-08-12 Vladimir Abramov Peltier cooler integrated with electronic device(s)
US20050139250A1 (en) * 2003-12-02 2005-06-30 Battelle Memorial Institute Thermoelectric devices and applications for the same
WO2007122560A2 (fr) * 2006-04-20 2007-11-01 Nxp B.V. Procédé et dispositif permettant de déterminer la température d'un substrat semi-conducteur
TWI338390B (en) * 2007-07-12 2011-03-01 Ind Tech Res Inst Flexible thermoelectric device and manufacturing method thereof
US12154841B2 (en) * 2007-08-29 2024-11-26 Texas Instruments Incorporated Nanoscale thermoelectric refrigerator
JP2010109132A (ja) * 2008-10-30 2010-05-13 Yamaha Corp 熱電モジュールを備えたパッケージおよびその製造方法
DE102009000333A1 (de) * 2009-01-20 2010-07-22 Ihp Gmbh - Innovations For High Performance Microelectronics / Leibniz-Institut Für Innovative Mikroelektronik Thermoelektrisches Halbleiterbauelement
JP5515721B2 (ja) * 2009-12-21 2014-06-11 富士通株式会社 熱電変換モジュールの製造方法
US10224474B2 (en) * 2013-01-08 2019-03-05 Analog Devices, Inc. Wafer scale thermoelectric energy harvester having interleaved, opposing thermoelectric legs and manufacturing techniques therefor
US9231025B2 (en) * 2014-05-30 2016-01-05 Texas Instruments Incorporated CMOS-based thermoelectric device with reduced electrical resistance

Also Published As

Publication number Publication date
FR2977984A1 (fr) 2013-01-18
US20160056364A1 (en) 2016-02-25
US20130015549A1 (en) 2013-01-17
US9177994B2 (en) 2015-11-03
US9490415B2 (en) 2016-11-08

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Effective date: 20150331