FR2984603B1 - Circuit integre comprenant un transformateur integre de type "balun" a plusieurs voies d'entree et de sortie. - Google Patents
Circuit integre comprenant un transformateur integre de type "balun" a plusieurs voies d'entree et de sortie.Info
- Publication number
- FR2984603B1 FR2984603B1 FR1162017A FR1162017A FR2984603B1 FR 2984603 B1 FR2984603 B1 FR 2984603B1 FR 1162017 A FR1162017 A FR 1162017A FR 1162017 A FR1162017 A FR 1162017A FR 2984603 B1 FR2984603 B1 FR 2984603B1
- Authority
- FR
- France
- Prior art keywords
- integrated
- balun
- type
- integrated circuit
- output paths
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/003—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F21/00—Variable inductances or transformers of the signal type
- H01F21/12—Variable inductances or transformers of the signal type discontinuously variable, e.g. tapped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F30/00—Fixed transformers not covered by group H01F19/00
- H01F30/04—Fixed transformers not covered by group H01F19/00 having two or more secondary windings, each supplying a separate load, e.g. for radio set power supplies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/42—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/20—Inductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
- H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/497—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
- H03H7/1775—Parallel LC in shunt or branch path
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
- H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
- H10W44/234—Arrangements for impedance matching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
- H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
- H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
- H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Transceivers (AREA)
- Semiconductor Integrated Circuits (AREA)
- Amplifiers (AREA)
- Coils Or Transformers For Communication (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1162017A FR2984603B1 (fr) | 2011-12-20 | 2011-12-20 | Circuit integre comprenant un transformateur integre de type "balun" a plusieurs voies d'entree et de sortie. |
| US13/707,736 US9008603B2 (en) | 2011-12-20 | 2012-12-07 | Integrated circuit comprising an integrated transformer of the “BALUN” type with several input and output channels |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1162017A FR2984603B1 (fr) | 2011-12-20 | 2011-12-20 | Circuit integre comprenant un transformateur integre de type "balun" a plusieurs voies d'entree et de sortie. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2984603A1 FR2984603A1 (fr) | 2013-06-21 |
| FR2984603B1 true FR2984603B1 (fr) | 2014-01-17 |
Family
ID=46044794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1162017A Expired - Fee Related FR2984603B1 (fr) | 2011-12-20 | 2011-12-20 | Circuit integre comprenant un transformateur integre de type "balun" a plusieurs voies d'entree et de sortie. |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9008603B2 (fr) |
| FR (1) | FR2984603B1 (fr) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928438B (zh) * | 2014-04-04 | 2016-11-16 | 豪威科技(上海)有限公司 | 片上变压器、其版图结构、发射电路及收发电路 |
| CN103957024B (zh) * | 2014-04-18 | 2017-04-12 | 锐迪科科技有限公司 | 射频收发开关及其工作方法 |
| TWI553676B (zh) * | 2015-07-07 | 2016-10-11 | 瑞昱半導體股份有限公司 | 平面式變壓器及平衡不平衡轉換器之結構 |
| CN105933011B (zh) * | 2016-03-28 | 2019-03-26 | 豪威科技(上海)有限公司 | 功率合成器 |
| DE102016110425B4 (de) * | 2016-06-06 | 2023-07-20 | X-Fab Semiconductor Foundries Gmbh | Halbleitertransformator |
| US9843301B1 (en) | 2016-07-14 | 2017-12-12 | Northrop Grumman Systems Corporation | Silicon transformer balun |
| TWI645428B (zh) * | 2016-11-25 | 2018-12-21 | 瑞昱半導體股份有限公司 | 積體電感 |
| WO2018198601A1 (fr) * | 2017-04-26 | 2018-11-01 | 株式会社村田製作所 | Filtre d'équilibrage |
| EP3471140B1 (fr) | 2017-10-11 | 2022-05-18 | Nxp B.V. | Circuit intégré comprenant une pluralité de composants comprenant un transformateur |
| NL2021654B1 (en) | 2018-09-18 | 2020-05-07 | Prodrive Tech Bv | Balun transformer |
| US11069476B2 (en) * | 2018-10-08 | 2021-07-20 | Vayyar Imaging Ltd. | Self-contained device with planar overlapping coils |
| US12117556B2 (en) * | 2021-06-28 | 2024-10-15 | Texas Instruments Incorporated | Field-aware metal fills for integrated circuit passive components |
| EP4350877A1 (fr) * | 2022-10-05 | 2024-04-10 | Nxp B.V. | Déphaseur à zéro ou 180 degrés basé sur un auto-transformateur intégré |
| CN115881715B (zh) * | 2023-02-09 | 2023-05-30 | 四川斯艾普电子科技有限公司 | 一种基于厚薄膜电路基板的lange电桥及其制备方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8049589B2 (en) * | 2008-09-10 | 2011-11-01 | Advanced Semiconductor Engineering, Inc. | Balun circuit manufactured by integrate passive device process |
| EP2204877A1 (fr) * | 2008-12-30 | 2010-07-07 | STMicroelectronics (Tours) SAS | Réglage d'un transformateur à changement de mode (balun) |
| US8791775B2 (en) * | 2010-03-30 | 2014-07-29 | Stats Chippac, Ltd. | Semiconductor device and method of forming high-attenuation balanced band-pass filter |
-
2011
- 2011-12-20 FR FR1162017A patent/FR2984603B1/fr not_active Expired - Fee Related
-
2012
- 2012-12-07 US US13/707,736 patent/US9008603B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| FR2984603A1 (fr) | 2013-06-21 |
| US9008603B2 (en) | 2015-04-14 |
| US20130157587A1 (en) | 2013-06-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |
Effective date: 20150831 |