FR3054151B1 - Procede et appareil pour la decoupe de materiaux par multi-faisceaux laser femtoseconde - Google Patents

Procede et appareil pour la decoupe de materiaux par multi-faisceaux laser femtoseconde Download PDF

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Publication number
FR3054151B1
FR3054151B1 FR1657138A FR1657138A FR3054151B1 FR 3054151 B1 FR3054151 B1 FR 3054151B1 FR 1657138 A FR1657138 A FR 1657138A FR 1657138 A FR1657138 A FR 1657138A FR 3054151 B1 FR3054151 B1 FR 3054151B1
Authority
FR
France
Prior art keywords
cutting
femtosecond laser
laser multi
beam materials
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1657138A
Other languages
English (en)
Other versions
FR3054151A1 (fr
Inventor
Konstantin MISHCHIK
John Lopez
Rainer Kling
Clementine Javaux-Leger
Guillaume DUCHATEAU
Ophelie Dematteo-Caulier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre National de la Recherche Scientifique CNRS
Universite de Bordeaux
Alphanov Centre Technologique Optique et Lasers
Amplitude SAS
Original Assignee
Centre National de la Recherche Scientifique CNRS
Amplitude Systemes SA
Universite de Bordeaux
Alphanov Centre Technologique Optique et Lasers
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR1657138A priority Critical patent/FR3054151B1/fr
Application filed by Centre National de la Recherche Scientifique CNRS, Amplitude Systemes SA, Universite de Bordeaux, Alphanov Centre Technologique Optique et Lasers filed Critical Centre National de la Recherche Scientifique CNRS
Priority to US16/320,585 priority patent/US11883903B2/en
Priority to JP2019504823A priority patent/JP7190631B2/ja
Priority to KR1020197002669A priority patent/KR102363273B1/ko
Priority to PCT/FR2017/052072 priority patent/WO2018020145A1/fr
Priority to PCT/FR2017/052071 priority patent/WO2018020144A1/fr
Priority to CN201780058357.7A priority patent/CN109789511B/zh
Priority to EP17748557.0A priority patent/EP3487656B1/fr
Publication of FR3054151A1 publication Critical patent/FR3054151A1/fr
Application granted granted Critical
Publication of FR3054151B1 publication Critical patent/FR3054151B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/06—Cutting or splitting glass tubes, rods, or hollow products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
FR1657138A 2016-07-25 2016-07-25 Procede et appareil pour la decoupe de materiaux par multi-faisceaux laser femtoseconde Active FR3054151B1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FR1657138A FR3054151B1 (fr) 2016-07-25 2016-07-25 Procede et appareil pour la decoupe de materiaux par multi-faisceaux laser femtoseconde
JP2019504823A JP7190631B2 (ja) 2016-07-25 2017-07-25 マルチビームフェムト秒レーザによって材料を切断する方法及び器具
KR1020197002669A KR102363273B1 (ko) 2016-07-25 2017-07-25 다중 빔 펨토초 레이저에 의해 재료를 절단하는 방법 및 장치
PCT/FR2017/052072 WO2018020145A1 (fr) 2016-07-25 2017-07-25 Procédé et appareil pour la découpe de matériaux par multi-faisceaux laser femtoseconde
US16/320,585 US11883903B2 (en) 2016-07-25 2017-07-25 Method and appliance for cutting materials by multi-beam femtosecond laser
PCT/FR2017/052071 WO2018020144A1 (fr) 2016-07-25 2017-07-25 Appareil et procédé de découpe de matériau par faisceau laser allongé non diffractif
CN201780058357.7A CN109789511B (zh) 2016-07-25 2017-07-25 通过多光束飞秒激光来切割材料的方法和装置
EP17748557.0A EP3487656B1 (fr) 2016-07-25 2017-07-25 Procédé et appareil pour la découpe de matériaux par multi-faisceaux laser femtoseconde

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1657138A FR3054151B1 (fr) 2016-07-25 2016-07-25 Procede et appareil pour la decoupe de materiaux par multi-faisceaux laser femtoseconde
FR1657138 2016-07-25

Publications (2)

Publication Number Publication Date
FR3054151A1 FR3054151A1 (fr) 2018-01-26
FR3054151B1 true FR3054151B1 (fr) 2018-07-13

Family

ID=56990632

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1657138A Active FR3054151B1 (fr) 2016-07-25 2016-07-25 Procede et appareil pour la decoupe de materiaux par multi-faisceaux laser femtoseconde

Country Status (1)

Country Link
FR (1) FR3054151B1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111618454A (zh) * 2020-06-26 2020-09-04 苏州图森激光有限公司 一种透明材料的超快激光切割方法及装置
DE102020134751A1 (de) * 2020-12-22 2022-06-23 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Trennen eines Werkstücks
CN115447137B (zh) * 2022-09-29 2024-06-14 哈尔滨工程大学 一种光固化3d打印装置以及打印方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5446631B2 (ja) * 2009-09-10 2014-03-19 アイシン精機株式会社 レーザ加工方法及びレーザ加工装置
FR2989294B1 (fr) * 2012-04-13 2022-10-14 Centre Nat Rech Scient Dispositif et methode de nano-usinage par laser
WO2014079478A1 (fr) * 2012-11-20 2014-05-30 Light In Light Srl Traitement par laser à grande vitesse de matériaux transparents
LT2965853T (lt) * 2014-07-09 2016-11-25 High Q Laser Gmbh Medžiagos apdorojimas, naudojant pailgintuosius lazerio spindulius

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Publication number Publication date
FR3054151A1 (fr) 2018-01-26

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