FR3100657B1 - Pixel comprenant une photodiode - Google Patents
Pixel comprenant une photodiode Download PDFInfo
- Publication number
- FR3100657B1 FR3100657B1 FR1909888A FR1909888A FR3100657B1 FR 3100657 B1 FR3100657 B1 FR 3100657B1 FR 1909888 A FR1909888 A FR 1909888A FR 1909888 A FR1909888 A FR 1909888A FR 3100657 B1 FR3100657 B1 FR 3100657B1
- Authority
- FR
- France
- Prior art keywords
- photodiode
- pixel
- transistors
- channel transistor
- series
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
- H10F39/80373—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor characterised by the gate of the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/014—Manufacture or treatment of image sensors covered by group H10F39/12 of CMOS image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/807—Pixel isolation structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Thin Film Transistor (AREA)
Abstract
Pixel comprenant une photodiode La présente description concerne un pixel (170) comprenant une photodiode (102) et des premier (110) et deuxième (176) transistors, les premier et deuxième transistors étant reliés en série, l'un des premier et deuxième transistors étant un transistor à canal P et l'autre étant un transistor à canal N. Figure pour l'abrégé : Fig. 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1909888A FR3100657B1 (fr) | 2019-09-09 | 2019-09-09 | Pixel comprenant une photodiode |
| US17/011,900 US11552116B2 (en) | 2019-09-09 | 2020-09-03 | Image sensors with multi-channel type transistors |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1909888 | 2019-09-09 | ||
| FR1909888A FR3100657B1 (fr) | 2019-09-09 | 2019-09-09 | Pixel comprenant une photodiode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR3100657A1 FR3100657A1 (fr) | 2021-03-12 |
| FR3100657B1 true FR3100657B1 (fr) | 2023-02-10 |
Family
ID=69903218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1909888A Active FR3100657B1 (fr) | 2019-09-09 | 2019-09-09 | Pixel comprenant une photodiode |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US11552116B2 (fr) |
| FR (1) | FR3100657B1 (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3085231B1 (fr) * | 2018-08-24 | 2020-09-25 | St Microelectronics Crolles 2 Sas | Capteur d'images a grande dynamique et faible bruit |
| US12349493B2 (en) * | 2021-07-16 | 2025-07-01 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and manufacturing method of the same |
| FR3137999B1 (fr) * | 2022-07-15 | 2024-06-07 | Commissariat Energie Atomique | Pixels d'un capteur de lumière |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100782463B1 (ko) * | 2005-04-13 | 2007-12-05 | (주)실리콘화일 | 3차원 구조를 갖는 이미지 센서의 분리형 단위화소 및 그제조방법 |
| US20110267505A1 (en) * | 2010-04-29 | 2011-11-03 | Bart Dierickx | Pixel with reduced 1/f noise |
| US9083899B2 (en) * | 2013-02-21 | 2015-07-14 | Omnivision Technologies, Inc. | Circuit structure for providing conversion gain of a pixel array |
| US9356066B2 (en) * | 2013-03-15 | 2016-05-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Interconnect structure for stacked device and method |
| CN204966510U (zh) | 2014-06-20 | 2016-01-13 | 意法半导体股份有限公司 | 宽带隙高密度半导体开关器件 |
| US9602750B2 (en) * | 2014-11-25 | 2017-03-21 | Semiconductor Components Industries, Llc | Image sensor pixels having built-in variable gain feedback amplifier circuitry |
| CN108781084B (zh) * | 2016-03-28 | 2023-04-28 | 索尼公司 | 信号处理装置和方法、摄像元件和电子装置 |
| US10225499B2 (en) * | 2016-04-11 | 2019-03-05 | Semiconductor Components Industries, Llc | Backside illuminated global shutter pixel with active reset |
| KR102574973B1 (ko) * | 2018-09-17 | 2023-09-06 | 에스케이하이닉스 주식회사 | P-형 분리 구조를 갖는 이미지 센서 |
-
2019
- 2019-09-09 FR FR1909888A patent/FR3100657B1/fr active Active
-
2020
- 2020-09-03 US US17/011,900 patent/US11552116B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20210074749A1 (en) | 2021-03-11 |
| US11552116B2 (en) | 2023-01-10 |
| FR3100657A1 (fr) | 2021-03-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PLFP | Fee payment |
Year of fee payment: 2 |
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| PLSC | Publication of the preliminary search report |
Effective date: 20210312 |
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| PLFP | Fee payment |
Year of fee payment: 3 |
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| PLFP | Fee payment |
Year of fee payment: 4 |
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| PLFP | Fee payment |
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| PLFP | Fee payment |
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| PLFP | Fee payment |
Year of fee payment: 7 |