FR3129809B1 - Dissipation de chaleur - Google Patents

Dissipation de chaleur Download PDF

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Publication number
FR3129809B1
FR3129809B1 FR2112736A FR2112736A FR3129809B1 FR 3129809 B1 FR3129809 B1 FR 3129809B1 FR 2112736 A FR2112736 A FR 2112736A FR 2112736 A FR2112736 A FR 2112736A FR 3129809 B1 FR3129809 B1 FR 3129809B1
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FR
France
Prior art keywords
face
thermally conductive
layer
substrate
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2112736A
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English (en)
Other versions
FR3129809A1 (fr
Inventor
Richard Rembert
Fanny Laporte
Catherine Cadieux
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Grenoble 2 SAS
Original Assignee
STMicroelectronics Grenoble 2 SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Grenoble 2 SAS filed Critical STMicroelectronics Grenoble 2 SAS
Priority to FR2112736A priority Critical patent/FR3129809B1/fr
Priority to US17/989,173 priority patent/US12439562B2/en
Priority to CN202223177073.7U priority patent/CN219553616U/zh
Priority to CN202211511541.1A priority patent/CN116207054A/zh
Publication of FR3129809A1 publication Critical patent/FR3129809A1/fr
Application granted granted Critical
Publication of FR3129809B1 publication Critical patent/FR3129809B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Dissipation de chaleur La présente description concerne un dispositif de dissipation de chaleur (104) comprenant : - un substrat (114) comprenant un réseau de vias (130) conducteurs thermiquement et de couches conductrices thermiquement (132) s'étendant entre une première face (116) du substrat et une deuxième face (118) du substrat (114) opposée à la première face (116) ; et - une couche d'interface dissipatrice de chaleur (124) comprenant un empilement d'une première couche en un premier matériau conducteur thermiquement et une deuxième couche en un deuxième matériau conducteur thermiquement, le premier matériau étant différent du deuxième matériau, une troisième face de la première couche reposant sur la première face dudit substrat, au moins un desdits vias (130) conducteurs thermiquement dudit réseau étant en contact avec ladite première couche, dans lequel l'empilement comprend au moins une ouverture le traversant de part en part. Figure pour l'abrégé : Fig. 1
FR2112736A 2021-11-30 2021-11-30 Dissipation de chaleur Active FR3129809B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR2112736A FR3129809B1 (fr) 2021-11-30 2021-11-30 Dissipation de chaleur
US17/989,173 US12439562B2 (en) 2021-11-30 2022-11-17 Thermal dissipation
CN202223177073.7U CN219553616U (zh) 2021-11-30 2022-11-29 散热装置和电子装置
CN202211511541.1A CN116207054A (zh) 2021-11-30 2022-11-29 散热装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2112736 2021-11-30
FR2112736A FR3129809B1 (fr) 2021-11-30 2021-11-30 Dissipation de chaleur

Publications (2)

Publication Number Publication Date
FR3129809A1 FR3129809A1 (fr) 2023-06-02
FR3129809B1 true FR3129809B1 (fr) 2024-05-10

Family

ID=81325186

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2112736A Active FR3129809B1 (fr) 2021-11-30 2021-11-30 Dissipation de chaleur

Country Status (3)

Country Link
US (1) US12439562B2 (fr)
CN (2) CN116207054A (fr)
FR (1) FR3129809B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3129809B1 (fr) * 2021-11-30 2024-05-10 St Microelectronics Grenoble 2 Dissipation de chaleur

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030029637A1 (en) * 2001-08-13 2003-02-13 Tina Barcley Circuit board assembly with ceramic capped components and heat transfer vias
US7253518B2 (en) * 2005-06-15 2007-08-07 Endicott Interconnect Technologies, Inc. Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same
US9161461B2 (en) * 2012-06-14 2015-10-13 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Multilayer electronic structure with stepped holes
US9295163B2 (en) * 2013-05-30 2016-03-22 Dyi-chung Hu Method of making a circuit board structure with embedded fine-pitch wires
US9674940B2 (en) * 2014-08-14 2017-06-06 Samsung Electronics Co., Ltd. Electronic device and semiconductor package with thermally conductive via
US20170018501A1 (en) * 2015-07-14 2017-01-19 Avago Technologies General Ip (Singapore) Pte. Ltd Via structures for thermal dissipation
US11227846B2 (en) * 2019-01-30 2022-01-18 Mediatek Inc. Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
FR3129809B1 (fr) * 2021-11-30 2024-05-10 St Microelectronics Grenoble 2 Dissipation de chaleur

Also Published As

Publication number Publication date
US20230171927A1 (en) 2023-06-01
US12439562B2 (en) 2025-10-07
CN116207054A (zh) 2023-06-02
CN219553616U (zh) 2023-08-18
FR3129809A1 (fr) 2023-06-02

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