FR3137528B1 - Dispositif électronique moulé et procédé pour réaliser un dispositif électronique moulé - Google Patents

Dispositif électronique moulé et procédé pour réaliser un dispositif électronique moulé Download PDF

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Publication number
FR3137528B1
FR3137528B1 FR2206557A FR2206557A FR3137528B1 FR 3137528 B1 FR3137528 B1 FR 3137528B1 FR 2206557 A FR2206557 A FR 2206557A FR 2206557 A FR2206557 A FR 2206557A FR 3137528 B1 FR3137528 B1 FR 3137528B1
Authority
FR
France
Prior art keywords
electronic device
face
film
molded electronic
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2206557A
Other languages
English (en)
Other versions
FR3137528A1 (fr
Inventor
Godefroy Beau
Lionel Hafer
Christophe Cuvillier
Armand Brousselle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Faurecia Interieur Industrie SAS
Original Assignee
Faurecia Interieur Industrie SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Faurecia Interieur Industrie SAS filed Critical Faurecia Interieur Industrie SAS
Priority to FR2206557A priority Critical patent/FR3137528B1/fr
Priority to CN202310702239.2A priority patent/CN117320341A/zh
Publication of FR3137528A1 publication Critical patent/FR3137528A1/fr
Application granted granted Critical
Publication of FR3137528B1 publication Critical patent/FR3137528B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H05K5/0243—Mechanical details of casings for decorative purposes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Laminated Bodies (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Dispositif électronique moulé (1) comprenant : - un film imprimé (10), le film imprimé (10) comprenant un film (12) et au moins une couche imprimée (14, 16), le film (12) présentant une face externe (12a) et une face interne (12b), - un élément électronique (2) électriquement relié à la couche électriquement conductrice (16), - une couche support (32, 42) s’étendant sur la face interne (12b) et rigidifiant le film imprimé (10), et - une couche protectrice externe (22), la couche protectrice externe (22) est transparente, en polyuréthane réticulé et présente une face d’aspect (22a) et une face de contact (22b), la face d’aspect (22) présente un aspect brillant et la face externe (12b) du film (12) présente une rugosité arithmétique supérieure à 200 nm. Figure pour l’abrégé : Figure 4
FR2206557A 2022-06-29 2022-06-29 Dispositif électronique moulé et procédé pour réaliser un dispositif électronique moulé Active FR3137528B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR2206557A FR3137528B1 (fr) 2022-06-29 2022-06-29 Dispositif électronique moulé et procédé pour réaliser un dispositif électronique moulé
CN202310702239.2A CN117320341A (zh) 2022-06-29 2023-06-14 模塑电子装置和制作模塑电子装置的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2206557 2022-06-29
FR2206557A FR3137528B1 (fr) 2022-06-29 2022-06-29 Dispositif électronique moulé et procédé pour réaliser un dispositif électronique moulé

Publications (2)

Publication Number Publication Date
FR3137528A1 FR3137528A1 (fr) 2024-01-05
FR3137528B1 true FR3137528B1 (fr) 2025-06-06

Family

ID=83188686

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2206557A Active FR3137528B1 (fr) 2022-06-29 2022-06-29 Dispositif électronique moulé et procédé pour réaliser un dispositif électronique moulé

Country Status (2)

Country Link
CN (1) CN117320341A (fr)
FR (1) FR3137528B1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012041389A (ja) * 2010-08-13 2012-03-01 Nissha Printing Co Ltd マット層形成用インキ、マット剥離シート及びマット転写シート
CN108966519B (zh) * 2017-05-23 2020-08-21 昆山雅森电子材料科技有限公司 高雾度的有色超薄高频覆盖膜及制备方法
FR3109915B1 (fr) * 2020-05-05 2023-02-24 Faurecia Interieur Ind Elément de garnissage comprenant une zone rétroéclairée
FR3109918B1 (fr) * 2020-05-05 2023-02-24 Faurecia Interieur Ind Elément de garnissage comprenant deux zones rétroéclairées indépendantes

Also Published As

Publication number Publication date
CN117320341A (zh) 2023-12-29
FR3137528A1 (fr) 2024-01-05

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