FR3139664B1 - Dissipateur thermique de boitier de circuit integre - Google Patents

Dissipateur thermique de boitier de circuit integre

Info

Publication number
FR3139664B1
FR3139664B1 FR2209121A FR2209121A FR3139664B1 FR 3139664 B1 FR3139664 B1 FR 3139664B1 FR 2209121 A FR2209121 A FR 2209121A FR 2209121 A FR2209121 A FR 2209121A FR 3139664 B1 FR3139664 B1 FR 3139664B1
Authority
FR
France
Prior art keywords
heat sink
integrated circuit
circuit enclosure
enclosure heat
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2209121A
Other languages
English (en)
Other versions
FR3139664A1 (fr
Inventor
Romain Coffy
Jérôme Lopez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Grenoble 2 SAS
Original Assignee
STMicroelectronics Grenoble 2 SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Grenoble 2 SAS filed Critical STMicroelectronics Grenoble 2 SAS
Priority to FR2209121A priority Critical patent/FR3139664B1/fr
Priority to US18/244,534 priority patent/US20240087977A1/en
Publication of FR3139664A1 publication Critical patent/FR3139664A1/fr
Application granted granted Critical
Publication of FR3139664B1 publication Critical patent/FR3139664B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07253—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/232—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)

Abstract

Circuit intégré (1) comprenant : - au moins une puce électronique (2) possédant une face (22) recouverte d’une couche d’un matériau d’interface thermique (6), - un dissipateur thermique (7) comprenant une zone de montage (71) fixée à la puce (2) par l’intermédiaire de la couche de matériau d’interface thermique (6), le dissipateur thermique (7) comprenant des entailles ouvertes (73) s’étendant dans la zone de montage (71) de façon à former des ailettes (711, 712, 713, 714) séparées les unes des autres par les entailles (73). Figure pour l’abrégé : Fig 1
FR2209121A 2022-09-12 2022-09-12 Dissipateur thermique de boitier de circuit integre Active FR3139664B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR2209121A FR3139664B1 (fr) 2022-09-12 2022-09-12 Dissipateur thermique de boitier de circuit integre
US18/244,534 US20240087977A1 (en) 2022-09-12 2023-09-11 Integrated circuit package heat sink

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2209121A FR3139664B1 (fr) 2022-09-12 2022-09-12 Dissipateur thermique de boitier de circuit integre
FR2209121 2022-09-12

Publications (2)

Publication Number Publication Date
FR3139664A1 FR3139664A1 (fr) 2024-03-15
FR3139664B1 true FR3139664B1 (fr) 2025-10-24

Family

ID=83996524

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2209121A Active FR3139664B1 (fr) 2022-09-12 2022-09-12 Dissipateur thermique de boitier de circuit integre

Country Status (2)

Country Link
US (1) US20240087977A1 (fr)
FR (1) FR3139664B1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4415025A (en) * 1981-08-10 1983-11-15 International Business Machines Corporation Thermal conduction element for semiconductor devices
US6580167B1 (en) * 2001-04-20 2003-06-17 Amkor Technology, Inc. Heat spreader with spring IC package
US6906413B2 (en) * 2003-05-30 2005-06-14 Honeywell International Inc. Integrated heat spreader lid
US20050051893A1 (en) * 2003-09-05 2005-03-10 Taiwan Semiconductor Manufacturing Co. SBGA design for low-k integrated circuits (IC)
US10163754B2 (en) * 2013-12-26 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. Lid design for heat dissipation enhancement of die package
US10224262B2 (en) * 2017-05-12 2019-03-05 Globalfoundries Inc. Flexible heat spreader lid
US11670569B2 (en) * 2019-06-11 2023-06-06 Intel Corporation Channeled lids for integrated circuit packages

Also Published As

Publication number Publication date
FR3139664A1 (fr) 2024-03-15
US20240087977A1 (en) 2024-03-14

Similar Documents

Publication Publication Date Title
US7203064B2 (en) Heat exchanger with cooling channels having varying geometry
CN104486901B (zh) 散热绝缘衬板，包括该衬板的封装模块及其制作方法
US9721861B2 (en) Semiconductor device
JP2014099606A (ja) 分離タブを備える低プロファイル表面実装パッケージ
RU2015136239A (ru) Архитектура создания гибких корпусов
US7532475B2 (en) Semiconductor chip assembly with flexible metal cantilevers
JP6391527B2 (ja) パワー半導体モジュール
KR960026690A (ko) 반도체 패키지
KR20140056071A (ko) 반도체 장치
US10658324B2 (en) Semiconductor device
JP7622410B2 (ja) 冷却器及び半導体装置
JP2014053603A5 (fr)
JP2009070907A (ja) 半導体装置
JP2017028040A (ja) 半導体装置
JP2019021864A (ja) パワーモジュール
JP2016115782A (ja) 半導体モジュール
TW201728252A (zh) 致冷晶片散熱模組
JP6344477B2 (ja) 半導体モジュール
US12046549B2 (en) Semiconductor device
FR3100656B1 (fr) Structure de boîtier pour dispositifs d’alimentation
US11037857B1 (en) IGBT module with heat dissipation structure having copper layers of different thicknesses
JP7130928B2 (ja) 半導体装置
JP2017147316A (ja) 半導体装置
WO2010024343A1 (fr) Dispositif à semi-conducteurs
TW201927084A (zh) 軟性線路板結構

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20240315

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4