FR3155404B1 - Dispositif de refroidissement configuré pour refroidir un module électronique - Google Patents

Dispositif de refroidissement configuré pour refroidir un module électronique

Info

Publication number
FR3155404B1
FR3155404B1 FR2312404A FR2312404A FR3155404B1 FR 3155404 B1 FR3155404 B1 FR 3155404B1 FR 2312404 A FR2312404 A FR 2312404A FR 2312404 A FR2312404 A FR 2312404A FR 3155404 B1 FR3155404 B1 FR 3155404B1
Authority
FR
France
Prior art keywords
electronic module
cooling device
cool
device configured
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2312404A
Other languages
English (en)
Other versions
FR3155404A1 (fr
Inventor
Nicolas Martinho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo eAutomotive Germany GmbH
Original Assignee
Valeo eAutomotive Germany GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo eAutomotive Germany GmbH filed Critical Valeo eAutomotive Germany GmbH
Priority to FR2312404A priority Critical patent/FR3155404B1/fr
Priority to PCT/EP2024/082186 priority patent/WO2025104090A1/fr
Publication of FR3155404A1 publication Critical patent/FR3155404A1/fr
Application granted granted Critical
Publication of FR3155404B1 publication Critical patent/FR3155404B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Titre : Dispositif de refroidissement configuré pour refroidir un module électronique L’invention a pour objet un dispositif de refroidissement (3) configuré pour refroidir un module électronique (2) comprenant notamment une carte électronique (4) sur laquelle sont montés une pluralité de composants électroniques (5), le dispositif de refroidissement comportant : une enceinte (10) configurée pour recevoir le module électronique (2), un fluide d’immersion (100) dans lequel est au moins partiellement immergé le module électronique (2), le fluide d’immersion contenant un fluide diélectrique et au moins un matériau formant barrière électromagnétique mélangé au fluide diélectrique. Figure pour l’abrégé : Fig.1
FR2312404A 2023-11-13 2023-11-13 Dispositif de refroidissement configuré pour refroidir un module électronique Active FR3155404B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR2312404A FR3155404B1 (fr) 2023-11-13 2023-11-13 Dispositif de refroidissement configuré pour refroidir un module électronique
PCT/EP2024/082186 WO2025104090A1 (fr) 2023-11-13 2024-11-13 Dispositif de refroidissement configuré pour refroidir un module électronique

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2312404 2023-11-13
FR2312404A FR3155404B1 (fr) 2023-11-13 2023-11-13 Dispositif de refroidissement configuré pour refroidir un module électronique

Publications (2)

Publication Number Publication Date
FR3155404A1 FR3155404A1 (fr) 2025-05-16
FR3155404B1 true FR3155404B1 (fr) 2025-10-31

Family

ID=90718043

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2312404A Active FR3155404B1 (fr) 2023-11-13 2023-11-13 Dispositif de refroidissement configuré pour refroidir un module électronique

Country Status (2)

Country Link
FR (1) FR3155404B1 (fr)
WO (1) WO2025104090A1 (fr)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04207098A (ja) * 1990-11-30 1992-07-29 Fujitsu Ltd プリント基板ユニットの冷却方法
JPH0590461A (ja) * 1991-09-25 1993-04-09 Hitachi Ltd 電子装置
DE102021212656A1 (de) * 2021-11-09 2022-12-15 Continental Automotive Technologies GmbH Elektronisches Gerät mit einer magnetisch abschirmenden Abdeckung

Also Published As

Publication number Publication date
FR3155404A1 (fr) 2025-05-16
WO2025104090A1 (fr) 2025-05-22

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