FR932898A - Perfectionnements relatifs aux méthodes pour la fabrication de configurations conductrices, comme des circuits de câblage, des selfs, etc. - Google Patents

Perfectionnements relatifs aux méthodes pour la fabrication de configurations conductrices, comme des circuits de câblage, des selfs, etc.

Info

Publication number
FR932898A
FR932898A FR932898DA FR932898A FR 932898 A FR932898 A FR 932898A FR 932898D A FR932898D A FR 932898DA FR 932898 A FR932898 A FR 932898A
Authority
FR
France
Prior art keywords
chokes
methods
wiring circuits
manufacturing conductive
conductive configurations
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EMI Ltd
Electrical and Musical Industries Ltd
Original Assignee
EMI Ltd
Electrical and Musical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EMI Ltd, Electrical and Musical Industries Ltd filed Critical EMI Ltd
Application granted granted Critical
Publication of FR932898A publication Critical patent/FR932898A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
FR932898D 1945-08-23 1946-08-27 Perfectionnements relatifs aux méthodes pour la fabrication de configurations conductrices, comme des circuits de câblage, des selfs, etc. Expired FR932898A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB2154445A GB602492A (en) 1945-08-23 1945-08-23 Improvements in or relating to methods of making electrically conducting patterns, such as wiring circuits, coils and the like
GB990146 1946-03-30

Publications (1)

Publication Number Publication Date
FR932898A true FR932898A (fr) 1948-04-05

Family

ID=41806072

Family Applications (1)

Application Number Title Priority Date Filing Date
FR932898D Expired FR932898A (fr) 1945-08-23 1946-08-27 Perfectionnements relatifs aux méthodes pour la fabrication de configurations conductrices, comme des circuits de câblage, des selfs, etc.

Country Status (3)

Country Link
ES (1) ES174665A1 (fr)
FR (1) FR932898A (fr)
GB (1) GB602492A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2628592A1 (fr) * 1988-03-11 1989-09-15 Thomson Csf Procede de realisation de circuits imprimes sur un support tridimensionnel, et support ainsi equipe
WO1995032605A1 (fr) * 1994-05-25 1995-11-30 James Cook University Of North Queensland Douille de carte a circuit imprime
AU699033B2 (en) * 1994-05-25 1998-11-19 James Cook University Of North Queensland Printed circuit board socket

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2734150A (en) * 1956-02-07 Circuit component and method of making same
NL90799C (fr) * 1949-03-08
US2695351A (en) * 1950-01-12 1954-11-23 Beck S Inc Electric circuit components and methods of preparing the same
NL189131B (nl) * 1950-01-12 Basf Ag Werkwijze voor de bereiding van n.n-dimethylpiperidiniumchloride respectievelijk n.n-dimethylmorfoliniumchloride.
US2762113A (en) * 1950-11-03 1956-09-11 Standard Coil Prod Co Inc Method of making tuner devices
US2716268A (en) * 1952-10-16 1955-08-30 Erie Resistor Corp Method of making printed circuits
US2943956A (en) * 1952-12-18 1960-07-05 Automated Circuits Inc Printed electrical circuits and method of making the same
US2876391A (en) * 1953-12-09 1959-03-03 Sanders Associates Inc Electrical circuit assembly
US2946936A (en) * 1954-03-05 1960-07-26 Motorola Inc Semiconductor device
US3000079A (en) * 1955-05-05 1961-09-19 Aladdin Ind Inc Tuner and method for making same
US3234632A (en) * 1955-08-25 1966-02-15 Hazeltine Research Inc Method of manufacturing magnetic deflection yokes
US2966429A (en) * 1956-08-31 1960-12-27 Gen Electric Method of and apparatus for making printed circuits
US3098951A (en) * 1959-10-29 1963-07-23 Sippican Corp Weldable circuit cards
GB2307354A (en) * 1995-11-14 1997-05-21 Daewoo Electronics Co Ltd Flyback transformer with a cylindrical printed circuit coil structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2628592A1 (fr) * 1988-03-11 1989-09-15 Thomson Csf Procede de realisation de circuits imprimes sur un support tridimensionnel, et support ainsi equipe
EP0333550A1 (fr) * 1988-03-11 1989-09-20 Thomson-Csf Procédé de réalisation de circuits imprimés sur un support plastique tridimensionnel, et support ainsi équipé
WO1995032605A1 (fr) * 1994-05-25 1995-11-30 James Cook University Of North Queensland Douille de carte a circuit imprime
AU699033B2 (en) * 1994-05-25 1998-11-19 James Cook University Of North Queensland Printed circuit board socket

Also Published As

Publication number Publication date
GB602492A (en) 1948-05-27
ES174665A1 (es) 1946-10-01

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