FR93425E - Décapage par pulvérisation a haute fréquence. - Google Patents
Décapage par pulvérisation a haute fréquence.Info
- Publication number
- FR93425E FR93425E FR8559A FR06008559A FR93425E FR 93425 E FR93425 E FR 93425E FR 8559 A FR8559 A FR 8559A FR 06008559 A FR06008559 A FR 06008559A FR 93425 E FR93425 E FR 93425E
- Authority
- FR
- France
- Prior art keywords
- high frequency
- frequency spray
- spray stripping
- stripping
- spray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007921 spray Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US52013166A | 1966-01-12 | 1966-01-12 | |
| US567485A US3474021A (en) | 1966-01-12 | 1966-07-25 | Method of forming openings using sequential sputtering and chemical etching |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR93425E true FR93425E (fr) | 1969-03-28 |
Family
ID=24267355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8559A Expired FR93425E (fr) | 1966-01-12 | 1967-06-12 | Décapage par pulvérisation a haute fréquence. |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US3474021A (fr) |
| FR (1) | FR93425E (fr) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3642548A (en) * | 1969-08-20 | 1972-02-15 | Siemens Ag | Method of producing integrated circuits |
| US3816198A (en) * | 1969-09-22 | 1974-06-11 | G Babcock | Selective plasma etching of organic materials employing photolithographic techniques |
| DE1951968A1 (de) * | 1969-10-15 | 1971-04-22 | Philips Patentverwaltung | AEtzloesung zur selektiven Musterzeugung in duennen Siliziumdioxydschichten |
| US3676317A (en) * | 1970-10-23 | 1972-07-11 | Stromberg Datagraphix Inc | Sputter etching process |
| US3664942A (en) * | 1970-12-31 | 1972-05-23 | Ibm | End point detection method and apparatus for sputter etching |
| FR2128140B1 (fr) * | 1971-03-05 | 1976-04-16 | Alsthom Cgee | |
| DE2117199C3 (de) * | 1971-04-08 | 1974-08-22 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Verfahren zur Herstellung geätzter Muster in dünnen Schichten mit definierten Kantenprofilen |
| US6076652A (en) * | 1971-04-16 | 2000-06-20 | Texas Instruments Incorporated | Assembly line system and apparatus controlling transfer of a workpiece |
| US3767493A (en) * | 1971-06-17 | 1973-10-23 | Ibm | Two-step photo-etching method for semiconductors |
| US3767492A (en) * | 1971-10-12 | 1973-10-23 | Bell Telephone Labor Inc | Semiconductor masking |
| FR2209216B1 (fr) * | 1972-11-30 | 1977-09-30 | Ibm | |
| US3984301A (en) * | 1973-08-11 | 1976-10-05 | Nippon Electric Varian, Ltd. | Sputter-etching method employing fluorohalogenohydrocarbon etching gas and a planar electrode for a glow discharge |
| JPS5065232A (fr) * | 1973-10-09 | 1975-06-02 | ||
| US4113486A (en) * | 1973-10-22 | 1978-09-12 | Fuji Photo Film Co., Ltd. | Method for producing a photomask |
| US4007103A (en) * | 1975-10-14 | 1977-02-08 | Ibm Corporation | Planarizing insulative layers by resputtering |
| US4172758A (en) * | 1975-11-07 | 1979-10-30 | Rockwell International Corporation | Magnetic bubble domain device fabrication technique |
| DE2626420C3 (de) * | 1976-06-12 | 1979-11-29 | Ibm Deutschland Gmbh, 7000 Stuttgart | Verfahren zum gleichzeitigen Ätzen von mehreren durchgehenden Löchern |
| JPS5377670U (fr) * | 1976-11-29 | 1978-06-28 | ||
| JPS5647950Y2 (fr) * | 1976-12-29 | 1981-11-10 | ||
| US4243435A (en) * | 1979-06-22 | 1981-01-06 | International Business Machines Corporation | Bipolar transistor fabrication process with an ion implanted emitter |
| JPS5533090A (en) * | 1979-07-19 | 1980-03-08 | Anelva Corp | Etching method |
| JPS5687670A (en) * | 1979-12-15 | 1981-07-16 | Anelva Corp | Dry etching apparatus |
| FR2550681B1 (fr) * | 1983-08-12 | 1985-12-06 | Centre Nat Rech Scient | Source d'ions a au moins deux chambres d'ionisation, en particulier pour la formation de faisceaux d'ions chimiquement reactifs |
| US4978420A (en) * | 1990-01-03 | 1990-12-18 | Hewlett-Packard Company | Single chamber via etch through a dual-layer dielectric |
| JP3328250B2 (ja) * | 1998-12-09 | 2002-09-24 | 岸本産業株式会社 | レジスト残渣除去剤 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2702274A (en) * | 1951-04-02 | 1955-02-15 | Rca Corp | Method of making an electrode screen by cathode sputtering |
| US3165430A (en) * | 1963-01-21 | 1965-01-12 | Siliconix Inc | Method of ultra-fine semiconductor manufacture |
| US3287243A (en) * | 1965-03-29 | 1966-11-22 | Bell Telephone Labor Inc | Deposition of insulating films by cathode sputtering in an rf-supported discharge |
-
1966
- 1966-07-25 US US567485A patent/US3474021A/en not_active Expired - Lifetime
-
1967
- 1967-06-12 FR FR8559A patent/FR93425E/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US3474021A (en) | 1969-10-21 |
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