GB0313402D0 - Semiconductor defect etch - Google Patents

Semiconductor defect etch

Info

Publication number
GB0313402D0
GB0313402D0 GBGB0313402.0A GB0313402A GB0313402D0 GB 0313402 D0 GB0313402 D0 GB 0313402D0 GB 0313402 A GB0313402 A GB 0313402A GB 0313402 D0 GB0313402 D0 GB 0313402D0
Authority
GB
United Kingdom
Prior art keywords
semiconductor defect
defect etch
etch
semiconductor
defect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0313402.0A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Europe Ltd
Original Assignee
Shin Etsu Handotai Europe Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Europe Ltd filed Critical Shin Etsu Handotai Europe Ltd
Priority to GBGB0313402.0A priority Critical patent/GB0313402D0/en
Publication of GB0313402D0 publication Critical patent/GB0313402D0/en
Priority to PCT/GB2004/002399 priority patent/WO2004112122A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/235—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising optical enhancement of defects or not-directly-visible states
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/32—Polishing; Etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
GBGB0313402.0A 2003-06-11 2003-06-11 Semiconductor defect etch Ceased GB0313402D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GBGB0313402.0A GB0313402D0 (en) 2003-06-11 2003-06-11 Semiconductor defect etch
PCT/GB2004/002399 WO2004112122A1 (en) 2003-06-11 2004-06-04 Semiconductor crystal defect etch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0313402.0A GB0313402D0 (en) 2003-06-11 2003-06-11 Semiconductor defect etch

Publications (1)

Publication Number Publication Date
GB0313402D0 true GB0313402D0 (en) 2003-07-16

Family

ID=27589820

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB0313402.0A Ceased GB0313402D0 (en) 2003-06-11 2003-06-11 Semiconductor defect etch

Country Status (2)

Country Link
GB (1) GB0313402D0 (en)
WO (1) WO2004112122A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2090675B1 (en) 2008-01-31 2015-05-20 Imec Defect etching of germanium
CN102768134B (en) * 2012-07-20 2015-02-11 浙江大学 Method for displaying and detecting void type defects in Czochralski silicon wafer
CN113394126A (en) * 2021-04-15 2021-09-14 上海新昇半导体科技有限公司 Method for detecting defects in semiconductor material
US12467877B2 (en) * 2023-01-31 2025-11-11 Globalwafers Co., Ltd. Methods for detecting defects in a single crystal silicon structure

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63215041A (en) * 1987-03-04 1988-09-07 Toshiba Corp Etching liquid for crystal defect evaluation
JPH1167742A (en) * 1997-08-25 1999-03-09 Sumitomo Metal Ind Ltd Etching solution for semiconductor substrate and etching method
US6376395B2 (en) * 2000-01-11 2002-04-23 Memc Electronic Materials, Inc. Semiconductor wafer manufacturing process

Also Published As

Publication number Publication date
WO2004112122A1 (en) 2004-12-23

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)