GB1237303A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
GB1237303A
GB1237303A GB4489169A GB4489169A GB1237303A GB 1237303 A GB1237303 A GB 1237303A GB 4489169 A GB4489169 A GB 4489169A GB 4489169 A GB4489169 A GB 4489169A GB 1237303 A GB1237303 A GB 1237303A
Authority
GB
United Kingdom
Prior art keywords
supports
containers
sept
wafer
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4489169A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB1237303A publication Critical patent/GB1237303A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/13Containers comprising a conductive base serving as an interconnection
    • H10W76/138Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB4489169A 1968-09-11 1969-09-11 Semiconductor device Expired GB1237303A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6544068A JPS4919024B1 (fr) 1968-09-11 1968-09-11

Publications (1)

Publication Number Publication Date
GB1237303A true GB1237303A (en) 1971-06-30

Family

ID=13287175

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4489169A Expired GB1237303A (en) 1968-09-11 1969-09-11 Semiconductor device

Country Status (4)

Country Link
JP (1) JPS4919024B1 (fr)
DE (2) DE6935758U (fr)
FR (1) FR2017808A1 (fr)
GB (1) GB1237303A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006014145C5 (de) * 2006-03-28 2015-12-17 Semikron Elektronik Gmbh & Co. Kg Druck kontaktierte Anordnung mit einem Leistungsbauelement, einem Metallformkörper und einer Verbindungseinrichtung
KR102040378B1 (ko) * 2016-12-20 2019-11-05 주식회사 티씨케이 지그를 이용한 반도체 제조용 부품의 제조방법 및 제조장치

Also Published As

Publication number Publication date
DE6935758U (de) 1971-05-27
DE1946106A1 (de) 1971-05-13
JPS4919024B1 (fr) 1974-05-14
FR2017808A1 (fr) 1970-05-22

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