GR1003602B - Διαδικασια ολοκληρωσης, σε κλιμακα ακεραιων δισκιων ημιαγωγων, οπτοηλεκτρονικων ημιαγωγικων διαταξεων, βασισμενων σε αρσενικουχογαλλιο και ολοκληρωμενων κυκλωματων πυριτιου - Google Patents

Διαδικασια ολοκληρωσης, σε κλιμακα ακεραιων δισκιων ημιαγωγων, οπτοηλεκτρονικων ημιαγωγικων διαταξεων, βασισμενων σε αρσενικουχογαλλιο και ολοκληρωμενων κυκλωματων πυριτιου

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Publication number
GR1003602B
GR1003602B GR20000100066A GR20000100066A GR1003602B GR 1003602 B GR1003602 B GR 1003602B GR 20000100066 A GR20000100066 A GR 20000100066A GR 20000100066 A GR20000100066 A GR 20000100066A GR 1003602 B GR1003602 B GR 1003602B
Authority
GR
Greece
Prior art keywords
wafer
procedure
integrated circuits
bonding
wafer scale
Prior art date
Application number
GR20000100066A
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English (en)
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Original Assignee
"����������"
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by , "����������" filed Critical
Priority to GR20000100066A priority Critical patent/GR1003602B/el
Priority to EP01600004A priority patent/EP1130647A3/en
Publication of GR1003602B publication Critical patent/GR1003602B/el

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/12—Active materials
    • H10F77/124—Active materials comprising only Group III-V materials, e.g. GaAs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
    • H10F71/1276—The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising growth substrates not made of Group III-V materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/162—Non-monocrystalline materials, e.g. semiconductor particles embedded in insulating materials
    • H10F77/164—Polycrystalline semiconductors

Landscapes

  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Abstract

Ολοκληρωμένη διαδικασία κατασκευής οπτοηλεκτρονικού (Ο/Η) συστήματος, που περιλαμβάνει διόδους εκπομπής φωτός (Λέιζερ ή LED)και φωτοαισθητήρες κατασκευάσμένους με επιταξιακά στρώματα ΙΙΙ-V ημιαγωγών που έχουν εναποτεθεί πάνω σε κρυσταλλικό δίσκο το οποίο είναι επικολλημένο πάνω σε δισκίο Πυριτίου στο οποίο έχουν προκατασκευαστεί Ο.Κ. CMOS/BiCMOS, χαρακτηριζόμενο από το ότι η επικόλληση του δισκίου με τα επιταξιακά στρώματα ΙΙΙ-V ημιαγωγών στο δισκίο πυριτίου γίνεται είτε με τη χρήση επoξικής κόλλας είτε με τη διαδικασία συγκόλλησης δισκίων (wafer bonding) μέσω SOG, SiO2 ή Si3N4 (ή συνδυασμού αυτών), τα οποία εναποτίθενται με διαδικασίες χαμηλής θερμοκρασίας (κάτω των 450 βαθμών C) και συγκολλούνται επίσης με διαδικασίες χαμηλής θερμοκρασίας (κάτω των 25ο βαθμών C). Χαρακτηριστικό της παρούσας εφεύρεσης είναι η τρισδιάστατη ολοκλήρωση των μικροηλεκτρονικών στοιχείων με τα οπτοηλεκτρονικά και με βάση διαδικασίες πολύ μεγάλης κλίμακας ολοκλήρωσης (VLSI).ΰ
GR20000100066A 2000-02-29 2000-02-29 Διαδικασια ολοκληρωσης, σε κλιμακα ακεραιων δισκιων ημιαγωγων, οπτοηλεκτρονικων ημιαγωγικων διαταξεων, βασισμενων σε αρσενικουχογαλλιο και ολοκληρωμενων κυκλωματων πυριτιου GR1003602B (el)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GR20000100066A GR1003602B (el) 2000-02-29 2000-02-29 Διαδικασια ολοκληρωσης, σε κλιμακα ακεραιων δισκιων ημιαγωγων, οπτοηλεκτρονικων ημιαγωγικων διαταξεων, βασισμενων σε αρσενικουχογαλλιο και ολοκληρωμενων κυκλωματων πυριτιου
EP01600004A EP1130647A3 (en) 2000-02-29 2001-02-28 Procedure for the wafer scale integration of gallium arsenide based optoelectronic devices with silicon based integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GR20000100066A GR1003602B (el) 2000-02-29 2000-02-29 Διαδικασια ολοκληρωσης, σε κλιμακα ακεραιων δισκιων ημιαγωγων, οπτοηλεκτρονικων ημιαγωγικων διαταξεων, βασισμενων σε αρσενικουχογαλλιο και ολοκληρωμενων κυκλωματων πυριτιου

Publications (1)

Publication Number Publication Date
GR1003602B true GR1003602B (el) 2001-06-19

Family

ID=10944209

Family Applications (1)

Application Number Title Priority Date Filing Date
GR20000100066A GR1003602B (el) 2000-02-29 2000-02-29 Διαδικασια ολοκληρωσης, σε κλιμακα ακεραιων δισκιων ημιαγωγων, οπτοηλεκτρονικων ημιαγωγικων διαταξεων, βασισμενων σε αρσενικουχογαλλιο και ολοκληρωμενων κυκλωματων πυριτιου

Country Status (2)

Country Link
EP (1) EP1130647A3 (el)
GR (1) GR1003602B (el)

Families Citing this family (12)

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US6500694B1 (en) 2000-03-22 2002-12-31 Ziptronix, Inc. Three dimensional device integration method and integrated device
US6984571B1 (en) 1999-10-01 2006-01-10 Ziptronix, Inc. Three dimensional device integration method and integrated device
US6902987B1 (en) 2000-02-16 2005-06-07 Ziptronix, Inc. Method for low temperature bonding and bonded structure
DE10211677B4 (de) * 2002-03-15 2007-08-09 Mergeoptics Gmbh Anordnung zum Senden oder Empfangen von optischen Signalen
AU2002307578A1 (en) * 2002-04-30 2003-12-02 Agency For Science Technology And Research A method of wafer/substrate bonding
US7109092B2 (en) 2003-05-19 2006-09-19 Ziptronix, Inc. Method of room temperature covalent bonding
DE102005061206B4 (de) * 2005-09-30 2019-10-17 Osram Opto Semiconductors Gmbh Verwendung einer Detektoranordnung als Umgebungslichtsensor
US7927975B2 (en) 2009-02-04 2011-04-19 Micron Technology, Inc. Semiconductor material manufacture
US9263512B2 (en) 2013-06-24 2016-02-16 Globalfoundries Inc. Memory cell with integrated III-V device
SG10201805702QA (en) 2014-01-14 2018-08-30 Massachusetts Inst Technology Method of forming an integrated circuit and related integrated circuit
CN106602402A (zh) * 2015-10-15 2017-04-26 罕王微电子（辽宁）有限公司 一种晶圆级电子元器件及其封装方法
KR20230097121A (ko) 2020-10-29 2023-06-30 아데이아 세미컨덕터 본딩 테크놀로지스 인코포레이티드 직접 접합 방법 및 구조체

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US5427638A (en) * 1992-06-04 1995-06-27 Alliedsignal Inc. Low temperature reaction bonding
US5503704A (en) * 1993-01-06 1996-04-02 The Regents Of The University Of California Nitrogen based low temperature direct bonding
US5606186A (en) * 1993-12-20 1997-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit including opposed substrates of different semiconductor materials and method of manufacturing the semiconductor integrated circuit
US5877038A (en) * 1996-11-27 1999-03-02 The Regents Of The University Of California Method of making a vertical cavity laser

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WO1991016729A1 (en) * 1990-04-20 1991-10-31 Australian And Overseas Telecommunications Corporation Limited An electro-optic device
US5236871A (en) * 1992-04-29 1993-08-17 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for producing a hybridization of detector array and integrated circuit for readout
US5346848A (en) * 1993-06-01 1994-09-13 Motorola, Inc. Method of bonding silicon and III-V semiconductor materials
US6005262A (en) * 1997-08-20 1999-12-21 Lucent Technologies Inc. Flip-chip bonded VCSEL CMOS circuit with silicon monitor detector
AU9296098A (en) * 1997-08-29 1999-03-16 Sharon N. Farrens In situ plasma wafer bonding method
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US5427638A (en) * 1992-06-04 1995-06-27 Alliedsignal Inc. Low temperature reaction bonding
US5503704A (en) * 1993-01-06 1996-04-02 The Regents Of The University Of California Nitrogen based low temperature direct bonding
US5606186A (en) * 1993-12-20 1997-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit including opposed substrates of different semiconductor materials and method of manufacturing the semiconductor integrated circuit
US5877038A (en) * 1996-11-27 1999-03-02 The Regents Of The University Of California Method of making a vertical cavity laser

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Also Published As

Publication number Publication date
EP1130647A3 (en) 2007-08-22
EP1130647A2 (en) 2001-09-05

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