GR1006723B - Ολοκληρωμενο ή τυπωμενο πηνιο σε σχημα μαργαριτας - Google Patents
Ολοκληρωμενο ή τυπωμενο πηνιο σε σχημα μαργαριταςInfo
- Publication number
- GR1006723B GR1006723B GR20090100028A GR20090100028A GR1006723B GR 1006723 B GR1006723 B GR 1006723B GR 20090100028 A GR20090100028 A GR 20090100028A GR 20090100028 A GR20090100028 A GR 20090100028A GR 1006723 B GR1006723 B GR 1006723B
- Authority
- GR
- Greece
- Prior art keywords
- printed
- coil
- same
- daisy
- petals
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Το ολοκληρωμένο ή τυπωμένο πηνίο σε σχήμα μαργαρίτας, αποτελείται από ανοικτούς βρόχους, τα πέταλα, που συνδέονται μεταξύ τους σε σειρά σχηματίζοντας τις σπείρες του και μπορεί να αποτελείται από μία ή περισσότερες σπείρες και ένα ή περισσότερα επίπεδα. Σε ένα ολοκληρωμένο ή τυπωμένο πηνίο σε σχήμα μαργαρίτας, σύμφωνα με την παρούσα εφεύρεση, το ανοικτό τμήμα του πετάλου είναι στραμμένο προς το κέντρο του πηνίου. Κάθε πέταλο είναι στραμμένο ως προς γωνία με κάθε προηγούμενο και τα πέταλα συνδέονται μεταξύ τους κατά μήκος μιας νοητής κλειστής καμπύλης, η οποία και ορίζει τη σπείρα του πηνίου,ενώ ο αριθμός των πετάλων είναι ίσος ή μεγαλύτερος του δύο. Ένα ολοκληρωμένο ή τυπωμένο πηνίο σε σχήμα μαργαρίτας, σύμφωνα με την παρούσα εφεύρεση, κατασκευάζεται με τον ίδιο τρόπο και ακολουθώντας τους ίδιους κανόνες με τα μέχρι τώρα συμβατικά πηνία, χωρίς να εισάγει επιπλέον βήματα στη διαδικασία παραγωγής πέραν των καθιερωμένων. Το πλεονέκτημα της σε σύγκριση με τα κλασσικά ολοκληρωμένα πηνία,είναι ότι για συγκεκριμένη τιμή της αυτεπαγωγής παρέχει υψηλότερο συντελεστή ποιότητας και μάλιστα σε υψηλότερη τιμή συχνότητας καταλαμβάνοντας την ίδια επιφάνεια στο ολοκληρωμένο κύκλωμα. ’μεση συνέπεια των παραπάνω είναι ότι με το ίδιο κόστος κατασκευής και με την ίδια δέσμευση επιφάνειας στο chip, μπορεί κανείς να πετύχει μεγαλύτερες τιμές του συντελεστή ποιότητας σε μεγαλύτερη τιμή συχνότητας.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GR20090100028A GR1006723B (el) | 2009-01-16 | 2009-01-16 | Ολοκληρωμενο ή τυπωμενο πηνιο σε σχημα μαργαριτας |
| EP10386002A EP2214183A1 (en) | 2009-01-16 | 2010-01-18 | Integrated, printed margarita- or clover shaped inductor |
| US12/657,376 US8237533B2 (en) | 2009-01-16 | 2010-01-19 | Integrated or printed margarita shaped inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GR20090100028A GR1006723B (el) | 2009-01-16 | 2009-01-16 | Ολοκληρωμενο ή τυπωμενο πηνιο σε σχημα μαργαριτας |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GR1006723B true GR1006723B (el) | 2010-03-09 |
Family
ID=42111203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GR20090100028A GR1006723B (el) | 2009-01-16 | 2009-01-16 | Ολοκληρωμενο ή τυπωμενο πηνιο σε σχημα μαργαριτας |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8237533B2 (el) |
| EP (1) | EP2214183A1 (el) |
| GR (1) | GR1006723B (el) |
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| US9123614B2 (en) | 2008-10-07 | 2015-09-01 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
| US9545216B2 (en) | 2011-08-05 | 2017-01-17 | Mc10, Inc. | Catheter balloon methods and apparatus employing sensing elements |
| US9289132B2 (en) | 2008-10-07 | 2016-03-22 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| WO2011041727A1 (en) | 2009-10-01 | 2011-04-07 | Mc10, Inc. | Protective cases with integrated electronics |
| WO2012125494A2 (en) | 2011-03-11 | 2012-09-20 | Mc10, Inc. | Integrated devices to facilitate quantitative assays and diagnostics |
| WO2012166686A2 (en) | 2011-05-27 | 2012-12-06 | Mc10, Inc. | Electronic, optical and/or mechanical apparatus and systems and methods for fabricating same |
| US9757050B2 (en) | 2011-08-05 | 2017-09-12 | Mc10, Inc. | Catheter balloon employing force sensing elements |
| EP2786131B1 (en) | 2011-09-01 | 2018-11-07 | Mc10, Inc. | Electronics for detection of a condition of tissue |
| DE112012004146T5 (de) | 2011-10-05 | 2014-11-06 | Mc10, Inc. | Herzkatheter mit Verwendung oberflächentreuer Elektronik zur Abbildung |
| KR101222777B1 (ko) * | 2011-10-25 | 2013-01-15 | 삼성전기주식회사 | 무선 충전용 코일 구조체 및 이를 구비한 무선 충전 장치 |
| JP5459327B2 (ja) * | 2012-01-24 | 2014-04-02 | 株式会社村田製作所 | 電子部品 |
| US9226402B2 (en) | 2012-06-11 | 2015-12-29 | Mc10, Inc. | Strain isolation structures for stretchable electronics |
| US9295842B2 (en) | 2012-07-05 | 2016-03-29 | Mc10, Inc. | Catheter or guidewire device including flow sensing and use thereof |
| JP2015521894A (ja) | 2012-07-05 | 2015-08-03 | エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． | 流量センシングを含むカテーテルデバイス |
| US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
| CN105008949A (zh) | 2012-10-09 | 2015-10-28 | Mc10股份有限公司 | 与服装整合的保形电子装置 |
| US9706647B2 (en) | 2013-05-14 | 2017-07-11 | Mc10, Inc. | Conformal electronics including nested serpentine interconnects |
| KR20160040670A (ko) | 2013-08-05 | 2016-04-14 | 엠씨10, 인크 | 곡면부착형 전자기기를 포함하는 유연한 온도 센서 |
| US10467926B2 (en) | 2013-10-07 | 2019-11-05 | Mc10, Inc. | Conformal sensor systems for sensing and analysis |
| JP6711750B2 (ja) | 2013-11-22 | 2020-06-17 | エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． | 心臓活動の検知および分析のためのコンフォーマルセンサシステム |
| WO2015103580A2 (en) | 2014-01-06 | 2015-07-09 | Mc10, Inc. | Encapsulated conformal electronic systems and devices, and methods of making and using the same |
| KR20160129007A (ko) | 2014-03-04 | 2016-11-08 | 엠씨10, 인크 | 전자 디바이스를 위한 다부분 유연성 봉지 하우징 |
| JP6661242B2 (ja) | 2014-03-12 | 2020-03-11 | エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． | アッセイの変化の定量化のための測定装置および方法 |
| JP2017524315A (ja) * | 2014-07-01 | 2017-08-24 | エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． | コンフォーマル電子デバイス |
| US10496915B2 (en) | 2014-07-31 | 2019-12-03 | 3M Innovative Properties Company | RFID tag on flexible substrate |
| US10229353B2 (en) | 2014-07-31 | 2019-03-12 | 3M Innovative Properties Company | RFID tag on stretchable substrate |
| US9899330B2 (en) | 2014-10-03 | 2018-02-20 | Mc10, Inc. | Flexible electronic circuits with embedded integrated circuit die |
| US10297572B2 (en) | 2014-10-06 | 2019-05-21 | Mc10, Inc. | Discrete flexible interconnects for modules of integrated circuits |
| USD781270S1 (en) | 2014-10-15 | 2017-03-14 | Mc10, Inc. | Electronic device having antenna |
| US10122192B2 (en) | 2015-02-17 | 2018-11-06 | Qualcomm Incorporated | Sense coil geometries with improved sensitivity for metallic object detection in a predetermined space |
| EP3258837A4 (en) | 2015-02-20 | 2018-10-10 | Mc10, Inc. | Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation |
| US10398343B2 (en) | 2015-03-02 | 2019-09-03 | Mc10, Inc. | Perspiration sensor |
| US10653332B2 (en) | 2015-07-17 | 2020-05-19 | Mc10, Inc. | Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers |
| US10709384B2 (en) | 2015-08-19 | 2020-07-14 | Mc10, Inc. | Wearable heat flux devices and methods of use |
| CN108290070A (zh) | 2015-10-01 | 2018-07-17 | Mc10股份有限公司 | 用于与虚拟环境相互作用的方法和系统 |
| WO2017062508A1 (en) | 2015-10-05 | 2017-04-13 | Mc10, Inc. | Method and System for Neuromodulation and Stimulation |
| TWI614780B (zh) * | 2015-12-21 | 2018-02-11 | 財團法人工業技術研究院 | 線圈組及無線傳能系統 |
| CN108781313B (zh) | 2016-02-22 | 2022-04-08 | 美谛达解决方案公司 | 用以贴身获取传感器信息的耦接的集线器和传感器节点的系统、装置和方法 |
| EP3420732B8 (en) | 2016-02-22 | 2020-12-30 | Medidata Solutions, Inc. | System, devices, and method for on-body data and power transmission |
| CN109310340A (zh) | 2016-04-19 | 2019-02-05 | Mc10股份有限公司 | 用于测量汗液的方法和系统 |
| US10447347B2 (en) | 2016-08-12 | 2019-10-15 | Mc10, Inc. | Wireless charger and high speed data off-loader |
| US11024452B2 (en) * | 2017-05-17 | 2021-06-01 | Jabil Inc. | Apparatus, system and method of producing planar coils |
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| US5446311A (en) * | 1994-09-16 | 1995-08-29 | International Business Machines Corporation | High-Q inductors in silicon technology without expensive metalization |
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| JP2003174749A (ja) * | 2001-12-06 | 2003-06-20 | Matsushita Electric Ind Co Ltd | 積層セラミックコイルおよびこれを用いたモータ |
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| CN101188159B (zh) * | 2006-11-24 | 2011-01-12 | 阎跃军 | 分段可调电感器 |
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-
2009
- 2009-01-16 GR GR20090100028A patent/GR1006723B/el not_active IP Right Cessation
-
2010
- 2010-01-18 EP EP10386002A patent/EP2214183A1/en not_active Withdrawn
- 2010-01-19 US US12/657,376 patent/US8237533B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US8237533B2 (en) | 2012-08-07 |
| EP2214183A1 (en) | 2010-08-04 |
| US20100245011A1 (en) | 2010-09-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PG | Patent granted | ||
| ML | Lapse due to non-payment of fees |
Effective date: 20150805 |