GR1008100B - Stencil για εξαρτηματα τυπου bga (ball grid array) μονιμης τοποθετησης απο ελαστομερη υλικα και μεθοδος εφαρμογης τους για επεξεργασια εξαρτηματων bga - Google Patents

Stencil για εξαρτηματα τυπου bga (ball grid array) μονιμης τοποθετησης απο ελαστομερη υλικα και μεθοδος εφαρμογης τους για επεξεργασια εξαρτηματων bga

Info

Publication number
GR1008100B
GR1008100B GR20120100613A GR20120100613A GR1008100B GR 1008100 B GR1008100 B GR 1008100B GR 20120100613 A GR20120100613 A GR 20120100613A GR 20120100613 A GR20120100613 A GR 20120100613A GR 1008100 B GR1008100 B GR 1008100B
Authority
GR
Greece
Prior art keywords
stencil
accessories
new
bga
grid array
Prior art date
Application number
GR20120100613A
Other languages
English (en)
Inventor
Παναγιωτης Ανδρεα Καρυδοπουλος
Παναγιωτης Νικολαου Φραντζης
Σωτηριος Γεωργιου Βιλλιωτης
Original Assignee
Παναγιωτης Ανδρεα Καρυδοπουλος
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Παναγιωτης Ανδρεα Καρυδοπουλος filed Critical Παναγιωτης Ανδρεα Καρυδοπουλος
Priority to GR20120100613A priority Critical patent/GR1008100B/el
Publication of GR1008100B publication Critical patent/GR1008100B/el

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • B41C1/145—Forme preparation for stencil-printing or silk-screen printing by perforation using an energetic radiation beam, e.g. a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Νέα BGA stencil για εξαρτήματα τύπου ball grid array τα οποία παράγονται από μεμβράνες από ελαστομερή υλικά και τα οποία stencil κόβονται διατρυπώνται με τη χρήση ακτινών laser και τα οποία stencil είναι μόνιμα προσαρτημένα μεταξύ των συγκολλημένων σφαιριδίων (3), του εξαρτήματος BGA (2), και του PCB (5). Η θερμοκρασία τήξης του ελαστομερούς υλικού μπορεί να είναι μεγαλύτερη ή μικρότερη από 250 βαθμούς Κελσίου. Τα νέα stencil (1) μπορεί να περιλαμβάνουν μέχρι και 43 τοις εκατό σωματίδια (ή τρίμματα) από ελαστικά αυτοκινήτων τα οποία έφθασαν στο τέλος του κύκλου ζωής των (με 0,2 mm μέγιστο μέγεθος σωματιδίων). Το πάχος του κάθε stencil (1) είναι κατά τουλάχιστον 0,1 mm μικρότερο από τη διάμετρο των σφαιριδίων τα οποία παράγονται από το υλικό συγκόλλησης μετάλλων (3). Τα νέα stencils (1) τοποθετούνται σε επίπεδη επιφάνεια και ένα νέο σύνολο από σφαιρίδια (3) τοποθετείται (με το χέρι) εντός των ανοιγμάτων (4) του stencil.
GR20120100613A 2012-12-06 2012-12-06 Stencil για εξαρτηματα τυπου bga (ball grid array) μονιμης τοποθετησης απο ελαστομερη υλικα και μεθοδος εφαρμογης τους για επεξεργασια εξαρτηματων bga GR1008100B (el)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GR20120100613A GR1008100B (el) 2012-12-06 2012-12-06 Stencil για εξαρτηματα τυπου bga (ball grid array) μονιμης τοποθετησης απο ελαστομερη υλικα και μεθοδος εφαρμογης τους για επεξεργασια εξαρτηματων bga

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GR20120100613A GR1008100B (el) 2012-12-06 2012-12-06 Stencil για εξαρτηματα τυπου bga (ball grid array) μονιμης τοποθετησης απο ελαστομερη υλικα και μεθοδος εφαρμογης τους για επεξεργασια εξαρτηματων bga

Publications (1)

Publication Number Publication Date
GR1008100B true GR1008100B (el) 2014-02-04

Family

ID=48536932

Family Applications (1)

Application Number Title Priority Date Filing Date
GR20120100613A GR1008100B (el) 2012-12-06 2012-12-06 Stencil για εξαρτηματα τυπου bga (ball grid array) μονιμης τοποθετησης απο ελαστομερη υλικα και μεθοδος εφαρμογης τους για επεξεργασια εξαρτηματων bga

Country Status (1)

Country Link
GR (1) GR1008100B (el)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113276535A (zh) * 2021-05-13 2021-08-20 浪潮商用机器有限公司 0.4pitch BGA元件的钢网加工方法、钢网结构

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0719638A2 (en) * 1994-12-28 1996-07-03 Ricoh Microelectronics Co., Ltd. Method of fabricating plastic mask for paste printing, plastic mask for paste printing, and paste printing method
US5560531A (en) * 1994-12-14 1996-10-01 O.K. Industries, Inc. Reflow minioven for electrical component
US5861323A (en) * 1994-06-06 1999-01-19 Microfab Technologies, Inc. Process for manufacturing metal ball electrodes for a semiconductor device
US6228678B1 (en) * 1998-04-27 2001-05-08 Fry's Metals, Inc. Flip chip with integrated mask and underfill
US6253675B1 (en) * 1999-06-29 2001-07-03 Carl P. Mayer Solder paste stenciling apparatus and method of use for rework
US6426564B1 (en) * 1999-02-24 2002-07-30 Micron Technology, Inc. Recessed tape and method for forming a BGA assembly
US20040005770A1 (en) * 2002-07-08 2004-01-08 Farnworth Warren M. Semiconductor devices with permanent polymer stencil and method for manufacturing the same
CH694697A5 (de) * 2004-01-29 2005-06-15 Koelbl Engineering Und Consult Gummimehl-enthaltende Elastomerlegierungen.
US20050150936A1 (en) * 1997-05-27 2005-07-14 Mackay John Bumping electronic components using transfer substrates
US20050189402A1 (en) * 2004-02-11 2005-09-01 Bandjwet Enterprises Area array and leaded SMT component stenciling apparatus and area array reballing method
GB2446592A (en) * 2007-02-16 2008-08-20 Polymer Recyclers Ltd Rubber recycling
US20090197054A1 (en) * 2008-02-06 2009-08-06 Nano Terra Inc. Stencils With Removable Backings for Forming Micron-Sized Features on Surfaces and Methods of Making and Using the Same

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5861323A (en) * 1994-06-06 1999-01-19 Microfab Technologies, Inc. Process for manufacturing metal ball electrodes for a semiconductor device
US5560531A (en) * 1994-12-14 1996-10-01 O.K. Industries, Inc. Reflow minioven for electrical component
EP0719638A2 (en) * 1994-12-28 1996-07-03 Ricoh Microelectronics Co., Ltd. Method of fabricating plastic mask for paste printing, plastic mask for paste printing, and paste printing method
US20050150936A1 (en) * 1997-05-27 2005-07-14 Mackay John Bumping electronic components using transfer substrates
US6228678B1 (en) * 1998-04-27 2001-05-08 Fry's Metals, Inc. Flip chip with integrated mask and underfill
US6426564B1 (en) * 1999-02-24 2002-07-30 Micron Technology, Inc. Recessed tape and method for forming a BGA assembly
US6253675B1 (en) * 1999-06-29 2001-07-03 Carl P. Mayer Solder paste stenciling apparatus and method of use for rework
US20040005770A1 (en) * 2002-07-08 2004-01-08 Farnworth Warren M. Semiconductor devices with permanent polymer stencil and method for manufacturing the same
CH694697A5 (de) * 2004-01-29 2005-06-15 Koelbl Engineering Und Consult Gummimehl-enthaltende Elastomerlegierungen.
US20050189402A1 (en) * 2004-02-11 2005-09-01 Bandjwet Enterprises Area array and leaded SMT component stenciling apparatus and area array reballing method
GB2446592A (en) * 2007-02-16 2008-08-20 Polymer Recyclers Ltd Rubber recycling
US20090197054A1 (en) * 2008-02-06 2009-08-06 Nano Terra Inc. Stencils With Removable Backings for Forming Micron-Sized Features on Surfaces and Methods of Making and Using the Same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ANONYMOUS: "BGA reballing instructions", 31 December 2002 (2002-12-31), XP055081455, Retrieved from the Internet <URL:http://www.emulation.com/pdf/102003BGA_Reballing_Instruction_Manual.pdf> [retrieved on 20130927] *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113276535A (zh) * 2021-05-13 2021-08-20 浪潮商用机器有限公司 0.4pitch BGA元件的钢网加工方法、钢网结构

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Effective date: 20140317

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