HK1008552B - 对非导电材料制造的基体表面进行选择性或部分电解涂敷金属的方法 - Google Patents

对非导电材料制造的基体表面进行选择性或部分电解涂敷金属的方法 Download PDF

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Publication number
HK1008552B
HK1008552B HK98108815.9A HK98108815A HK1008552B HK 1008552 B HK1008552 B HK 1008552B HK 98108815 A HK98108815 A HK 98108815A HK 1008552 B HK1008552 B HK 1008552B
Authority
HK
Hong Kong
Prior art keywords
plastics material
metal
solution
moulded plastics
material parts
Prior art date
Application number
HK98108815.9A
Other languages
German (de)
English (en)
French (fr)
Other versions
HK1008552A1 (zh
Inventor
Middeke Hermann
Mc Caskie John
H. Joshi Nayan
Original Assignee
阿托技术德国有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19510855A external-priority patent/DE19510855C2/de
Application filed by 阿托技术德国有限公司 filed Critical 阿托技术德国有限公司
Publication of HK1008552A1 publication Critical patent/HK1008552A1/zh
Publication of HK1008552B publication Critical patent/HK1008552B/zh

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HK98108815.9A 1995-03-17 1996-03-15 对非导电材料制造的基体表面进行选择性或部分电解涂敷金属的方法 HK1008552B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19510855A DE19510855C2 (de) 1995-03-17 1995-03-17 Verfahren zum selektiven oder partiellen elektrolytischen Metallisieren von Substraten aus nichtleitenden Materialien
DE19510855.8 1995-03-17
PCT/EP1996/001190 WO1996029452A1 (de) 1995-03-17 1996-03-15 Verfahren zum selektiven oder partiellen elektrolytischen metallisieren von oberflächen von substraten aus nichtleitenden materialien

Publications (2)

Publication Number Publication Date
HK1008552A1 HK1008552A1 (zh) 1999-05-14
HK1008552B true HK1008552B (zh) 2000-07-14

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