HK1073473A1 - Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition - Google Patents

Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition Download PDF

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Publication number
HK1073473A1
HK1073473A1 HK05104574A HK05104574A HK1073473A1 HK 1073473 A1 HK1073473 A1 HK 1073473A1 HK 05104574 A HK05104574 A HK 05104574A HK 05104574 A HK05104574 A HK 05104574A HK 1073473 A1 HK1073473 A1 HK 1073473A1
Authority
HK
Hong Kong
Prior art keywords
solvent
adhesive composition
cationic
polymerization catalyst
cationic polymerization
Prior art date
Application number
HK05104574A
Other languages
German (de)
English (en)
Chinese (zh)
Other versions
HK1073473B (en
Inventor
Hiroaki Yamaguchi
Ryota Akiyama
Original Assignee
3M Innovative Properties Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Company filed Critical 3M Innovative Properties Company
Publication of HK1073473A1 publication Critical patent/HK1073473A1/en
Publication of HK1073473B publication Critical patent/HK1073473B/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Claims (4)

  1. Composition adhésive polymérisable par polymérisation cationique, comprenant:
    (a) un monomère polymérisable par polymérisation cationique sélectionné parmi un monomère époxy, un monomère d'éther vinylique, ou un mélange de ceux-ci ;
    (b) un catalyseur de polymérisation cationique, lequel est un complexe fer-arène ayant un pic d'absorption dans une plage de lumière visible de 360 à 830 nm ; et
    (c) un solvant pour le catalyseur de polymérisation cationique,
    dans laquelle le solvant est un mélange d'un bon solvant et d'un solvant mauvais pour le catalyseur de polymérisation cationique, un bon solvant étant un solvant dans lequel le catalyseur de polymérisation cationique a une solubilité de 5 % ou plus à température ambiante, un solvant mauvais étant un solvant dans lequel le catalyseur de polymérisation cationique a une solubilité inférieure à 5 % à température ambiante, et dans laquelle un rapport pondéral du bon solvant contre le solvant mauvais est dans une plage de 5:95 à 60:40.
  2. Composition adhésive anisotropiquement électroconductrice, comprenant la composition adhésive polymérisable par polymérisation cationique selon la revendication 1 et des particules électroconductrices.
  3. Film adhésif formé par application de la composition adhésive polymérisable par polymérisation cationique selon la revendication 1 sur un séparateur et séchage du film de recouvrement.
  4. Film adhésif anisotropiquement électroconducteur formé par application de la composition adhésive anisotropiquement électroconductrice selon la revendication 2 sur un séparateur et séchage du film de recouvrement.
HK05104574.1A 2002-04-01 2003-02-19 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition HK1073473B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002099071A JP4201519B2 (ja) 2002-04-01 2002-04-01 カチオン重合性接着剤組成物及び異方導電性接着剤組成物
JP2002099071 2002-04-01
PCT/US2003/004944 WO2003085062A1 (fr) 2002-04-01 2003-02-19 Composition adhesive cationique polymerisable et composition adhesive anisotropiquement electroconductive

Publications (2)

Publication Number Publication Date
HK1073473A1 true HK1073473A1 (en) 2005-10-07
HK1073473B HK1073473B (en) 2007-04-20

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Also Published As

Publication number Publication date
JP2003292921A (ja) 2003-10-15
DE60308000T2 (de) 2007-03-01
DE60308000D1 (de) 2006-10-12
EP1490450A1 (fr) 2004-12-29
KR20040111454A (ko) 2004-12-31
CN1646657A (zh) 2005-07-27
ATE338102T1 (de) 2006-09-15
EP1490450B1 (fr) 2006-08-30
CN1312246C (zh) 2007-04-25
TW200304935A (en) 2003-10-16
WO2003085062A1 (fr) 2003-10-16
MY133275A (en) 2007-10-31
JP4201519B2 (ja) 2008-12-24
TWI322172B (en) 2010-03-21
AU2003215305A1 (en) 2003-10-20

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20110219