HK1073473A1 - 陽離子聚合的黏合劑組合物和各向異性導電的黏合劑組合物 - Google Patents

陽離子聚合的黏合劑組合物和各向異性導電的黏合劑組合物 Download PDF

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Publication number
HK1073473A1
HK1073473A1 HK05104574A HK05104574A HK1073473A1 HK 1073473 A1 HK1073473 A1 HK 1073473A1 HK 05104574 A HK05104574 A HK 05104574A HK 05104574 A HK05104574 A HK 05104574A HK 1073473 A1 HK1073473 A1 HK 1073473A1
Authority
HK
Hong Kong
Prior art keywords
solvent
adhesive composition
cationic
polymerization catalyst
cationic polymerization
Prior art date
Application number
HK05104574A
Other languages
German (de)
English (en)
French (fr)
Other versions
HK1073473B (zh
Inventor
Hiroaki Yamaguchi
Ryota Akiyama
Original Assignee
3M Innovative Properties Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Company filed Critical 3M Innovative Properties Company
Publication of HK1073473A1 publication Critical patent/HK1073473A1/zh
Publication of HK1073473B publication Critical patent/HK1073473B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
HK05104574.1A 2002-04-01 2003-02-19 陽離子聚合的黏合劑組合物和各向異性導電的黏合劑組合物 HK1073473B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002099071A JP4201519B2 (ja) 2002-04-01 2002-04-01 カチオン重合性接着剤組成物及び異方導電性接着剤組成物
JP2002099071 2002-04-01
PCT/US2003/004944 WO2003085062A1 (en) 2002-04-01 2003-02-19 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition

Publications (2)

Publication Number Publication Date
HK1073473A1 true HK1073473A1 (zh) 2005-10-07
HK1073473B HK1073473B (zh) 2007-04-20

Family

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Also Published As

Publication number Publication date
JP2003292921A (ja) 2003-10-15
DE60308000T2 (de) 2007-03-01
DE60308000D1 (de) 2006-10-12
EP1490450A1 (en) 2004-12-29
KR20040111454A (ko) 2004-12-31
CN1646657A (zh) 2005-07-27
ATE338102T1 (de) 2006-09-15
EP1490450B1 (en) 2006-08-30
CN1312246C (zh) 2007-04-25
TW200304935A (en) 2003-10-16
WO2003085062A1 (en) 2003-10-16
MY133275A (en) 2007-10-31
JP4201519B2 (ja) 2008-12-24
TWI322172B (en) 2010-03-21
AU2003215305A1 (en) 2003-10-20

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20110219