HK35676A - Processing semiconductor layers - Google Patents

Processing semiconductor layers

Info

Publication number
HK35676A
HK35676A HK356/76*UA HK35676A HK35676A HK 35676 A HK35676 A HK 35676A HK 35676 A HK35676 A HK 35676A HK 35676 A HK35676 A HK 35676A
Authority
HK
Hong Kong
Prior art keywords
semiconductor layers
processing semiconductor
processing
layers
semiconductor
Prior art date
Application number
HK356/76*UA
Other languages
English (en)
Inventor
W Ch Erdman
Paul Miller
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of HK35676A publication Critical patent/HK35676A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/60Wet etching
    • H10P50/64Wet etching of semiconductor materials
    • H10P50/642Chemical etching
    • H10P50/644Anisotropic liquid etching
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/051Etching
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/106Masks, special
HK356/76*UA 1971-05-28 1976-06-10 Processing semiconductor layers HK35676A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14808171A 1971-05-28 1971-05-28

Publications (1)

Publication Number Publication Date
HK35676A true HK35676A (en) 1976-06-18

Family

ID=22524177

Family Applications (1)

Application Number Title Priority Date Filing Date
HK356/76*UA HK35676A (en) 1971-05-28 1976-06-10 Processing semiconductor layers

Country Status (12)

Country Link
US (1) US3718514A (fr)
JP (1) JPS51427B1 (fr)
BE (1) BE783938A (fr)
CA (1) CA921374A (fr)
CH (1) CH541230A (fr)
DE (1) DE2225366C3 (fr)
FR (1) FR2139975B1 (fr)
GB (1) GB1389941A (fr)
HK (1) HK35676A (fr)
IT (1) IT958953B (fr)
NL (1) NL7207145A (fr)
SE (1) SE379213B (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2431647C3 (de) * 1974-07-02 1982-04-22 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zum Entfernen von Vorsprüngen an der Oberfläche einer epitaktischen Halbleiterschicht
US3990925A (en) * 1975-03-31 1976-11-09 Bell Telephone Laboratories, Incorporated Removal of projections on epitaxial layers
US4238275A (en) * 1978-12-29 1980-12-09 International Business Machines Corporation Pyrocatechol-amine-water solution for the determination of defects
JPS5612723A (en) * 1979-07-11 1981-02-07 Fujitsu Ltd Manufacture of semiconductor device
US4515652A (en) * 1984-03-20 1985-05-07 Harris Corporation Plasma sculpturing with a non-planar sacrificial layer
FR2578107A1 (fr) * 1985-02-26 1986-08-29 Socem Dispositif de connexion et de support, notamment pour le raccordement de lignes electriques
US4789646A (en) * 1987-07-20 1988-12-06 North American Philips Corporation, Signetics Division Company Method for selective surface treatment of semiconductor structures
US5387316A (en) * 1992-12-09 1995-02-07 Motorola, Inc. Wafer etch protection method

Also Published As

Publication number Publication date
BE783938A (fr) 1972-09-18
SE379213B (fr) 1975-09-29
FR2139975A1 (fr) 1973-01-12
DE2225366B2 (de) 1973-11-22
CH541230A (de) 1973-08-31
FR2139975B1 (fr) 1977-04-01
GB1389941A (en) 1975-04-09
NL7207145A (fr) 1972-11-30
CA921374A (en) 1973-02-20
JPS51427B1 (fr) 1976-01-08
US3718514A (en) 1973-02-27
DE2225366C3 (de) 1974-06-27
IT958953B (it) 1973-10-30
DE2225366A1 (de) 1972-12-14

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