HUT51659A - Sealing compound and process for the ulterior filling of gaps
- Google Patents
Sealing compound and process for the ulterior filling of gaps
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Publication number
HUT51659A
HUT51659AHU588188AHU588188AHUT51659AHU T51659 AHUT51659 AHU T51659AHU 588188 AHU588188 AHU 588188AHU 588188 AHU588188 AHU 588188AHU T51659 AHUT51659 AHU T51659A
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Application filed by Lajos NemesfiledCriticalLajos Nemes
Priority to HU588188ApriorityCriticalpatent/HUT51659A/en
Publication of HUT51659ApublicationCriticalpatent/HUT51659A/en
A sealant for secondary filling of gaps of larger than capillary size. Bonds inseparably to the inner surfaces and is capable of completely filling these voids
HU588188A1988-11-151988-11-15Sealing compound and process for the ulterior filling of gaps
HUT51659A
(en)