ID18411A - Metode dan alat untuk menghilangkan butir-butir solder secara mekanik pada permukaan papan-papan rangkaian yang dicetak - Google Patents

Metode dan alat untuk menghilangkan butir-butir solder secara mekanik pada permukaan papan-papan rangkaian yang dicetak

Info

Publication number
ID18411A
ID18411A IDP972693A ID972693A ID18411A ID 18411 A ID18411 A ID 18411A ID P972693 A IDP972693 A ID P972693A ID 972693 A ID972693 A ID 972693A ID 18411 A ID18411 A ID 18411A
Authority
ID
Indonesia
Prior art keywords
tools
methods
printed circuit
circuit boards
mechanical molding
Prior art date
Application number
IDP972693A
Other languages
English (en)
Inventor
Jens Tauchmann
Tilman Dr Schwinn
Heinz-Olaf Lucht
Original Assignee
Messer Griesheim Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Messer Griesheim Gmbh filed Critical Messer Griesheim Gmbh
Publication of ID18411A publication Critical patent/ID18411A/id

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Cleaning In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
IDP972693A 1996-08-10 1997-08-04 Metode dan alat untuk menghilangkan butir-butir solder secara mekanik pada permukaan papan-papan rangkaian yang dicetak ID18411A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19632335A DE19632335C2 (de) 1996-08-10 1996-08-10 Verfahren und Vorrichtung zur mechanischen Beseitigung von Lotkugeln auf der Obfläche von Leiterplatten

Publications (1)

Publication Number Publication Date
ID18411A true ID18411A (id) 1998-04-09

Family

ID=7802332

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP972693A ID18411A (id) 1996-08-10 1997-08-04 Metode dan alat untuk menghilangkan butir-butir solder secara mekanik pada permukaan papan-papan rangkaian yang dicetak

Country Status (8)

Country Link
US (1) US5911355A (id)
EP (1) EP0824051A1 (id)
KR (1) KR19980018549A (id)
DE (1) DE19632335C2 (id)
ID (1) ID18411A (id)
SG (1) SG67400A1 (id)
TW (1) TW363006B (id)
ZA (1) ZA976081B (id)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6216938B1 (en) * 1999-09-30 2001-04-17 International Business Machines Corporation Machine and process for reworking circuit boards
DE102004003521B3 (de) * 2004-01-21 2005-02-17 Siemens Ag Reparaturlötkopf mit einem Zuführkanal für ein Wärmeübertragungsmedium und dessen Verwendung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3680199A (en) * 1970-07-06 1972-08-01 Texas Instruments Inc Alloying method
US4419566A (en) * 1981-05-18 1983-12-06 Fortune William S Hot air soldering and resoldering system
US5205461A (en) * 1988-07-29 1993-04-27 International Business Machines Corporation Method and apparatus for fluxless solder bonding
US4995411A (en) * 1988-10-07 1991-02-26 Hollis Automation, Inc. Mass soldering system providing an improved fluid blast
DE3843191C2 (de) * 1988-12-22 1994-09-15 Broadcast Television Syst Vorrichtung zum Löten
JPH0671467A (ja) * 1992-08-21 1994-03-15 Fujitsu Ltd レーザを用いたプリント配線板の洗浄方法および洗浄装置
JPH066025A (ja) * 1992-06-24 1994-01-14 Fujitsu Ltd 半田ボール除去方法
DE9304784U1 (de) * 1993-03-29 1993-08-05 Cooper Tools GmbH, 74354 Besigheim Löt-/Entlötvorrichtung, insbesondere für integrierte Schaltungen
US5419481A (en) * 1993-09-21 1995-05-30 Air-Vac Engineering Company, Inc. Process and apparatus for attaching/deataching land grid array components
DE4416788C2 (de) * 1994-05-06 1999-08-19 Siemens Ag Verfahren zum Wellenlöten von Leiterplatten
US5685475A (en) * 1995-09-08 1997-11-11 Ford Motor Company Apparatus for cooling printed circuit boards in wave soldering
JP3303224B2 (ja) * 1995-12-22 2002-07-15 株式会社大成化研 半田付け方法及び半田ごて

Also Published As

Publication number Publication date
SG67400A1 (en) 1999-09-21
EP0824051A1 (de) 1998-02-18
DE19632335A1 (de) 1998-02-12
DE19632335C2 (de) 1999-01-21
ZA976081B (en) 1998-02-02
TW363006B (en) 1999-07-01
KR19980018549A (ko) 1998-06-05
US5911355A (en) 1999-06-15

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