ID20245A - Aparatus pembuatan peranti semikoduktor - Google Patents

Aparatus pembuatan peranti semikoduktor

Info

Publication number
ID20245A
ID20245A IDP981244A ID981244A ID20245A ID 20245 A ID20245 A ID 20245A ID P981244 A IDP981244 A ID P981244A ID 981244 A ID981244 A ID 981244A ID 20245 A ID20245 A ID 20245A
Authority
ID
Indonesia
Prior art keywords
semicoductor
aparatus
making
Prior art date
Application number
IDP981244A
Other languages
English (en)
Inventor
Minoru Yoshida
Takeshi Doi
Original Assignee
Innotech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innotech Corp filed Critical Innotech Corp
Publication of ID20245A publication Critical patent/ID20245A/id

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3216—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
IDP981244A 1997-09-25 1998-09-17 Aparatus pembuatan peranti semikoduktor ID20245A (id)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP27829697 1997-09-25
JP34864197 1997-12-03
JP10185567A JP2974069B2 (ja) 1997-09-25 1998-06-16 半導体デバイスの製造装置

Publications (1)

Publication Number Publication Date
ID20245A true ID20245A (id) 1998-11-05

Family

ID=27325580

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP981244A ID20245A (id) 1997-09-25 1998-09-17 Aparatus pembuatan peranti semikoduktor

Country Status (9)

Country Link
EP (1) EP0905745A3 (id)
JP (1) JP2974069B2 (id)
KR (1) KR19990029921A (id)
CN (1) CN1214531A (id)
AU (1) AU707688B2 (id)
CA (1) CA2248524A1 (id)
ID (1) ID20245A (id)
SG (1) SG102529A1 (id)
TW (1) TW421812B (id)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000277584A (ja) * 1999-03-26 2000-10-06 Innotech Corp 半導体デバイスの製造ライン
JP4508787B2 (ja) * 2004-08-31 2010-07-21 株式会社日立プラントテクノロジー 液晶パネルの生産設備
GB0804499D0 (en) * 2008-03-11 2008-04-16 Metryx Ltd Measurement apparatus and method
JP6123740B2 (ja) * 2014-06-17 2017-05-10 トヨタ自動車株式会社 半導体装置の製造ライン及び半導体装置の製造方法
EP3789512B1 (de) * 2019-09-09 2023-11-15 Sturm Maschinen- & Anlagenbau GmbH Anlage und verfahren zum beschichten von bremsscheiben oder bremstrommeln

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3765763A (en) * 1969-07-29 1973-10-16 Texas Instruments Inc Automatic slice processing
US3845286A (en) * 1973-02-05 1974-10-29 Ibm Manufacturing control system for processing workpieces
US3889355A (en) * 1973-02-05 1975-06-17 Ibm Continuous processing system
EP0322205A3 (en) * 1987-12-23 1990-09-12 Texas Instruments Incorporated Automated photolithographic work cell
US5024570A (en) * 1988-09-14 1991-06-18 Fujitsu Limited Continuous semiconductor substrate processing system
JP2525284B2 (ja) * 1990-10-22 1996-08-14 ティーディーケイ株式会社 クリ―ン搬送方法及び装置
US5399531A (en) * 1990-12-17 1995-03-21 United Micrpelectronics Corporation Single semiconductor wafer transfer method and plural processing station manufacturing system
US5668056A (en) * 1990-12-17 1997-09-16 United Microelectronics Corporation Single semiconductor wafer transfer method and manufacturing system
JPH05147723A (ja) * 1991-11-26 1993-06-15 Hitachi Ltd 物流管理システム
US5256204A (en) * 1991-12-13 1993-10-26 United Microelectronics Corporation Single semiconductor water transfer method and manufacturing system
JP3340181B2 (ja) * 1993-04-20 2002-11-05 株式会社東芝 半導体の製造方法及びそのシステム
JPH08181184A (ja) * 1994-12-22 1996-07-12 Hitachi Ltd 半導体製造ラインの構成方法
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
JP3774277B2 (ja) * 1996-08-29 2006-05-10 東京エレクトロン株式会社 被処理基板の搬送方法及び処理システム
JPH10144765A (ja) * 1996-11-11 1998-05-29 Canon Sales Co Inc 基板処理システム

Also Published As

Publication number Publication date
KR19990029921A (ko) 1999-04-26
SG102529A1 (en) 2004-03-26
TW421812B (en) 2001-02-11
CN1214531A (zh) 1999-04-21
AU8306298A (en) 1999-04-15
AU707688B2 (en) 1999-07-15
CA2248524A1 (en) 1999-03-25
JPH11224894A (ja) 1999-08-17
EP0905745A2 (en) 1999-03-31
EP0905745A3 (en) 2001-08-22
JP2974069B2 (ja) 1999-11-08

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