ID21066A - Pelogaman tembaga wafer silikon dengan menggunakan anoda tak larut - Google Patents

Pelogaman tembaga wafer silikon dengan menggunakan anoda tak larut

Info

Publication number
ID21066A
ID21066A IDP981323A ID981323A ID21066A ID 21066 A ID21066 A ID 21066A ID P981323 A IDP981323 A ID P981323A ID 981323 A ID981323 A ID 981323A ID 21066 A ID21066 A ID 21066A
Authority
ID
Indonesia
Prior art keywords
anodes
unlocked
programming
silicone wafer
wafer copper
Prior art date
Application number
IDP981323A
Other languages
English (en)
Indonesian (id)
Inventor
Elena H Too
Richard W Hurtubise
Juan B Haydu
Original Assignee
Enthone Omi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Omi Inc filed Critical Enthone Omi Inc
Publication of ID21066A publication Critical patent/ID21066A/id

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/20—Regeneration of process solutions of rinse-solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
IDP981323A 1997-10-10 1998-10-05 Pelogaman tembaga wafer silikon dengan menggunakan anoda tak larut ID21066A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/948,748 US6024856A (en) 1997-10-10 1997-10-10 Copper metallization of silicon wafers using insoluble anodes

Publications (1)

Publication Number Publication Date
ID21066A true ID21066A (id) 1999-04-15

Family

ID=25488219

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP981323A ID21066A (id) 1997-10-10 1998-10-05 Pelogaman tembaga wafer silikon dengan menggunakan anoda tak larut

Country Status (10)

Country Link
US (1) US6024856A (fr)
EP (1) EP1036222A4 (fr)
JP (1) JP2001520315A (fr)
KR (1) KR20010024470A (fr)
CN (1) CN1281517A (fr)
CA (1) CA2305456A1 (fr)
ID (1) ID21066A (fr)
IL (1) IL135548A0 (fr)
TW (1) TW476813B (fr)
WO (1) WO1999019544A1 (fr)

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CN112962129B (zh) * 2021-02-03 2023-04-14 深圳市永源微电子科技有限公司 一种晶圆双面电镀铜厚膜设备
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Also Published As

Publication number Publication date
WO1999019544A1 (fr) 1999-04-22
TW476813B (en) 2002-02-21
CA2305456A1 (fr) 1999-04-22
JP2001520315A (ja) 2001-10-30
IL135548A0 (en) 2001-05-20
US6024856A (en) 2000-02-15
EP1036222A1 (fr) 2000-09-20
EP1036222A4 (fr) 2005-12-21
KR20010024470A (ko) 2001-03-26
CN1281517A (zh) 2001-01-24

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