ID22238A - Komposisi-komposisi resin pengerasan termal - Google Patents

Komposisi-komposisi resin pengerasan termal

Info

Publication number
ID22238A
ID22238A IDW990703A ID990703A ID22238A ID 22238 A ID22238 A ID 22238A ID W990703 A IDW990703 A ID W990703A ID 990703 A ID990703 A ID 990703A ID 22238 A ID22238 A ID 22238A
Authority
ID
Indonesia
Prior art keywords
resin compositions
hardening resin
thermal hardening
thermal
compositions
Prior art date
Application number
IDW990703A
Other languages
English (en)
Inventor
Iida Kazutoshi
Wigham Jon
Original Assignee
Loctite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Loctite Corp filed Critical Loctite Corp
Publication of ID22238A publication Critical patent/ID22238A/id

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • C08K5/3155—Dicyandiamide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
IDW990703A 1997-01-17 1998-01-16 Komposisi-komposisi resin pengerasan termal ID22238A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP00657197A JP3613367B2 (ja) 1997-01-17 1997-01-17 熱硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
ID22238A true ID22238A (id) 1999-09-23

Family

ID=11642033

Family Applications (1)

Application Number Title Priority Date Filing Date
IDW990703A ID22238A (id) 1997-01-17 1998-01-16 Komposisi-komposisi resin pengerasan termal

Country Status (9)

Country Link
EP (1) EP0953008A4 (id)
JP (1) JP3613367B2 (id)
KR (1) KR100554323B1 (id)
CN (1) CN1243526A (id)
BR (1) BR9806743A (id)
ID (1) ID22238A (id)
MY (1) MY118700A (id)
TW (1) TW561178B (id)
WO (1) WO1998031738A1 (id)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1153980B1 (en) * 1999-02-18 2003-11-05 Three Bond Co., Ltd. Epoxy resin composition
KR100672130B1 (ko) * 1999-07-08 2007-01-19 산스타 기켄 가부시키가이샤 반도체 패키지용 언더필링 재료
US6255500B1 (en) 2000-01-21 2001-07-03 Loctite Corporation Process for the epoxidation of diene esters
US7012120B2 (en) 2000-03-31 2006-03-14 Henkel Corporation Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
US20050288458A1 (en) 2002-07-29 2005-12-29 Klemarczyk Philip T Reworkable thermosetting resin composition
JP4609617B2 (ja) * 2000-08-01 2011-01-12 日本電気株式会社 半導体装置の実装方法及び実装構造体
US6627683B1 (en) 2000-09-05 2003-09-30 Henkel Loctite Corporation Reworkable thermosetting resin compositions and compounds useful therein
US7108920B1 (en) 2000-09-15 2006-09-19 Henkel Corporation Reworkable compositions incorporating episulfide resins
US6936664B2 (en) 2000-10-04 2005-08-30 Henkel Corporation Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product
WO2002058108A2 (en) 2000-11-14 2002-07-25 Henkel Loctite Corporation Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
TW574739B (en) * 2001-02-14 2004-02-01 Nitto Denko Corp Thermosetting resin composition and semiconductor device using the same
JP5280597B2 (ja) 2001-03-30 2013-09-04 サンスター技研株式会社 一液加熱硬化型エポキシ樹脂組成物および半導体実装用アンダーフィル材
JP3566680B2 (ja) 2001-09-11 2004-09-15 富士通株式会社 半導体装置の製造方法
US6916890B1 (en) 2001-10-09 2005-07-12 Henkel Corporation Thermally reworkable epoxy resins and compositions based thereon
US6887737B1 (en) 2001-12-13 2005-05-03 Henkel Corporation Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom
US7242082B2 (en) 2002-02-07 2007-07-10 Irvine Sensors Corp. Stackable layer containing ball grid array package
JP2007521631A (ja) * 2003-08-08 2007-08-02 アービン センサーズ コーポレーション 積層可能な層及びその製造方法
JP5175431B2 (ja) * 2005-09-16 2013-04-03 日本電気株式会社 半導体装置のリペア方法
JP2007258207A (ja) * 2006-03-20 2007-10-04 Three M Innovative Properties Co バンプ付きチップもしくはパッケージの実装方法
ATE504448T1 (de) 2006-04-28 2011-04-15 Telecom Italia Spa Tintenstrahldruckkopfplatte und herstellungsverfahren dafür
WO2007142654A1 (en) * 2006-06-09 2007-12-13 Advanced Applied Adhesives Reworkable compositions and methods for use thereof
US7714426B1 (en) 2007-07-07 2010-05-11 Keith Gann Ball grid array package format layers and structure
JP4862963B2 (ja) 2008-06-05 2012-01-25 住友ベークライト株式会社 半導体装置の製造方法
WO2010050185A1 (ja) 2008-10-27 2010-05-06 パナソニック株式会社 半導体の実装構造体およびその製造方法
CN103172306A (zh) * 2013-04-08 2013-06-26 天津大学 一种水弹性模型材料及其制备方法
KR102340799B1 (ko) * 2018-09-20 2021-12-16 주식회사 엘지화학 금속 박막 코팅용 열경화성 수지 조성물, 이를 이용한 수지 코팅 금속 박막 및 금속박 적층판
KR102092649B1 (ko) * 2018-11-07 2020-03-24 (주)티에이치엔 방열 및 방사 기능이 구비된 전자 기기 패키징 장치 제조방법
DE102020127468A1 (de) 2020-10-19 2022-04-21 Werner H. Salewski Multifunktionale Epoxyd-Systeme
DE102022120396A1 (de) 2022-08-12 2024-02-15 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Verwendung einer härtbaren und wiederlösbaren Masse zur Herstellung eines Bauteils, und Masse dafür

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5463199A (en) * 1977-10-31 1979-05-21 Mitsui Petrochem Ind Ltd Curable composition for elastomers
SU990781A1 (ru) * 1979-12-06 1983-01-23 Предприятие П/Я В-8657 Маркировочна спиртобензостойка краска
SU1100295A1 (ru) * 1982-12-24 1984-06-30 Предприятие П/Я В-2756 Клей
US4794314A (en) * 1987-08-28 1988-12-27 Johnson Service Company Environmental position actuator apparatus having load responsive limit control apparatus
DD266361A1 (de) * 1987-12-03 1989-03-29 Leuna Werke Veb Tauchfaehige umhuellmassen fuer elektrische und elektronische bauelemente
US4866108A (en) * 1988-01-19 1989-09-12 Hughes Aircraft Company Flexible epoxy adhesive blend
JP2679849B2 (ja) * 1989-07-26 1997-11-19 松下電器産業株式会社 電子部品の実装方法およびこの方法に用いる接着剤
JP3543902B2 (ja) * 1997-01-17 2004-07-21 ヘンケル ロックタイト コーポレイション 半導体装置の実装構造および実装方法

Also Published As

Publication number Publication date
TW561178B (en) 2003-11-11
CN1243526A (zh) 2000-02-02
BR9806743A (pt) 2000-02-29
JP3613367B2 (ja) 2005-01-26
KR20000070203A (ko) 2000-11-25
EP0953008A1 (en) 1999-11-03
MY118700A (en) 2005-01-31
WO1998031738A1 (en) 1998-07-23
JPH10204259A (ja) 1998-08-04
KR100554323B1 (ko) 2006-02-24
EP0953008A4 (en) 2000-05-03

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