ID27581A - Penahan lembaran untuk melubangi lembaran hijau keramik dan peralatan pelubang - Google Patents

Penahan lembaran untuk melubangi lembaran hijau keramik dan peralatan pelubang

Info

Publication number
ID27581A
ID27581A IDW20002613A ID20002613A ID27581A ID 27581 A ID27581 A ID 27581A ID W20002613 A IDW20002613 A ID W20002613A ID 20002613 A ID20002613 A ID 20002613A ID 27581 A ID27581 A ID 27581A
Authority
ID
Indonesia
Prior art keywords
green sheet
sheets
ceramic green
puttle
walled
Prior art date
Application number
IDW20002613A
Other languages
English (en)
Inventor
Hiroshi Ochi
Shigetoshi Segawa
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of ID27581A publication Critical patent/ID27581A/id

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
    • B26F1/14—Punching tools; Punching dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/02—Means for holding or positioning work with clamping means
    • B26D7/025—Means for holding or positioning work with clamping means acting upon planar surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
    • B28B11/12—Apparatus or processes for treating or working the shaped or preshaped articles for removing parts of the articles by cutting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/202—With product handling means
    • Y10T83/2092—Means to move, guide, or permit free fall or flight of product
    • Y10T83/2096—Means to move product out of contact with tool
    • Y10T83/2135—Moving stripper timed with tool stroke
    • Y10T83/215—Carried by moving tool element or its support
    • Y10T83/2155—Stripper biased against product
    • Y10T83/2157—Elastomeric stripper contacting product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/202—With product handling means
    • Y10T83/2092—Means to move, guide, or permit free fall or flight of product
    • Y10T83/2096—Means to move product out of contact with tool
    • Y10T83/217—Stationary stripper
    • Y10T83/2172—Stripper encircles moving tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Forests & Forestry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Structural Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Preparation Of Clay, And Manufacture Of Mixtures Containing Clay Or Cement (AREA)
  • Ceramic Capacitors (AREA)
IDW20002613A 1999-04-15 2000-04-10 Penahan lembaran untuk melubangi lembaran hijau keramik dan peralatan pelubang ID27581A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10841899A JP3771745B2 (ja) 1999-04-15 1999-04-15 セラミックグリーンシートの孔明け加工用シート押えおよび孔明け装置

Publications (1)

Publication Number Publication Date
ID27581A true ID27581A (id) 2001-04-12

Family

ID=14484271

Family Applications (1)

Application Number Title Priority Date Filing Date
IDW20002613A ID27581A (id) 1999-04-15 2000-04-10 Penahan lembaran untuk melubangi lembaran hijau keramik dan peralatan pelubang

Country Status (10)

Country Link
US (1) US6647845B1 (id)
EP (1) EP1120214B1 (id)
JP (1) JP3771745B2 (id)
KR (1) KR100434629B1 (id)
CN (1) CN1143766C (id)
AT (1) ATE341431T1 (id)
DE (1) DE60031084T2 (id)
ID (1) ID27581A (id)
TW (1) TW580850B (id)
WO (1) WO2000062988A1 (id)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468453B1 (en) 1999-10-08 2002-10-22 Shear Technologies, Llc Methods and apparatus for manufacturing fiber-cement soffits with air vents
DE10300831B4 (de) * 2003-01-10 2006-10-26 Groz-Beckert Kg Stanzeinrichtung für Green Sheets
JP4562413B2 (ja) * 2004-03-29 2010-10-13 京セラ株式会社 穿孔用金型およびそれを用いたセラミックグリーンシートの穿孔方法
JP4938471B2 (ja) * 2006-04-13 2012-05-23 アルプス電気株式会社 グリーンシートのスルーホール加工装置およびスルーホール加工方法
CN102962319A (zh) * 2012-12-13 2013-03-13 昆山诺瑞信机械设备有限公司 冲孔机
DE102013015875A1 (de) * 2013-09-23 2015-03-26 Sprick Gmbh Bielefelder Papier- Und Wellpappenwerke & Co. Perforationswerkzeug für eine Vorrichtung zum maschinellen Fertigen eines Füllmaterialerzeugnisses und Vorrichtung zum maschinellen Fertigen eines Füllmaterialerzeugnisses
JP6531114B2 (ja) * 2014-12-18 2019-06-12 黒田精工株式会社 順送り金型装置用の逆押え装置及びこれを備えた順送り金型装置
CN104552640B (zh) * 2014-12-31 2016-03-02 上海卡贝尼精密陶瓷有限公司 一种空腔回转体陶瓷件喷头的专用夹具及制造方法
JP6484571B2 (ja) * 2016-02-16 2019-03-13 日昌株式会社 偏光板の加工方法
US10478987B1 (en) * 2018-05-15 2019-11-19 Nien Made Enterprise Co., Ltd. Cutting module of cutting machine for window covering

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2230043A (en) * 1940-04-22 1941-01-28 Ready Machine Tool & Die Co In Punch stripper
US3101984A (en) * 1959-04-07 1963-08-27 Gilbert Mfg Company Inc Push together, screw apart connector
US4215608A (en) * 1978-11-02 1980-08-05 Pivot Punch Corporation Punch stripper
JPH0616000A (ja) 1991-03-22 1994-01-25 Hiroo Hayashi 鉛筆削り
US5213376A (en) * 1991-09-03 1993-05-25 Itt Corporation Squeeze-to-release quick connector
JPH0724235Y2 (ja) * 1992-07-28 1995-06-05 ユーエイチティー株式会社 穿孔装置の打抜チップ回収機構
JPH0679361A (ja) * 1992-07-29 1994-03-22 L Wilhelm Arthur パンチング装置
US5359914A (en) * 1993-06-29 1994-11-01 Brown Richard H Two part urethane punch stripper
US5466017A (en) * 1993-09-17 1995-11-14 Itt Corporation Squeeze-to-release quick connector
AU684975B2 (en) * 1994-06-28 1998-01-08 Eisenwerke Fried. Wilh. Duker Gmbh & Co. Tension-resisting pipe connection and method of making same
JPH08141992A (ja) * 1994-11-17 1996-06-04 Sumitomo Kinzoku Ceramics:Kk セラミック生基板の加工装置と加工方法
JP2561058B2 (ja) * 1994-12-22 1996-12-04 ユーエイチティー株式会社 パンチング装置の打抜チップ回収装置
JPH09205265A (ja) * 1996-01-26 1997-08-05 Toshiba Corp セラミックス配線基板の製造方法およびグリーンシート孔開け装置

Also Published As

Publication number Publication date
ATE341431T1 (de) 2006-10-15
JP2000296513A (ja) 2000-10-24
DE60031084D1 (de) 2006-11-16
EP1120214A1 (en) 2001-08-01
DE60031084T2 (de) 2007-01-11
CN1143766C (zh) 2004-03-31
KR100434629B1 (ko) 2004-06-04
EP1120214B1 (en) 2006-10-04
TW580850B (en) 2004-03-21
US6647845B1 (en) 2003-11-18
JP3771745B2 (ja) 2006-04-26
CN1300247A (zh) 2001-06-20
EP1120214A4 (en) 2005-02-23
WO2000062988A1 (en) 2000-10-26
KR20010072612A (ko) 2001-07-31

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