ID28271A - Bantalan penggosok untuk substrat semikonduktor - Google Patents

Bantalan penggosok untuk substrat semikonduktor

Info

Publication number
ID28271A
ID28271A IDW20010294A ID20010294A ID28271A ID 28271 A ID28271 A ID 28271A ID W20010294 A IDW20010294 A ID W20010294A ID 20010294 A ID20010294 A ID 20010294A ID 28271 A ID28271 A ID 28271A
Authority
ID
Indonesia
Prior art keywords
porous substrate
semiconductor substrates
rubber bearing
polishing
pad
Prior art date
Application number
IDW20010294A
Other languages
English (en)
Inventor
Sriram P Anjur
Roland K Sevilla
Frank B Kaufman
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of ID28271A publication Critical patent/ID28271A/id

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
IDW20010294A 1998-07-10 1999-07-08 Bantalan penggosok untuk substrat semikonduktor ID28271A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/114,003 US6126532A (en) 1997-04-18 1998-07-10 Polishing pads for a semiconductor substrate

Publications (1)

Publication Number Publication Date
ID28271A true ID28271A (id) 2001-05-10

Family

ID=22352827

Family Applications (1)

Application Number Title Priority Date Filing Date
IDW20010294A ID28271A (id) 1998-07-10 1999-07-08 Bantalan penggosok untuk substrat semikonduktor

Country Status (15)

Country Link
US (1) US6126532A (id)
EP (1) EP1097026B1 (id)
JP (1) JP2002520174A (id)
KR (1) KR20010071803A (id)
CN (1) CN1316940A (id)
AT (1) ATE227192T1 (id)
AU (1) AU4982799A (id)
CA (1) CA2337202A1 (id)
DE (1) DE69903820T2 (id)
ES (1) ES2188195T3 (id)
ID (1) ID28271A (id)
IL (1) IL140807A0 (id)
MY (1) MY133820A (id)
TW (1) TW425331B (id)
WO (1) WO2000002708A1 (id)

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TW425331B (en) 2001-03-11
CN1316940A (zh) 2001-10-10
WO2000002708A1 (en) 2000-01-20
DE69903820D1 (de) 2002-12-12
IL140807A0 (en) 2002-02-10
EP1097026B1 (en) 2002-11-06
DE69903820T2 (de) 2003-02-27
EP1097026A1 (en) 2001-05-09
KR20010071803A (ko) 2001-07-31
AU4982799A (en) 2000-02-01
MY133820A (en) 2007-11-30
CA2337202A1 (en) 2000-01-20
US6126532A (en) 2000-10-03
JP2002520174A (ja) 2002-07-09
ES2188195T3 (es) 2003-06-16
ATE227192T1 (de) 2002-11-15

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