IE32507L - Lead attachment to semiconductor device - Google Patents

Lead attachment to semiconductor device

Info

Publication number
IE32507L
IE32507L IE681435A IE143568A IE32507L IE 32507 L IE32507 L IE 32507L IE 681435 A IE681435 A IE 681435A IE 143568 A IE143568 A IE 143568A IE 32507 L IE32507 L IE 32507L
Authority
IE
Ireland
Prior art keywords
leads
bonding
wafer
frame
needle
Prior art date
Application number
IE681435A
Other versions
IE32507B1 (en
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of IE32507L publication Critical patent/IE32507L/en
Publication of IE32507B1 publication Critical patent/IE32507B1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/442—Shapes or dispositions of multiple leadframes in a single chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07632—Compression bonding, e.g. thermocompression bonding
    • H10W72/07633—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/655—Materials of strap connectors of outermost layers of multilayered strap connectors, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

1,199,848. Integrated circuits. MOTOROLA ..Inc. 22 Nov., 1968 [15 Dec., 1967], No. 55557/68. Heading H1K [Also in Division B3] Leads are attached to raised coplanar aluminium bonding pads 12 on an integrated circuit wafer 11 by aligning the free ends of leads 24 (Fig. 6) extending inwardly from a frame member 21 with the pads and bonding them thereto in a single step. This is effected without heating by sandwiching the lead ends between the block and an anvil 32 no larger than the block itself and applying pressure and transverse high frequency vibrations (60 kc./s.) to the assembly via bonding needle 33. The free ends 54 of leads extending inwards from a larger frame member 51 of heavier gauge material such as nickel, copper, steel or KOVAR (RTM) are then aligned with portions of the first leads and bonded to them. Parts of the first leads extending beyond the bonds are removed before or (as shown) after this last operation. A number of frames 21 are preferably stamped or etched from a continuous strip of aluminium or copper 2 mils thick so that they can be wound on spools and run through the bonding apparatus in a continuous process. The anvil 32, bonding needle 33 and the backside of the wafer are roughened to facilitate communication of vibrations from the needle to the bonding areas. Lateral spread of the end of each tapered lead 24 during bonding causes it to kink adjacent the bond into the recess 35 provided for the purpose so that the leads stand proud of the edge of the wafer. Although leads 24 may be soldered, brazed, or bonded by a thermocompression or ultrasonic technique to those of frame 51 it is preferred to form resistance welds using a cylindrical welding element (Fig. 8, not shown). If desired, before this operation, the wafer and leads are stuck to a supporting disc of ceramic (shown in phantom) with epoxy resin or between two such discs. Finally leads 24 are severed from the first frame with the aid of a cylindrical knife edge or by simply ripping away the frame. The resulting elements may be potted in resin or mounted in ceramic flatpacks before removal from the second frames. [GB1199848A]
IE1435/68A 1967-12-15 1968-11-25 Improvements in and relating to contact bonding and lead attachment to an electrical device IE32507B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69104067A 1967-12-15 1967-12-15

Publications (2)

Publication Number Publication Date
IE32507L true IE32507L (en) 1969-06-15
IE32507B1 IE32507B1 (en) 1973-08-22

Family

ID=24774930

Family Applications (1)

Application Number Title Priority Date Filing Date
IE1435/68A IE32507B1 (en) 1967-12-15 1968-11-25 Improvements in and relating to contact bonding and lead attachment to an electrical device

Country Status (7)

Country Link
BE (1) BE725468A (en)
CA (1) CA922021A (en)
DE (1) DE1813165A1 (en)
FR (1) FR1597770A (en)
GB (1) GB1199848A (en)
IE (1) IE32507B1 (en)
NL (1) NL6817049A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE758871A (en) * 1969-11-13 1971-05-12 Philips Nv METHOD FOR CONNECTING METAL CONTACT LOCATIONS OF ELECTRICAL COMPONENTS WITH METAL CONDUCTORS OF A FLASK SUBSTRATE
US7515693B2 (en) 2004-08-06 2009-04-07 Powerphone, Inc. Call handler systems and methods
CN216483147U (en) * 2018-12-21 2022-05-10 大陆-特韦斯贸易合伙股份公司及两合公司 sensor

Also Published As

Publication number Publication date
BE725468A (en) 1969-06-13
IE32507B1 (en) 1973-08-22
GB1199848A (en) 1970-07-22
NL6817049A (en) 1969-06-17
DE1813165A1 (en) 1969-07-03
CA922021A (en) 1973-02-27
FR1597770A (en) 1970-06-29

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