IES66480B2 - Re-flow soldering apparatus - Google Patents
Re-flow soldering apparatusInfo
- Publication number
- IES66480B2 IES66480B2 IES950802A IES66480B2 IE S66480 B2 IES66480 B2 IE S66480B2 IE S950802 A IES950802 A IE S950802A IE S66480 B2 IES66480 B2 IE S66480B2
- Authority
- IE
- Ireland
- Prior art keywords
- pcb
- degrees centigrade
- soldering apparatus
- flow soldering
- conveyor
- Prior art date
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 11
- 229910000679 solder Inorganic materials 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 239000000155 melt Substances 0.000 claims abstract description 4
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims abstract 2
- XOFYZVNMUHMLCC-ZPOLXVRWSA-N prednisone Chemical compound O=C1C=C[C@]2(C)[C@H]3C(=O)C[C@](C)([C@@](CC4)(O)C(=O)CO)[C@@H]4[C@@H]3CCC2=C1 XOFYZVNMUHMLCC-ZPOLXVRWSA-N 0.000 claims description 2
- 230000003019 stabilising effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
A re-flow soldering apparatus for PCBs in which the PCB is passed on a conveyor 11 through successive heating zones such that the temperature of the PCB increases at not more than 2 degrees centigrade per second until the solder melts.
Description
RE-FLOW SOLDERING APPARATUS
The present invention relates to a re-flow soldering apparatus.
In a conventional manufacturing process for surface mounted printed circuit boards (PCBs), a blank PCS is screen printed to deposit solder paste where component pads are desired on the PCS. Components are then either manually or automatically placed on the pads and then the PCB is passed through a re-flow apparatus where the solder is first melted and then allowed to solidify to connect the components to the pads. However, it is important that the PCS should not be heated or cooled too quickly otherwise cracks will appear on the board.
Accordingly, the present invention provides a re-flow soldering apparatus for PCBs, in which the PCB is passed on a conveyor through successive heating zones such that the temperature of the PCB increases at not more than 2 degrees centigrade per second until the solder melts»
An embodiment of the invention will now be described, by way of example, with reference to the single figure of the accompanying drawing which is a schematic diagram of a re-flow soldering apparatus.
In the embodiment of the invention a conventional re-flow soldering apparatus 10 is used» This may be of the kind sold commercially as a Quant am 604 » '/
In the present embodiment, the PCB typically measures '
10cm x 10cm and travels through the oven on an open mesh conveyor 11 at a rate of 37.5cm per minute. The direction of travel is shown as right to left in the
- 2 drawing. The oven includes a plurality of infra-red heaters 14 located in the body 13 of the oven below the conveyor 11, and a further plurality of infra-red heaters 14 located in a cover 12 over the conveyor 11. Each heater 14 above the conveyor 11 opposes a respective heater 14 below the conveyor.
The PCB first passes through a heating sone including two opposed heating heaters set to 280 degrees centigrade. This brings the PCB up to temperature at a rate of not more than 2 degrees centigrade per second. The PCB then travels through two stabilising zones whose IR heaters are set between 190 degrees centigrade and 220 degrees centigrade as shown in the drawing. Finally, a reflow zone includes opposing heaters set to 350 degrees centigrade and 351 degrees centigrade respectively, and this is where the solder paste melts and begins to flow.
The PCB then exits the oven and passes between a pair of fans 15 located respectively above and below the conveyor. The fans are set so that the PCB cools at not more than 2 degrees centigrade per second.
Claims (4)
1. A re-flow soldering apparatus for PCBs, in which the ( A PCB is passed on a conveyor through successive heating zones such that the temperature of the PCB increases at not more than 2 degrees centigrade per second until the solder melts.
2. A re-flow soldering apparatus as claimed in claim 1, wherein after the solder has melted the PCB is cooled at not more than 2 degrees centigrade per second.
3. A re-flow soldering apparatus as claimed in claim 2, wherein the PCB passes through a plurality of zones each having a respective infra-red heater disposed respectively one above and one below the conveyor, the zones comprising an initial heating zone in which said heaters are set at about 280 degrees centigrade, two stabilising zones in which said heaters are set at from about 190 to about 220 degrees centigrade, and a reflow sone in which said heaters are set at about 350 degrees centigrade.
4. A re-flow soldering apparatus substantially as described herein with reference to the accompanying drawing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IES950802 IES950802A2 (en) | 1995-10-16 | 1995-10-16 | Re-flow soldering apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IES950802 IES950802A2 (en) | 1995-10-16 | 1995-10-16 | Re-flow soldering apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IES66480B2 true IES66480B2 (en) | 1995-12-27 |
| IES950802A2 IES950802A2 (en) | 1995-12-27 |
Family
ID=11040930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IES950802 IES950802A2 (en) | 1995-10-16 | 1995-10-16 | Re-flow soldering apparatus |
Country Status (1)
| Country | Link |
|---|---|
| IE (1) | IES950802A2 (en) |
-
1995
- 1995-10-16 IE IES950802 patent/IES950802A2/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| IES950802A2 (en) | 1995-12-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FD4E | Short term patents deemed void under section 64 |