IES950715A2 - A printed circuit board production process - Google Patents

A printed circuit board production process

Info

Publication number
IES950715A2
IES950715A2 IE950715A IES950715A IES950715A2 IE S950715 A2 IES950715 A2 IE S950715A2 IE 950715 A IE950715 A IE 950715A IE S950715 A IES950715 A IE S950715A IE S950715 A2 IES950715 A2 IE S950715A2
Authority
IE
Ireland
Prior art keywords
circuit board
printed circuit
production process
conducting layers
board production
Prior art date
Application number
IE950715A
Inventor
Declan Clear
Michael Clear
Original Assignee
Irish Circuits Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Irish Circuits Ltd filed Critical Irish Circuits Ltd
Priority to IE950715 priority Critical patent/IES66412B2/en
Priority to GB9518812A priority patent/GB2305299A/en
Publication of IES950715A2 publication Critical patent/IES950715A2/en
Publication of IES66412B2 publication Critical patent/IES66412B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A printed circuit board production process for producing a circuit board (21) having at least two interconnected conducting layers. The process has a chemical plating station (3) to provide a chemically plated electrical connection layer between the conducting layers and an electrical plating station (7) to cover the conducting layers with a conductive material and to apply an electricaly plated conductive layer to the chemically plated electrical connection layer. The circuit board (21) is passed between a number of chemical jet sprays (83) in a workstation 11 where dexodising chemical spray is sprayed on conducting surfaces to remove oxidised metal and deoxidised metal is activated before being immersed in a bath of hot solder 101.
IE950715 1995-09-12 1995-09-12 A printed circuit board production process IES66412B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IE950715 IES66412B2 (en) 1995-09-12 1995-09-12 A printed circuit board production process
GB9518812A GB2305299A (en) 1995-09-12 1995-09-14 Printed circuit board production process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IE950715 IES66412B2 (en) 1995-09-12 1995-09-12 A printed circuit board production process
GB9518812A GB2305299A (en) 1995-09-12 1995-09-14 Printed circuit board production process

Publications (2)

Publication Number Publication Date
IES950715A2 true IES950715A2 (en) 1995-12-27
IES66412B2 IES66412B2 (en) 1995-12-27

Family

ID=26307759

Family Applications (1)

Application Number Title Priority Date Filing Date
IE950715 IES66412B2 (en) 1995-09-12 1995-09-12 A printed circuit board production process

Country Status (2)

Country Link
GB (1) GB2305299A (en)
IE (1) IES66412B2 (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1042234A (en) * 1965-03-05 1966-09-14 Mullard Ltd Multilayer printed circuits
SE317423B (en) * 1967-07-28 1969-11-17 Gylling & Co Ab
GB1303851A (en) * 1970-03-09 1973-01-24
GB1288992A (en) * 1970-06-22 1972-09-13
GB1409737A (en) * 1972-09-29 1975-10-15 Exacta Circuits Ltd Through-hole plated printed circuits
GB2176942A (en) * 1983-11-10 1987-01-07 Donald Fort Sullivan Making printed circuit boards
GB8500906D0 (en) * 1985-01-15 1985-02-20 Prestwick Circuits Ltd Printed circuit boards

Also Published As

Publication number Publication date
GB2305299A9 (en) 1997-04-28
GB9518812D0 (en) 1995-11-15
IES66412B2 (en) 1995-12-27
GB2305299A8 (en) 1997-04-28
GB2305299A (en) 1997-04-02

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Legal Events

Date Code Title Description
MM4A Patent lapsed