IL102936A - Flow-soaking surfaces for non-electrical copper plating of complex systems - Google Patents

Flow-soaking surfaces for non-electrical copper plating of complex systems

Info

Publication number: IL102936A
Authority: IL; Israel
Prior art keywords: panel; flow; panels; assemblies; channels
Prior art date: 1991-08-26

Application number

IL10293692A

Other languages

English (en)

Hebrew (he)

Other versions

IL102936A0 (en

Original Assignee

Hughes Aircraft Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1991-08-26

Filing date

1992-08-25

Publication date

1996-03-31

1992-08-25 Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co

1993-02-21 Publication of IL102936A0 publication Critical patent/IL102936A0/xx

1996-03-31 Publication of IL102936A publication Critical patent/IL102936A/en

Links

230000001939 inductive effect Effects 0.000 title claims description 37
230000000712 assembly Effects 0.000 title claims description 36
238000000429 assembly Methods 0.000 title claims description 36
238000007747 plating Methods 0.000 title claims description 35
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 33
229910052802 copper Inorganic materials 0.000 title claims description 33
239000010949 copper Substances 0.000 title claims description 33
239000004033 plastic Substances 0.000 claims description 7
229920003023 plastic Polymers 0.000 claims description 7
230000013011 mating Effects 0.000 claims description 6
238000004519 manufacturing process Methods 0.000 description 4
238000001465 metallisation Methods 0.000 description 4
238000003780 insertion Methods 0.000 description 2
230000037431 insertion Effects 0.000 description 2
239000002184 metal Substances 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
238000004513 sizing Methods 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)
Electroplating Methods And Accessories (AREA)

IL10293692A 1991-08-26 1992-08-25 Flow-soaking surfaces for non-electrical copper plating of complex systems IL102936A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US75013791A	1991-08-26	1991-08-26

Publications (2)

Publication Number	Publication Date
IL102936A0 IL102936A0 (en)	1993-02-21
IL102936A true IL102936A (en)	1996-03-31

Family

ID=25016660

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IL10293692A IL102936A (en)	1991-08-26	1992-08-25	Flow-soaking surfaces for non-electrical copper plating of complex systems

Country Status (9)

Country	Link
US (1)	US5603768A (fr)
EP (1)	EP0530665B1 (fr)
JP (1)	JPH05209281A (fr)
KR (1)	KR960015096B1 (fr)
AU (1)	AU647658B2 (fr)
CA (1)	CA2076701C (fr)
DE (1)	DE69228783T2 (fr)
ES (1)	ES2129419T3 (fr)
IL (1)	IL102936A (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6225223B1 (en)	1999-08-16	2001-05-01	Taiwan Semiconductor Manufacturing Company	Method to eliminate dishing of copper interconnects

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2073679A (en) *	1935-02-05	1937-03-16	Western Electric Co	Electroplating apparatus
US2691144A (en) *	1952-07-12	1954-10-05	Fansteel Metallurgical Corp	Electroforming apparatus for rectifier disks
US3257308A (en) *	1961-07-11	1966-06-21	Western Electric Co	Article holder for electroplating articles
DE1239160B (de) *	1963-05-04	1967-04-20	Karl Schmidt Ges Mit Beschraen	Vorrichtung zum Galvanisieren ringfoermiger Koerper
US3648653A (en) *	1970-06-01	1972-03-14	Bell Telephone Labor Inc	Liquid phase crystal growth apparatus
US3972785A (en) *	1974-06-17	1976-08-03	The Empire Plating Company	Electroplating rack
FR2316761A1 (fr) *	1975-07-04	1977-01-28	Olivier Jean	Procede et reacteur pour soumettre une matiere a des ondes electromagnetiques
US4322592A (en) *	1980-08-22	1982-03-30	Rca Corporation	Susceptor for heating semiconductor substrates
US4312716A (en) *	1980-11-21	1982-01-26	Western Electric Co., Inc.	Supporting an array of elongate articles
CA1219179A (fr) *	1982-09-27	1987-03-17	Etd Technology, Inc.	Methode et dispositif de plaquate non electrolytique
DE3305564C1 (de) *	1983-02-15	1984-03-22	Siemens AG, 1000 Berlin und 8000 München	Verfahren zum Aufbau von metallisierten Leiterbahnen und Durchkontaktierungen an gelochten Leiterplatten
SU1167663A1 (ru) *	1984-01-10	1985-07-15	Предприятие П/Я Х-5618	Кассета дл групповой обработки радиодеталей
DE3411208C2 (de) *	1984-03-27	1987-01-29	Leybold-Heraeus GmbH, 5000 Köln	Haltevorrichtung für Substrate, insbesondere in Vakuum-Beschichtungsanlagen
US4634512A (en) *	1984-08-21	1987-01-06	Komag, Inc.	Disk and plug

1992
- 1992-08-24 CA CA002076701A patent/CA2076701C/fr not_active Expired - Fee Related
- 1992-08-25 IL IL10293692A patent/IL102936A/en not_active IP Right Cessation
- 1992-08-26 JP JP4227549A patent/JPH05209281A/ja active Pending
- 1992-08-26 DE DE69228783T patent/DE69228783T2/de not_active Expired - Fee Related
- 1992-08-26 ES ES92114558T patent/ES2129419T3/es not_active Expired - Lifetime
- 1992-08-26 AU AU21313/92A patent/AU647658B2/en not_active Ceased
- 1992-08-26 EP EP92114558A patent/EP0530665B1/fr not_active Expired - Lifetime
- 1992-08-26 KR KR1019920015373A patent/KR960015096B1/ko not_active Expired - Fee Related
1994
- 1994-07-21 US US08/278,682 patent/US5603768A/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
ES2129419T3 (es)	1999-06-16
IL102936A0 (en)	1993-02-21
AU647658B2 (en)	1994-03-24
EP0530665A1 (fr)	1993-03-10
CA2076701C (fr)	1997-12-23
JPH05209281A (ja)	1993-08-20
EP0530665B1 (fr)	1999-03-31
DE69228783T2 (de)	1999-12-02
DE69228783D1 (de)	1999-05-06
AU2131392A (en)	1993-03-11
KR960015096B1 (ko)	1996-10-24
US5603768A (en)	1997-02-18
CA2076701A1 (fr)	1993-02-27

Legal Events

Date	Code	Title
1996-08-04	FF	Patent granted
1997-03-18	KB	Patent renewed
1999-01-26	KB	Patent renewed
1999-06-20	HC	Change of name of proprietor(s)
2002-11-10	KB	Patent renewed
2007-07-24	MM9K	Patent not in force due to non-payment of renewal fees

Publication	Publication Date	Title
US4773881A (en)	1988-09-27	Keying system for connector assemblies
US6780058B2 (en)	2004-08-24	Shielded backplane connector
US5931686A (en)	1999-08-03	Backplane connector and method of assembly thereof to a backplane
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DE69901084T2 (de)	2002-10-02	Multikoaxialer Steckverbinder bestehend aus einem metallischen Block, der mit den Aussenleitern von verschiedenen koaxialen Kabeln verbunden ist
DE4232048A1 (de)	1994-03-31	Elektronisches Steuergerät
US5951306A (en)	1999-09-14	Modular connector assembly
DE68914855T2 (de)	1994-08-11	Steckervorrichtung für Koaxialkabel hoher Dichte.
DE69606067T2 (de)	2000-09-14	Elektrische steckvorrichtung
EP0153632B1 (fr)	1989-06-07	Montage d'un connecteur électrique à un appareil de mesure
JPH0378983A (ja)	1991-04-04	多極の差し込み装置のシールドを配線盤のアース電位層に電気的に接読するための装置
KR920003698Y1 (ko)	1992-06-08	컴퓨터 옵션 보드(option board)고정용 가이드 홀더 고정장치
US5603768A (en)	1997-02-18	Flow-inducing panels for electroless copper plating of complex assemblies
US5017750A (en)	1991-05-21	Frame construction for microwave oven having an integrally formed open chassis and an inserting opening
US5407364A (en)	1995-04-18	Retention and coupling assembly of connector
EP0872913B1 (fr)	2002-07-03	Connecteur coaxial multiple
JPS60158577A (ja)	1985-08-19	電気コネクタ部材
DE3243132A1 (de)	1984-05-24	Kastenfoermige flachbaugruppe
US2783443A (en)	1957-02-26	Connector plug assembly
US4750088A (en)	1988-06-07	Card cage
EP1045661B1 (fr)	2002-11-20	Aspirateur
JP2000294972A (ja)	2000-10-20	実装基板のシールド装置
EP0436531B1 (fr)	1993-03-24	Dispositif pivotant pour recevoir des ensembles de composants
WO1998034448A1 (fr)	1998-08-06	Boitier de connecteur electrique pour ensemble de plaquette de circuits
DE29721207U1 (de)	1998-03-05	Verbesserter elektrischer Verbinder für Computer