IL128087A - Buffer station for a wafer handling system - Google Patents

Buffer station for a wafer handling system

Info

Publication number
IL128087A
IL128087A IL12808799A IL12808799A IL128087A IL 128087 A IL128087 A IL 128087A IL 12808799 A IL12808799 A IL 12808799A IL 12808799 A IL12808799 A IL 12808799A IL 128087 A IL128087 A IL 128087A
Authority
IL
Israel
Prior art keywords
wafer
supporting
handling system
supporting elements
buffer station
Prior art date
Application number
IL12808799A
Other languages
English (en)
Other versions
IL128087A0 (en
Original Assignee
Nova Measuring Instr Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nova Measuring Instr Ltd filed Critical Nova Measuring Instr Ltd
Priority to IL12808799A priority Critical patent/IL128087A/en
Priority to JP23844799A priority patent/JP4431224B2/ja
Publication of IL128087A0 publication Critical patent/IL128087A0/xx
Priority to EP05109183A priority patent/EP1617461A3/fr
Priority to EP00100228A priority patent/EP1020893A3/fr
Priority to US09/822,505 priority patent/US6619144B2/en
Publication of IL128087A publication Critical patent/IL128087A/en
Priority to US10/630,973 priority patent/US6860790B2/en
Priority to US11/066,602 priority patent/US20050229725A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
IL12808799A 1999-01-17 1999-01-17 Buffer station for a wafer handling system IL128087A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
IL12808799A IL128087A (en) 1999-01-17 1999-01-17 Buffer station for a wafer handling system
JP23844799A JP4431224B2 (ja) 1999-01-17 1999-08-25 加工装置
EP05109183A EP1617461A3 (fr) 1999-01-17 2000-01-17 Poste de mesure et de traitement de plaquettes semi-conductrices
EP00100228A EP1020893A3 (fr) 1999-01-17 2000-01-17 Système tampon pour un système de manipulation de plaquette semiconductrice
US09/822,505 US6619144B2 (en) 1999-01-17 2001-04-02 Buffer system for a wafer handling system
US10/630,973 US6860790B2 (en) 1999-01-17 2003-07-31 Buffer system for a wafer handling system
US11/066,602 US20050229725A1 (en) 1999-01-17 2005-02-28 Buffer system for a wafer handling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL12808799A IL128087A (en) 1999-01-17 1999-01-17 Buffer station for a wafer handling system

Publications (2)

Publication Number Publication Date
IL128087A0 IL128087A0 (en) 1999-11-30
IL128087A true IL128087A (en) 2002-04-21

Family

ID=11072385

Family Applications (1)

Application Number Title Priority Date Filing Date
IL12808799A IL128087A (en) 1999-01-17 1999-01-17 Buffer station for a wafer handling system

Country Status (3)

Country Link
EP (2) EP1617461A3 (fr)
JP (1) JP4431224B2 (fr)
IL (1) IL128087A (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6854948B1 (en) 2002-08-15 2005-02-15 Nanometrics Incorporated Stage with two substrate buffer station
US7314808B2 (en) * 2004-12-23 2008-01-01 Applied Materials, Inc. Method for sequencing substrates
US7891936B2 (en) * 2005-03-30 2011-02-22 Brooks Automation, Inc. High speed substrate aligner apparatus
US8545165B2 (en) 2005-03-30 2013-10-01 Brooks Automation, Inc. High speed substrate aligner apparatus
US20080138178A1 (en) * 2006-12-06 2008-06-12 Axcelis Technologies,Inc. High throughput serial wafer handling end station
US7949425B2 (en) * 2006-12-06 2011-05-24 Axcelis Technologies, Inc. High throughput wafer notch aligner
DE102007041332A1 (de) * 2007-08-31 2009-03-05 Siemens Ag Transferchuck zur Übertragung, insbesondere von Wafern
TWI664130B (zh) * 2016-01-29 2019-07-01 Mpi Corporation 晶圓匣

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5024570A (en) * 1988-09-14 1991-06-18 Fujitsu Limited Continuous semiconductor substrate processing system
JP3139155B2 (ja) * 1992-07-29 2001-02-26 東京エレクトロン株式会社 真空処理装置
US6036426A (en) * 1996-01-26 2000-03-14 Creative Design Corporation Wafer handling method and apparatus
US5980183A (en) * 1997-04-14 1999-11-09 Asyst Technologies, Inc. Integrated intrabay buffer, delivery, and stocker system
IL123575A (en) * 1998-03-05 2001-08-26 Nova Measuring Instr Ltd Method and apparatus for alignment of a wafer

Also Published As

Publication number Publication date
IL128087A0 (en) 1999-11-30
EP1617461A3 (fr) 2006-11-02
EP1617461A2 (fr) 2006-01-18
EP1020893A3 (fr) 2005-04-06
EP1020893A2 (fr) 2000-07-19
JP2000208592A (ja) 2000-07-28
JP4431224B2 (ja) 2010-03-10

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