IL131838A - A laser system that uses a sub-material to control heat - Google Patents

A laser system that uses a sub-material to control heat

Info

Publication number: IL131838A
Authority: IL; Israel
Prior art keywords: heat; assembly; phase change; change material; laser medium
Prior art date: 1998-09-11

Application number

IL13183899A

Other languages

English (en)

Hebrew (he)

Other versions

IL131838A0 (en

Original Assignee

Cutting Edge Optronics Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1998-09-11

Filing date

1999-09-09

Publication date

2002-12-01

1998-09-11 Priority claimed from US09/151,851 external-priority patent/US6351478B1/en

1999-09-09 Application filed by Cutting Edge Optronics Inc filed Critical Cutting Edge Optronics Inc

2001-03-19 Publication of IL131838A0 publication Critical patent/IL131838A0/xx

2002-12-01 Publication of IL131838A publication Critical patent/IL131838A/en

Links

239000012782 phase change material Substances 0.000 title claims abstract description 150
239000007787 solid Substances 0.000 claims abstract description 30
239000007788 liquid Substances 0.000 claims abstract description 29
230000003287 optical effect Effects 0.000 claims abstract description 29
238000004891 communication Methods 0.000 claims abstract description 24
230000004044 response Effects 0.000 claims abstract 7
239000012530 fluid Substances 0.000 claims description 31
GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 17
229910052733 gallium Inorganic materials 0.000 claims description 17
239000004593 Epoxy Substances 0.000 claims description 6
229910001092 metal group alloy Inorganic materials 0.000 claims description 6
230000031070 response to heat Effects 0.000 claims description 4
229910000679 solder Inorganic materials 0.000 claims description 3
238000001816 cooling Methods 0.000 description 24
238000003491 array Methods 0.000 description 21
238000002844 melting Methods 0.000 description 17
230000008018 melting Effects 0.000 description 17
230000008859 change Effects 0.000 description 14
238000010276 construction Methods 0.000 description 12
239000012071 phase Substances 0.000 description 12
239000002918 waste heat Substances 0.000 description 11
239000013078 crystal Substances 0.000 description 10
239000000463 material Substances 0.000 description 10
229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 10
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
229910052802 copper Inorganic materials 0.000 description 7
239000010949 copper Substances 0.000 description 7
238000002310 reflectometry Methods 0.000 description 7
238000012546 transfer Methods 0.000 description 7
239000011248 coating agent Substances 0.000 description 5
238000000576 coating method Methods 0.000 description 5
239000007791 liquid phase Substances 0.000 description 5
230000005855 radiation Effects 0.000 description 5
239000004065 semiconductor Substances 0.000 description 5
230000007704 transition Effects 0.000 description 5
229910001369 Brass Inorganic materials 0.000 description 4
238000010521 absorption reaction Methods 0.000 description 4
239000012080 ambient air Substances 0.000 description 4
239000010951 brass Substances 0.000 description 4
238000009760 electrical discharge machining Methods 0.000 description 4
238000000034 method Methods 0.000 description 4
238000012360 testing method Methods 0.000 description 4
JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 3
229910001218 Gallium arsenide Inorganic materials 0.000 description 3
229910052782 aluminium Inorganic materials 0.000 description 3
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
230000008901 benefit Effects 0.000 description 3
238000006243 chemical reaction Methods 0.000 description 3
230000001427 coherent effect Effects 0.000 description 3
230000008878 coupling Effects 0.000 description 3
238000010168 coupling process Methods 0.000 description 3
238000005859 coupling reaction Methods 0.000 description 3
239000002019 doping agent Substances 0.000 description 3
230000004927 fusion Effects 0.000 description 3
239000007789 gas Substances 0.000 description 3
230000017525 heat dissipation Effects 0.000 description 3
229910052751 metal Inorganic materials 0.000 description 3
239000002184 metal Substances 0.000 description 3
238000013021 overheating Methods 0.000 description 3
239000007790 solid phase Substances 0.000 description 3
IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
239000003570 air Substances 0.000 description 2
-1 alkyl hydrocarbons Chemical class 0.000 description 2
JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 2
230000000712 assembly Effects 0.000 description 2
238000000429 assembly Methods 0.000 description 2
230000005540 biological transmission Effects 0.000 description 2
239000003795 chemical substances by application Substances 0.000 description 2
230000006835 compression Effects 0.000 description 2
238000007906 compression Methods 0.000 description 2
239000004020 conductor Substances 0.000 description 2
230000007423 decrease Effects 0.000 description 2
230000001419 dependent effect Effects 0.000 description 2
230000004907 flux Effects 0.000 description 2
238000010438 heat treatment Methods 0.000 description 2
APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
238000012986 modification Methods 0.000 description 2
230000004048 modification Effects 0.000 description 2
229910052755 nonmetal Inorganic materials 0.000 description 2
230000010287 polarization Effects 0.000 description 2
238000007789 sealing Methods 0.000 description 2
238000005476 soldering Methods 0.000 description 2
229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 2
FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
206010042135 Stomatitis necrotising Diseases 0.000 description 1
238000000862 absorption spectrum Methods 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
239000012298 atmosphere Substances 0.000 description 1
LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
230000001010 compromised effect Effects 0.000 description 1
239000002826 coolant Substances 0.000 description 1
239000002274 desiccant Substances 0.000 description 1
238000013461 design Methods 0.000 description 1
230000009977 dual effect Effects 0.000 description 1
NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
229910000743 fusible alloy Inorganic materials 0.000 description 1
229930195733 hydrocarbon Natural products 0.000 description 1
229910052738 indium Inorganic materials 0.000 description 1
239000003562 lightweight material Substances 0.000 description 1
VCZFPTGOQQOZGI-UHFFFAOYSA-N lithium bis(oxoboranyloxy)borinate Chemical compound [Li+].[O-]B(OB=O)OB=O VCZFPTGOQQOZGI-UHFFFAOYSA-N 0.000 description 1
238000003754 machining Methods 0.000 description 1
239000000155 melt Substances 0.000 description 1
239000002905 metal composite material Substances 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
UYIXUPGBIXNDHN-UHFFFAOYSA-N neodymium(3+) Chemical compound [Nd+3] UYIXUPGBIXNDHN-UHFFFAOYSA-N 0.000 description 1
229910052757 nitrogen Inorganic materials 0.000 description 1
201000008585 noma Diseases 0.000 description 1
230000009972 noncorrosive effect Effects 0.000 description 1
150000002843 nonmetals Chemical class 0.000 description 1
238000002135 phase contrast microscopy Methods 0.000 description 1
230000000704 physical effect Effects 0.000 description 1
WYOHGPUPVHHUGO-UHFFFAOYSA-K potassium;oxygen(2-);titanium(4+);phosphate Chemical compound [O-2].[K+].[Ti+4].[O-]P([O-])([O-])=O WYOHGPUPVHHUGO-UHFFFAOYSA-K 0.000 description 1
230000008569 process Effects 0.000 description 1
239000003507 refrigerant Substances 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1
238000007711 solidification Methods 0.000 description 1
230000008023 solidification Effects 0.000 description 1
239000000758 substrate Substances 0.000 description 1
238000007738 vacuum evaporation Methods 0.000 description 1
238000004073 vulcanization Methods 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1

Classifications

- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
- H01S3/027—Constructional details of solid state lasers, e.g. housings or mountings comprising a special atmosphere inside the housing
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0407—Liquid cooling, e.g. by water
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
- H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Mechanical Engineering (AREA)
General Engineering & Computer Science (AREA)
Electromagnetism (AREA)
Plasma & Fusion (AREA)
Optics & Photonics (AREA)
Lasers (AREA)
Control Of Temperature (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

IL13183899A 1998-09-11 1999-09-09 A laser system that uses a sub-material to control heat IL131838A (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US09/151,851 US6351478B1 (en)	1998-09-11	1998-09-11	Passively cooled solid-state laser
US09/270,991 US6307871B1 (en)	1998-09-11	1999-03-17	Laser system using phase change material for thermal control

Publications (2)

Publication Number	Publication Date
IL131838A0 IL131838A0 (en)	2001-03-19
IL131838A true IL131838A (en)	2002-12-01

Family

ID=26849027

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IL13183899A IL131838A (en)	1998-09-11	1999-09-09	A laser system that uses a sub-material to control heat

Country Status (6)

Country	Link
US (2)	US6307871B1 (de)
EP (1)	EP0987799B1 (de)
JP (1)	JP2000091672A (de)
AT (1)	ATE234522T1 (de)
DE (1)	DE69905829T2 (de)
IL (1)	IL131838A (de)

Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6307871B1 (en) *	1998-09-11	2001-10-23	Cutting Edge Optronics, Inc.	Laser system using phase change material for thermal control
GB2373636B (en) *	2000-11-29	2004-09-08	Mitsubishi Chem Corp	Semiconductor light emitting device with two heat sinks in contact with each other
US6397618B1 (en) *	2001-05-30	2002-06-04	International Business Machines Corporation	Cooling system with auxiliary thermal buffer unit for cooling an electronics module
WO2003047052A2 (en) *	2001-11-21	2003-06-05	General Atomics	Laser containing a distributed gain medium
US7002800B2 (en) *	2002-01-25	2006-02-21	Lockheed Martin Corporation	Integrated power and cooling architecture
US7106777B2 (en) *	2003-01-07	2006-09-12	The Boeing Company	Phase-change heat exchanger
US7170919B2 (en)	2003-06-23	2007-01-30	Northrop Grumman Corporation	Diode-pumped solid-state laser gain module
US7495848B2 (en)	2003-07-24	2009-02-24	Northrop Grumman Corporation	Cast laser optical bench
EP1519039A1 (de) *	2003-09-23	2005-03-30	AVL List GmbH	Gütegeschaltener, gepumpter Festkörperlaser
DK176137B1 (da) *	2003-10-27	2006-09-25	Danfoss Silicon Power Gmbh	Flowfordelingsenhed og köleenhed med bypassflow
JP2005268445A (ja) *	2004-03-17	2005-09-29	Hamamatsu Photonics Kk	半導体レーザ装置
US7218655B2 (en) *	2004-10-08	2007-05-15	B&W Tek Property, Inc.	Solid state laser insensitive to temperature changes
US20060088271A1 (en) *	2004-10-22	2006-04-27	Nanocoolers, Inc.	Transient thermoelectric cooling of optoelectronic devices
US7056116B2 (en) *	2004-10-26	2006-06-06	Ultradent Products, Inc.	Heat sink for dental curing light comprising a plurality of different materials
US7729392B2 (en) *	2005-01-28	2010-06-01	Scientific Materials Corporation	Monoblock laser with reflective substrate
US7305016B2 (en) *	2005-03-10	2007-12-04	Northrop Grumman Corporation	Laser diode package with an internal fluid cooling channel
US7817704B2 (en) *	2005-03-17	2010-10-19	Scientific Materials Corporation	Monoblock laser with improved alignment features
US7328508B2 (en) *	2005-07-05	2008-02-12	International Business Machines Corporation	Anisotropic heat spreading apparatus and method for semiconductor devices
US20070104233A1 (en) *	2005-11-09	2007-05-10	Jan Vetrovec	Thermal management system for high energy laser
US20070115635A1 (en) *	2005-11-18	2007-05-24	Low Andrew G	Passive cooling for fiber to the premise (FTTP) electronics
US7761181B2 (en) *	2005-11-29	2010-07-20	The Boeing Company	Line replaceable systems and methods
KR100719225B1 (ko) *	2005-12-21	2007-05-17	주식회사 글로벌스탠다드테크놀로지	반도체 제조 공정용 온도조절 시스템
US7839904B1 (en)	2006-01-26	2010-11-23	Scientific Materials Corporation	Monoblock laser systems and methods
WO2007098094A2 (en) *	2006-02-16	2007-08-30	Polacek Denise C	Thermoelectric cooler and reservoir for medical treatment
US8364320B2 (en)	2006-05-19	2013-01-29	ARGES Gesellschaft für Industrieplanung und Lasertechnik m.b.H.	Method for the highly precise regulation of load-variable heat sources or heat sinks, and device for controlling the temperature of a dynamic heat source, especially pump diodes for solid-state lasers
US7656915B2 (en) *	2006-07-26	2010-02-02	Northrop Grumman Space & Missions Systems Corp.	Microchannel cooler for high efficiency laser diode heat extraction
US20080056314A1 (en) *	2006-08-31	2008-03-06	Northrop Grumman Corporation	High-power laser-diode package system
US7518123B2 (en) *	2006-09-25	2009-04-14	Philip Morris Usa Inc.	Heat capacitor for capillary aerosol generator
US7433190B2 (en) *	2006-10-06	2008-10-07	Honeywell International Inc.	Liquid cooled electronic chassis having a plurality of phase change material reservoirs
US7983373B2 (en) *	2007-02-07	2011-07-19	Vintomie Networks B.V., Llc	Clock distribution for 10GBase-T analog front end
US7532652B2 (en) *	2007-02-20	2009-05-12	The Boeing Company	Laser thermal management systems and methods
DE102008004053A1 (de) *	2008-01-11	2009-07-23	Airbus Deutschland Gmbh	Spitzenlast-Kühlung von elektronischen Bauteilen durch phasenwechselnde Materialien
US7724791B2 (en) *	2008-01-18	2010-05-25	Northrop Grumman Systems Corporation	Method of manufacturing laser diode packages and arrays
US7633980B1 (en)	2008-02-29	2009-12-15	The United States Of America As Represented By The United States Department Of Energy	Phase change based cooling for high burst mode heat loads with temperature regulation above the phase change temperature
US7810965B2 (en)	2008-03-02	2010-10-12	Lumenetix, Inc.	Heat removal system and method for light emitting diode lighting apparatus
US9102857B2 (en) *	2008-03-02	2015-08-11	Lumenetix, Inc.	Methods of selecting one or more phase change materials to match a working temperature of a light-emitting diode to be cooled
DE102008013816B4 (de) *	2008-03-12	2010-09-16	Trumpf Werkzeugmaschinen Gmbh + Co. Kg	Rückgewinnung von Energie aus einem Laserbearbeitungssystem
JP4677009B2 (ja) *	2008-05-30	2011-04-27	ヤマハ発動機株式会社	部品供給装置およびそれを備えた表面実装機
US8657487B2 (en) *	2008-06-11	2014-02-25	Utah State University Research Foundation	Mini-cell, on-orbit, temperature re-calibration apparatus and method
WO2009155707A1 (en) *	2008-06-25	2009-12-30	Coractive High-Tech Inc.	Energy dissipating packages for high power operation of optical fiber components
DE102008057963A1 (de)	2008-11-19	2010-05-27	Lorenzen, Dirk, Dr.	Strahlungsquelle mit einer Wärmeübertragungsvorrichtung und Verfahren zum Betrieb der Strahlungsquelle
US8154728B2 (en) *	2008-12-31	2012-04-10	Spectrasensors, Inc.	Analytical equipment enclosure incorporating phase changing materials
DE102009000487A1 (de) *	2009-01-29	2010-08-05	Robert Bosch Gmbh	Laserzündkerze
US8345720B2 (en)	2009-07-28	2013-01-01	Northrop Grumman Systems Corp.	Laser diode ceramic cooler having circuitry for control and feedback of laser diode performance
US9019704B2 (en) *	2009-08-27	2015-04-28	Hewlett-Packard Development Company, L.P.	Heat storage by phase-change material
US8448457B2 (en) *	2009-11-23	2013-05-28	Sartorius Stedim North America Inc.	Systems and methods for use in freezing, thawing, and storing biopharmaceutical materials
US8018980B2 (en) *	2010-01-25	2011-09-13	Lawrence Livermore National Security, Llc	Laser diode package with enhanced cooling
US8123389B2 (en)	2010-02-12	2012-02-28	Lumenetix, Inc.	LED lamp assembly with thermal management system
CN101854027A (zh) *	2010-04-30	2010-10-06	西安炬光科技有限公司	一种用于半导体激光器的液体制冷器
US9590388B2 (en)	2011-01-11	2017-03-07	Northrop Grumman Systems Corp.	Microchannel cooler for a single laser diode emitter based system
WO2013040530A1 (en) *	2011-09-15	2013-03-21	Schlumberger Canada Limited	Target assembly including temperature activated coupler and related methods
CN102623889B (zh) *	2012-04-11	2014-12-24	西安炬光科技有限公司	应用于半导体激光器的液体制冷器的制备方法及其制冷装置
CN102620592B (zh) *	2012-04-11	2014-06-04	西安炬光科技有限公司	应用于半导体激光器的液体制冷器的制备方法及其制冷装置
EP2859391B1 (de) *	2012-04-19	2022-11-30	OE Solutions America Inc.	Kühlungssystem für vorrichtungen und baugruppen
US8937976B2 (en)	2012-08-15	2015-01-20	Northrop Grumman Systems Corp.	Tunable system for generating an optical pulse based on a double-pass semiconductor optical amplifier
CN103811976B (zh) *	2014-02-28	2017-02-22	苏州微木智能系统有限公司	一种脉冲式大功率激光器的散热装置及散热方法
EP2949422B1 (de)	2014-05-27	2017-05-17	Step-Tec AG	Vorrichtung zur Kühlung von Maschinenbauteilen mittels PCM
US9554491B1 (en)	2014-07-01	2017-01-24	Google Inc.	Cooling a data center
CN104218435B (zh) *	2014-09-19	2017-11-07	中国运载火箭技术研究院	一种基于板条式激光器的高密度热流相变储热散热系统
US20190036301A1 (en) *	2017-07-26	2019-01-31	The Boeing Company	Methods and apparatus to thermally manage heat sources using eutectic thermal control
RU184534U1 (ru) *	2018-01-10	2018-10-30	Акционерное общество "Научно-исследовательский институт газоразрядных приборов "Плазма" (АО "ПЛАЗМА")	Одночастотный стабилизированный газовый лазер
US10900755B1 (en) *	2018-06-26	2021-01-26	Applied Research Associates, Inc.	Laser weapon system
US10685900B2 (en) *	2018-10-22	2020-06-16	Deere & Company	Packaging of a semiconductor device with phase-change material for thermal performance
CN109244805A (zh) *	2018-11-02	2019-01-18	中国科学院西安光学精密机械研究所	一种高功率激光二极管泵浦源阵列的相变热控系统及方法
US10965084B1 (en) *	2019-05-07	2021-03-30	Lockheed Martin Corporation	Systems and methods for planar waveguide mounting and cooling
JP7279600B2 (ja) *	2019-09-26	2023-05-23	ブラザー工業株式会社	レーザ加工装置
US20240359595A1 (en) *	2020-08-24	2024-10-31	Tae Technologies, Inc.	Modular Cascaded Energy Systems with a Cooling Apparatus and with Replaceable Energy Source Capability
US11985895B2 (en) *	2021-05-17	2024-05-14	The United States Of America As Represented By The Secretary Of The Army	Thermoelectrically actuated phase change thermal energy storage (TES) module
US12082374B2 (en) *	2021-10-08	2024-09-03	Simmonds Precision Products, Inc.	Heatsinks comprising a phase change material
CN113851923B (zh) *	2021-10-19	2024-08-06	北京大学东莞光电研究院	激光器to封装结构
US20230400263A1 (en) *	2022-06-13	2023-12-14	Hamilton Sundstrand Corporation	Cold plate thermal storage for high load short duration cooling
US20240262162A1 (en) *	2023-02-04	2024-08-08	Jevne Micheau-Cunningham	Active and passive heat exchanger for cooling electric vehicle charging handles
CN116454713B (zh) *	2023-06-19	2023-08-11	深圳市联明电源有限公司	一种具有自动调节功能的激光电源及控制方法
CN119134032B (zh) *	2024-09-02	2025-09-30	武汉锐科光纤激光技术股份有限公司	固固相变储热激光器及制备方法
CN119297707B (zh) *	2024-12-12	2025-03-28	北京卓镭激光技术有限公司	一种自冷却激光模块

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3683296A (en)	1970-10-13	1972-08-08	Texas Instruments Inc	High efficiency laser cavity
DE2542174C3 (de)	1974-09-21	1980-02-14	Nippon Electric Co., Ltd., Tokio	Halbleiterlaservorrichtung
US4057101A (en)	1976-03-10	1977-11-08	Westinghouse Electric Corporation	Heat sink
US4219072A (en)	1978-02-10	1980-08-26	Barlow Donald W Sr	Phase change material heat exchanger
US4228406A (en)	1978-05-10	1980-10-14	The University Of Rochester	Laser apparatus
US4233567A (en)	1978-12-13	1980-11-11	General Electric Company	Face-cooled laser device having increased energy storage and output
US4393393A (en)	1979-08-13	1983-07-12	Mcdonnell Douglas Corporation	Laser diode with double sided heat sink
US4315225A (en)	1979-08-24	1982-02-09	Mcdonnell Douglas Corporation	Heat sink laser diode array
US4673030A (en)	1980-10-20	1987-06-16	Hughes Aircraft Company	Rechargeable thermal control system
US4573067A (en)	1981-03-02	1986-02-25	The Board Of Trustees Of The Leland Stanford Junior University	Method and means for improved heat removal in compact semiconductor integrated circuits
US4415234A (en)	1981-04-02	1983-11-15	Eastman Kodak Company	Passive cooling of mirrors
US4454602A (en)	1982-03-26	1984-06-12	Mcdonnell Douglas Corporation	Conductively cooled laser diode array
US4709750A (en)	1986-04-10	1987-12-01	Internorth, Inc.	Phase change heat exchanger
US4963741A (en)	1987-06-22	1990-10-16	Molectron Detector, Inc.	Large area pyroelectric joulemeter
FR2616976B1 (fr)	1987-06-22	1989-10-13	Lasag Ag	Laser avec systeme de refroidissement perfectionne
US4852109A (en)	1988-12-02	1989-07-25	General Electric Company	Temperature control of a solid state face pumped laser slab by an active siderail
US5005640A (en)	1989-06-05	1991-04-09	Mcdonnell Douglas Corporation	Isothermal multi-passage cooler
DE3925201A1 (de)	1989-07-29	1991-02-07	Messerschmitt Boelkow Blohm	Optische bank zur halterung optischer, elektrischer u.a. komponenten
US5076348A (en)	1990-01-25	1991-12-31	United Technologies Corporation	Solid-to-liquid phase change cooled mirror arrangement
US5105429A (en)	1990-07-06	1992-04-14	The United States Of America As Represented By The Department Of Energy	Modular package for cooling a laser diode array
US5253260A (en)	1991-12-20	1993-10-12	Hughes Aircraft Company	Apparatus and method for passive heat pipe cooling of solid state laser heads
US5220954A (en)	1992-10-07	1993-06-22	Shape, Inc.	Phase change heat exchanger
US5520244A (en)	1992-12-16	1996-05-28	Sdl, Inc.	Micropost waste heat removal system
US5315154A (en)	1993-05-14	1994-05-24	Hughes Aircraft Company	Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase transition
US5394427A (en)	1994-04-29	1995-02-28	Cutting Edge Optronics, Inc.	Housing for a slab laser pumped by a close-coupled light source
GB9505069D0 (en) *	1995-03-14	1995-05-03	Barr & Stroud Ltd	Heat sink
US5834840A (en) *	1995-05-25	1998-11-10	Massachusetts Institute Of Technology	Net-shape ceramic processing for electronic devices and packages
US5734672A (en)	1996-08-06	1998-03-31	Cutting Edge Optronics, Inc.	Smart laser diode array assembly and operating method using same
US6307871B1 (en) *	1998-09-11	2001-10-23	Cutting Edge Optronics, Inc.	Laser system using phase change material for thermal control
US6351478B1 (en) *	1998-09-11	2002-02-26	Cutting Edge Optronics, Inc.	Passively cooled solid-state laser
US6397618B1 (en) *	2001-05-30	2002-06-04	International Business Machines Corporation	Cooling system with auxiliary thermal buffer unit for cooling an electronics module

1999
- 1999-03-17 US US09/270,991 patent/US6307871B1/en not_active Expired - Lifetime
- 1999-09-09 IL IL13183899A patent/IL131838A/en active IP Right Review Request
- 1999-09-10 EP EP99117895A patent/EP0987799B1/de not_active Expired - Lifetime
- 1999-09-10 DE DE69905829T patent/DE69905829T2/de not_active Expired - Lifetime
- 1999-09-10 AT AT99117895T patent/ATE234522T1/de not_active IP Right Cessation
- 1999-09-10 JP JP11257957A patent/JP2000091672A/ja active Pending
2001
- 2001-10-09 US US09/973,027 patent/US6570895B2/en not_active Expired - Lifetime

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US6307871B1 (en)	2001-10-23
IL131838A0 (en)	2001-03-19
DE69905829T2 (de)	2003-08-14
EP0987799B1 (de)	2003-03-12
ATE234522T1 (de)	2003-03-15
EP0987799A3 (de)	2001-01-10
JP2000091672A (ja)	2000-03-31
US20020018498A1 (en)	2002-02-14
US6570895B2 (en)	2003-05-27
EP0987799A2 (de)	2000-03-22
DE69905829D1 (de)	2003-04-17

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Publication	Publication Date	Title
EP0987799B1 (de)	2003-03-12	Lasersystem mit phasenveränderlichem Material zur Temperatursteuerung
US6351478B1 (en)	2002-02-26	Passively cooled solid-state laser
US6339605B1 (en)	2002-01-15	Active mirror amplifier system and method for a high-average power laser system
US6101201A (en)	2000-08-08	Solid state laser with longitudinal cooling
US4949346A (en)	1990-08-14	Conductively cooled, diode-pumped solid-state slab laser
US6185235B1 (en)	2001-02-06	Lasers with low doped gain medium
US5796766A (en)	1998-08-18	Optically transparent heat sink for longitudinally cooling an element in a laser
US6256142B1 (en)	2001-07-03	End pumped zig-zag slab laser gain medium
Schepler et al.	2005	Thermal effects in Cr/sup 2+: ZnSe thin disk lasers
KR20060121900A (ko)	2006-11-29	다이오드 펌핑된 마이크로 레이저를 생산하기 위한 고밀도방법
US6625184B1 (en)	2003-09-23	Cooling device for an optical crystal or laser crystal
US5982792A (en)	1999-11-09	Solid-state laser device
Golla et al.	1994	High power continuous-wave diode-laser-pumped Nd: YAG laser
JPH09199882A (ja)	1997-07-31	温度制御装置
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US3471801A (en)	1969-10-07	Thermally controlled solid-state laser
US5848081A (en)	1998-12-08	Insulated water cooled gain medium assembly for a laser system
CN215896953U (zh)	2022-02-22	光纤激光器器件热控管理装置及光纤激光器
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KR100993790B1 (ko)	2010-11-11	초소형 고출력 마이크로칩 레이저 패키징용 서브마운트
CN113889832A (zh)	2022-01-04	一种泵浦被动调q激光器
US5506854A (en)	1996-04-09	Integrated, intracavity, frequency-converted slab laser
EP1618633A1 (de)	2006-01-25	Laservorrichtung zur erzeugung eines sichtbaren lichtstrahls
JPH11312832A (ja)	1999-11-09	半導体レーザ励起固体レーザ