IL253169A0 - התזת טיפות מתכת בזוית בשיטת העברת לייזר (lift) - Google Patents

התזת טיפות מתכת בזוית בשיטת העברת לייזר (lift)

Info

Publication number
IL253169A0
IL253169A0 IL253169A IL25316917A IL253169A0 IL 253169 A0 IL253169 A0 IL 253169A0 IL 253169 A IL253169 A IL 253169A IL 25316917 A IL25316917 A IL 25316917A IL 253169 A0 IL253169 A0 IL 253169A0
Authority
IL
Israel
Prior art keywords
angled lift
jetting
lift jetting
angled
lift
Prior art date
Application number
IL253169A
Other languages
English (en)
Inventor
Zenou Michael
Kotler Zvi
Original Assignee
Orbotech Ltd
Zenou Michael
Kotler Zvi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orbotech Ltd, Zenou Michael, Kotler Zvi filed Critical Orbotech Ltd
Publication of IL253169A0 publication Critical patent/IL253169A0/he

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • B23K26/342—Build-up welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/048—Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/225—Oblique incidence of vaporised material on substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • General Chemical & Material Sciences (AREA)
IL253169A 2015-01-21 2017-06-25 התזת טיפות מתכת בזוית בשיטת העברת לייזר (lift) IL253169A0 (he)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562105761P 2015-01-21 2015-01-21
PCT/IL2016/050007 WO2016116921A1 (en) 2015-01-21 2016-01-05 Angled lift jetting

Publications (1)

Publication Number Publication Date
IL253169A0 true IL253169A0 (he) 2017-08-31

Family

ID=56416516

Family Applications (1)

Application Number Title Priority Date Filing Date
IL253169A IL253169A0 (he) 2015-01-21 2017-06-25 התזת טיפות מתכת בזוית בשיטת העברת לייזר (lift)

Country Status (7)

Country Link
US (1) US20170306495A1 (he)
EP (1) EP3247529A4 (he)
KR (1) KR20170102984A (he)
CN (1) CN107206548B (he)
IL (1) IL253169A0 (he)
TW (1) TW201639654A (he)
WO (1) WO2016116921A1 (he)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102353254B1 (ko) 2014-08-07 2022-01-18 오르보테크 엘티디. 리프트 인쇄 시스템
WO2016063270A1 (en) 2014-10-19 2016-04-28 Orbotech Ltd. Llift printing of conductive traces onto a semiconductor substrate
EP3247816A4 (en) 2015-01-19 2018-01-24 Orbotech Ltd. Printing of three-dimensional metal structures with a sacrificial support
KR20180030609A (ko) 2015-07-09 2018-03-23 오르보테크 엘티디. Lift 토출 각도의 제어
CN108349120B (zh) 2015-11-22 2020-06-23 奥博泰克有限公司 打印的三维结构的表面性质控制
TW201901887A (zh) * 2017-05-24 2019-01-01 以色列商奧寶科技股份有限公司 於未事先圖樣化基板上電器互連電路元件
EP3521483A1 (en) * 2018-02-06 2019-08-07 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Lift deposition apparatus and method
JP7424093B2 (ja) * 2019-03-08 2024-01-30 株式会社リコー 立体造形物を造形する装置、立体造形物を造形する方法
US12046575B2 (en) 2019-05-01 2024-07-23 Io Tech Group Ltd. Method to electrically connect chip with top connectors using 3D printing
US12162294B2 (en) 2019-05-07 2024-12-10 Orbotech Ltd. Lift printing using thin donor foils
US11446750B2 (en) 2020-02-03 2022-09-20 Io Tech Group Ltd. Systems for printing solder paste and other viscous materials at high resolution
US11622451B2 (en) 2020-02-26 2023-04-04 Io Tech Group Ltd. Systems and methods for solder paste printing on components
EP3893611A1 (en) * 2020-04-07 2021-10-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Controlled deposition method of a donor material onto a target surface and plate therefor
US11497124B2 (en) 2020-06-09 2022-11-08 Io Tech Group Ltd. Methods for printing conformal materials on component edges at high resolution
US11691332B2 (en) 2020-08-05 2023-07-04 Io Tech Group Ltd. Systems and methods for 3D printing with vacuum assisted laser printing machine
CN112916873B (zh) 2021-01-26 2022-01-28 上海交通大学 基于脉冲激光驱动的微滴三维打印系统及方法

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
US6805918B2 (en) 1999-01-27 2004-10-19 The United States Of America As Represented By The Secretary Of The Navy Laser forward transfer of rheological systems
US6792326B1 (en) 1999-05-24 2004-09-14 Potomac Photonics, Inc. Material delivery system for miniature structure fabrication
US7277770B2 (en) 2003-07-15 2007-10-02 Huang Wen C Direct write process and apparatus
US20050095367A1 (en) 2003-10-31 2005-05-05 Babiarz Alec J. Method of noncontact dispensing of viscous material
KR20080039937A (ko) * 2005-09-30 2008-05-07 가부시키가이샤 씽크. 라보라토리 그라비아제판 롤 및 그의 제조방법
US20080084611A1 (en) * 2006-10-05 2008-04-10 Bright View Technologies, Inc. Methods and Apparatus for Creating Apertures Through Microlens Arrays Using Curved Cradles, and Products Produced Thereby
WO2009154156A1 (ja) * 2008-06-16 2009-12-23 東レ株式会社 パターニング方法およびこれを用いたデバイスの製造方法ならびにデバイス
WO2009153792A2 (en) * 2008-06-19 2009-12-23 Utilight Ltd. Light induced patterning
CN102668704A (zh) * 2009-12-03 2012-09-12 东丽株式会社 供体基板、图案化方法和器件的制造方法
KR20120138472A (ko) * 2011-06-15 2012-12-26 삼성디스플레이 주식회사 레이저 열전사 장치, 레이저 열전사 방법, 및 그를 이용한 유기 발광 표시장치의 제조 방법
KR101650830B1 (ko) * 2012-02-23 2016-08-24 에이에스엠엘 네델란즈 비.브이. 디바이스, 리소그래피 장치, 방사선을 안내하는 방법, 및 디바이스 제조 방법
AU2013222069A1 (en) * 2012-02-26 2014-10-16 Solexel, Inc. Systems and methods for laser splitting and device layer transfer
EP2660352A1 (en) * 2012-05-02 2013-11-06 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Donor sheet and method for light induced forward transfer manufacturing
KR102353254B1 (ko) * 2014-08-07 2022-01-18 오르보테크 엘티디. 리프트 인쇄 시스템

Also Published As

Publication number Publication date
EP3247529A1 (en) 2017-11-29
CN107206548B (zh) 2019-08-13
EP3247529A4 (en) 2019-01-16
US20170306495A1 (en) 2017-10-26
CN107206548A (zh) 2017-09-26
KR20170102984A (ko) 2017-09-12
TW201639654A (zh) 2016-11-16
WO2016116921A1 (en) 2016-07-28

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