IL29897A - Method of chemically etching metal articles - Google Patents
Method of chemically etching metal articlesInfo
- Publication number
- IL29897A IL29897A IL29897A IL2989768A IL29897A IL 29897 A IL29897 A IL 29897A IL 29897 A IL29897 A IL 29897A IL 2989768 A IL2989768 A IL 2989768A IL 29897 A IL29897 A IL 29897A
- Authority
- IL
- Israel
- Prior art keywords
- maskant
- block copolymer
- mask
- matrix
- chemical etching
- Prior art date
Links
- 238000005530 etching Methods 0.000 title claims description 33
- 229910052751 metal Inorganic materials 0.000 title claims description 19
- 239000002184 metal Substances 0.000 title claims description 19
- 238000000034 method Methods 0.000 title claims description 10
- 239000000203 mixture Substances 0.000 claims description 54
- 229920001400 block copolymer Polymers 0.000 claims description 42
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 24
- 229920000642 polymer Polymers 0.000 claims description 20
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 19
- 230000009477 glass transition Effects 0.000 claims description 18
- 239000011159 matrix material Substances 0.000 claims description 16
- 238000003486 chemical etching Methods 0.000 claims description 15
- 239000004793 Polystyrene Substances 0.000 claims description 13
- 229920002223 polystyrene Polymers 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 9
- 239000005062 Polybutadiene Substances 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 229920002857 polybutadiene Polymers 0.000 claims description 7
- 239000003513 alkali Substances 0.000 claims description 6
- 229920001577 copolymer Polymers 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 230000000873 masking effect Effects 0.000 claims description 4
- 230000001464 adherent effect Effects 0.000 claims description 2
- 239000003518 caustics Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 150000002430 hydrocarbons Chemical class 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 17
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 238000009472 formulation Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 239000000178 monomer Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 238000013461 design Methods 0.000 description 9
- -1 polyethylenes Polymers 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 239000000806 elastomer Substances 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 229920003048 styrene butadiene rubber Polymers 0.000 description 6
- 229920002554 vinyl polymer Polymers 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 150000001993 dienes Chemical class 0.000 description 4
- 229920005604 random copolymer Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000002174 Styrene-butadiene Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 235000017550 sodium carbonate Nutrition 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- WAEOXIOXMKNFLQ-UHFFFAOYSA-N 1-methyl-4-prop-2-enylbenzene Chemical group CC1=CC=C(CC=C)C=C1 WAEOXIOXMKNFLQ-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- QSOMQGJOPSLUAZ-UHFFFAOYSA-N 2-ethenylbuta-1,3-dienylbenzene Chemical compound C=CC(C=C)=CC1=CC=CC=C1 QSOMQGJOPSLUAZ-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- 229910001250 2024 aluminium alloy Inorganic materials 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 241001120493 Arene Species 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 241000288902 Lemur catta Species 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001253 acrylic acids Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 229920005603 alternating copolymer Polymers 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229940072049 amyl acetate Drugs 0.000 description 1
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- BXCCKEJWQJEUMS-UHFFFAOYSA-N formaldehyde;4-nonylphenol Chemical compound O=C.CCCCCCCCCC1=CC=C(O)C=C1 BXCCKEJWQJEUMS-UHFFFAOYSA-N 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 230000007775 late Effects 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- MYWUZJCMWCOHBA-VIFPVBQESA-N methamphetamine Chemical compound CN[C@@H](C)CC1=CC=CC=C1 MYWUZJCMWCOHBA-VIFPVBQESA-N 0.000 description 1
- 229910021652 non-ferrous alloy Inorganic materials 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 235000015424 sodium Nutrition 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- CMXPERZAMAQXSF-UHFFFAOYSA-M sodium;1,4-bis(2-ethylhexoxy)-1,4-dioxobutane-2-sulfonate;1,8-dihydroxyanthracene-9,10-dione Chemical compound [Na+].O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=CC=C2O.CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC CMXPERZAMAQXSF-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 1
- 235000019801 trisodium phosphate Nutrition 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
Description
/
METHOD OF CHEMICALLY ETCHING METAL. ARTICLES
nana *ian *B; D vip's? no»a?
This invention relates to chemical etching and, more particularly, to improved, maskant composition for use in chemical etching. The invention also relates to improved chemical etching method resulting from the use of such maskant composition.
In chemical etching, material or metal is removed from a surface of a metal article by subjection thereof to an etchin solution to obtain a part having a desired structural or ornamental configuration. In many instances, in order to produce a desired etch configuration on an article in a practical manner, it is necessary to mask certain portions of the surface of the article so as to prevent contact of such surface portions with the etching solution.
A substantial number of organic compounds and resins have been employed as etch maskants by the prior art. These include vinyls, epoxy resins, silicones, polyamides, polyethylenes , and other chemically resistant polymers. These materials, however, are unsatisfactory for a number of reasons, such as . "cob-webbing" or the formation of thin
strands of maskant composition between the application equipment and the part, even when said composition has proper solids content, failure of the mask formed by such composition to withstand the environment of the etching solution, failure of the mask to adhere sufficiently to the substrate or surface of the part, difficulty in removing the mask after completion of the etching process, necessity for use of a primer prior to application of the mask, necessity of exer
tion of the mask, limited pot life of the maskant composition after addition of the accelerator (in the case of those masks requiring an accelerator), necessity of excessive heat treatment in order to complete the curing cycle, necessity for using mask-ing tape and non-reproducibility with respect to general characteristics affecting the operation of the mask. '
the most serious problems encountered in the use of prior maskants are (1) insufficient adhesion of the mask to' the part,. (2) insufficient ( resistance of the mask to the etching solution especially at the edges of the mask, permitting undesirable penetration of the solution between the mask and underlying substrate, (3) inability to be readily strippable from the part after etching, and (4) excessive "cob-webbing" which often accompanies spraying of the maskant composition onto the part.
Further disadvantages of known maskant compositions are the problems they present in achieving adequate chemical resistance and mechanical toughness. Generally in elastomer based maskants, which are. preferred over other materials for minimizing problems noted above, toughness is brought up to required levels by "curing" or advancing elastomer molecular weight through chemical reaction secured between elastomer molecules through use of accelerators or cure agents such as sulfur or sulfur compounds and amine compounds. Nonelastomer based maskant compositions are generally too brittle or otherwise mechanically
29897/2
British Patent No. 1, 097, 150 discloses a maskant composition comprising a matrix consisting essentially of block co-polymers of styrene and butadiene. The maskant composition according to British Patent No. 1, 097, 150 may additionally comprise a small amount of polystyrene. The said British Patent in no way discloses the addition of ^-methyl styrene polymer to the polystyrene-polybutadiene block co-polymer which is a feature of the present invention^ Applicant has discovered , as hereinafter disclosed, that addition of °^-methyl styrene polymer has decided advantages in providing a maskant composition which is superior in adhesion. This is highly important in that adhesion of the mask to the article is necessary to protect against accidental lifting of the mask during scribing, handling and exposure to thermal shock and subsequent outgassing upon initial exposure to hot etchants (e. g. 210°F. ), Secondly, the incompat ability of polystyrene, a3 contrasted with "^-methyl styrene in the maskant has been discovered by applicant in stress-strain test data where the polystyrene compositions at 10 parts per hundred and higher decrease the inherent strength of the maskant to unacceptable levels. ► If polystyrene rather than "^methyl styrene is used as the additive, improvement in adhesion is noticed only when the proportion of additive is 10 parts per hundred or greater. Any adhesion improvement with polystyrene is at such high additive concentrations that the film strength is reduced.
When °^-methyl styrene is used, film strength is not sacrificed and increased adhesion can be accomplished.
In the present invention, it has now been . found that the limitations and disadvantages of prior art niaskants are overcome by the use in chemical etching of the novel maskant compositions hereof which have a matrix consistin ( essentially of (1) a block copolymer composed of styrene and butadiene in the ratio of ^0:60 to 20:80 having a resilience of at least 0 - in the uncured state and having at least , one polystyrene block of a length sufficient for the block copolymer to exhibit a glass transition temperature above about 50° C and a polybutadiene block of a length sufficient for the block copolymer to exhibit a glass transition temperature below about -50° C and a minor proportion of an= -methyl styrene polymer.
The terra "matrix" herein refers to the material x^ithin and throughout which other maskant ingredients such as fillers, if any, are distributed.
By the use of s yrene-butadiene block copolymers, first disclosed herein, as distinguished from random styrene-butadiene copolymers heretofore known, e.g. U.S. P. 3, 22?, 589 to Deutsch manifold benefits are realized. First, because these block copolymers have the chemical resistance and strength typical of the nonelastomer portion, i.e. the polystyrene block and the flexibility and adhesion of the elastomer portion, i.e.' the polybutadiene block in one matrix material there is provided the critical properties needed in a maskant. Secondly, because these strength properties are achieved without the use of cure agents or accelerators, such as are
savings in raw material costs, in material waste due to premature cure, in blending costs, of cure equipment and time and in overall greater uniformity and predictability of results. Therefore, although a cure agent can be present, adequate levels of tensile strength are present for presently known uses of mas-kants In the "uncured" , raw or gum stock block copolymer taught ' herein.
Block copolymers are distinguished in molecular structure from random copolymers. In the latter the two monomer species are in alternating relationship roughly proportional to their ratio in the polymerization system and their reaction rate. In block copolymers on the other hand one monomer species then the other is polymerized so that long homogeneous chains of one monomer species are formed joined to homogeneous chains of the other monomer species. This type of copolymer structure in general is detectable by the presence of two distinct glass transition temperatures for the copolymer, one for each species which approximates the glass transition temperature for the polymer of that monomer alone, whereas an alternating or random copolymer shows but one "compromise" glass transition temperature. For example, the block copolymer employed in the examples herein is composed of blocks of polystyrene and poly-butadiene and exhibits a glass transition temperature at -8^-° C which is closely approximate the published glass transition temperature of polybutadiene homo-polymer and a second glass transition temperature at
glass transition temperature of polystyrene homo-polymer.
As used herein the term "glass transition temperature" refers to that temperature at which molecular movement in a material is so slow that the material appears hard or glasslike, or changes from a soft to a hard, brittle material. Any test measuring the temperature range at which a noncrystalizing liquid becomes brittle will give a good indication of glass transition temperatures. The test described by L. N. Kattas in a paper, "An Evaluation of the Torsion Pendulum in the Accelerated Environmental Testing of Paint Films", presented at the ACS Division of Organic Coatings and Plastics Chemistry, March 1966, provides such a measure.
Another distinguishing characteristics of block copolymers is their resilience or "snap" in the uncured state. The block copolymers, without cure, exhibit a resilience, measured according to ASTM greater than % and often 5 % and higher.
Random copolymers, on the other hand, are μite low in resilience when in the uncured or "gum stock" state, being on the order of only 20 (e.g. SBR 1500 styrene-butadlene random copolymer).
The combination of resilience and chemical resistance afforded by the block copolymers herein makes them superior materials for use in maskants where cohesive strength, to enable peeling from the substrate,, is as important as resistance to etchant chemicals' in etching solutions. It has been found
by the inclusion of a minor proportion, generally at least two parts and preferably between 5 and.20 parts by weight, per 100 parts , by weight of the block copolymer of a polymer of o ~meth l styrene. This polymer preferably has a molecular, weight between 5>000 and lower and 60,000 and higher but this is not .
critical, i
The mask formed by the maskant compositions of the invention has the characteristics of (a) being Impermeable to the etching solutions and (b) adhering at a controlled, or controllable, degree of adhesion sufficient to cause it to adhere to the substrate under the severe conditions of the etching bath;
namely, at elevated temperatures and/or high chemical activity, but which is nevertheless readily removable by hand stripping both before and after etching, yet having, on portions hand, stripped prior to etching, adequate adherence to the part surface at the cut edges of the mask. The invention maskant compositions also possess the advantages of being applicable to the part surface without "cob-webbing", and of being highly inert to chemical etching solutions.
However, the strippable nature of the mask and its chemical resistance to attack by etching solutions, are outstanding properties of the mask produced herein, making such mask particularly adaptable and useful in connection with metal removal by means of etching solutions so as to form structural parts which may have relatively complex con gurations.
The strippable nature of this mask makes it possible
composition on a substrate such as an aluminum alloy, and without curing the composition, the mask may be stripped from the substrate by cutting with a sharp knife or similar instrument and pulling the cut mask from the surface by hand, either before or after etching. This property is of advantage since it. is' possible to coat an entire surface with the mask and then remove the mask from the surface in stages following a plurality of successive etching operations in accordance with a predetermined design. The area which is left masked at each stage is thus defined by sharp lines which are in exact accordance with the desired design. Furthermore, this new mask possesses adhesion such that the boundary between the masked and unmasked area is sharp and definitive even after completion of etching. It is not necessary to perform any additional operation to insure the ad~ hesion of the mask at the boundary between the masked and unmasked areas. Also, employing the present maskant composition a design can be cut in the mask, the part etched to a desired amount, another design cut in the mask and etching continued. In this manner the mask makes it possible to prepare multiple cuts (or etch levels) by chemical etching without the necessity for completely demasking the part after each etching step and remasking to a new design.
The saving in labor and expense is accordingly substantial. Further, the mask can be stripped by hand after completion of etching without resorting to the use of special demasking agents. However, the maskant
demasking materials, should such an operation be desired. .
. It has been found that- to obtain the advantages of the invention, the maskant composition must contain, as the matrix, 5% - 2$% preferably about
% styrene-butadiene block copolymer having a styrene butadiene ratio of from ^0 : 60 to 20 s 80 and preferably about 3*1·: 66 to. '28 : 72 and a minor proportion, generally at least 2 parts by weight based on the block copolymer and preferably 5 t 20 parts of a polymer of
«=^-methyl styrene, per hundred parts of block copolymer preferably having a molecular weight between
, 000 and 60 , 000 . To this matrix there can be added other materials, generally known to be useful in ' maskants for chemical etching. The balance of the composition is made up of organic solvent, e.g. from 50% to 0% by weight solvent. Useful solvents include aliphatic and aromatic hydrocarbons and their halogenated derivatives as well as esters. Specific solvents are aromatic hydrocarbons such as toluene, benzene and chlorinated aromatic hydrocarbons such as chlorobenzene, aliphatic hydrocarbons such as hexane, and aliphatic esters such as alkyl esters of lower carboxylic acids, e.g. butyl and amyl
acetate.
As with maskant compositions heretofore known it is desirable to employ small amounts of phenolic resin, generally 0 . 25 to 10 by weight, based on the total composition, to control the specific degree of adhesion and peelability. Among
larly alkylphenol such as nonylphenol formaldehyde resins are preferred. Used in conjunction with the phenolic resin is a small .amount of metal oxide, preferably an alkaline earth metal oxide such as magnesium or zinc oxide in amounts of 0.025 to \% by weight based on the total composition proportioned to the amount of phenolic resin employed
A variety of fillers and extenders can also be employed to reduce cost and modify certain properties. For example, clays including organic, e.g. amine coated clays, carbon black, silicas and talc can be incorporated in the matrix.
Accelerators and cure agents are not required but can be used, as explained above.
While the preparation of the block copolymer does not form a part of the present invention, it may be stated that there are several routes to their preparation. For example these block copolymers can be prepared by the use of lithium based initiators either in polar or honpolar solvents dependent on the structure Of the conjugated diene polymer blocks desired. The lithium based catalysts include lithium metal, alkyl lithiums and dilithiums with alkyl lithiums such as butyl lithium up to octyl and like alkyl lithiums being preferred. Polymerization is carried out by alternate feeding of styrene and butadiene monomer into the reaction system for a time and at a rate predetermined to provide the desired chain lengths of the two monomer species. Alternatively, preformed chains may be connected through a
as a divinylstyrene.
Other, copolymerizable monomers can be incorporated in the s yrene-butadiene block copolymers. In general, any vinyl unsaturated compound and conjugated diene can be incorporated in the block copolymer. For example In addition to polystyrene poly (vinyl) blocks can include polymers and copolymers of vinyl monomers such as vinyl arenes, e.g. vinyl toluene, vinyl xylene, ethyl vinyl benzene and vinyl naphthalene, vinyl pyridine, vinyl halides and vinyl carboxy'lates , as well as acrylic monomers such as acrylonitrile, methacrylonitrile, esters of acrylic acids and the like. Poly (diene) blocks can be prepared from such conjugated dienes as isoprene, copolymers of styrene and butadiene and homologues thereof in addition to butadiene.
As stated above the block copolymers useful herein exhibit two distinct glass transition temperatures one above 50° C and one below -50° C. Molecular weight of copolymer constituents sufficient to provide these glass transition values are in general a polystyrene block of at least 5,0.00 and preferably
,000 to 100,000 and more and a polybutadiene block of at least 15,000 and preferably 25,000 to 150,000 and more.
The components of the maskant composition may be mixed or blended in any desired manner. At this point another advantage' of the block copolymers based maskants is seen. With conventional elastomer based maskants it has been the practice in preparing
of the polymer by milling on suitable milling equip-:' ment, such as a Banbury mill. This millin step to insure proper dispersion of other maskant ingredients is not necessary with the elastomer matrix of the present invention since the block copolymer readily dissolves in, e.g. toluene affording an ease of mixing heretofore unknown in maskant preparation.
The c'ompositlon can be made in varying viscosity ranges depending particularly on the amount of solvent incorporated in the formulation and the relative proportions of block polymer present, and ^.the formulation can be stored or applied immediately to the surface of the article to be coated.
The above maskant composition can be applied to the substrate or metal surface in any suitable manner such as by spraying, brushing, flow coating, dipping, silk screening or any other conventional method for applying paints, lacquers or coatings. Although the novel maskant formulation is particularly suited for use on aluminum and its alloys as substrates, it is to be understood that such formulation can also be employed on other materials such as ferrous and other non-ferrous alloys to protect certain areas thereof from corrosion by etching solu- . tions. Hence, the formulation is alkali resistant and is. also resistant, to non-oxidizing acids and to oxidizing acids when sufficiently dilute and at moderately elevated temperature.
After application of the maskant composition to the substrate, the coating is dried to a continuous
tion to cause the uncovered or exposed, surfaces of the part to be etched or corroded by the etching solution to the desired depth and to form the desired etch pattern or configuration. Generally the masking composition is initially applied to the entire sur-face of the part, and the mask cut and hand stripped in accordance with a pre-selected design, to uncover or expose a surface portion of the part corresponding to said design. This can be accomplished with or without a template. '
Various types of etching solutions, acidic or alkaline, can be employed for etching the exposed surface of the part adjacent the mask, depending on the nature of the metal to be etched. For example, in the case of aluminum and its alloys, which are alkali soluble, a hot aqueous etching solution is generally employed containing an alkali such as sodium or potassium hydroxide, trisodium phosphate, soda ash or the like, or mixtures thereof, preferably sodium hydroxide solution. Temperature is generally maintained in a range say from 100° F to about boiling, although lower temperatures can be. used. Generally the alkali concentration employed in such solutions ranges from 0.1 to 10 normal.
It is noteworthy that the mask using the present maskant compositions is highly resistant to alkaline and acid etchants, and forms a tight bond with the surface of the substrate' substantially with-out the formation of capillary openings between the mask and the substrate or surface covered, especially
etching solution is unable to pass into the inter- · face between the substrate and the mask, and the mask is as resistant to etching solution along its edges as it is on its top surface. Another outstand ing advantage of the mask is that while it is tightly adherent to the substrate and resistant to the etching solution as pointed out above, on comple tion of etching the mask is readily strippable from the substrate without the need for special stripping agents.
Particularly when aluminum or its alloys ' are to be coated with the maskant for etching, the metal surface is preferably cleaned. Ordinarily these metals contain a thin surface coating or film of oil with dirt particles in the oil film. Treatment of such surface with a mild alkaline cleaner such as a mixture of silicates, phosphates, soda ash, and wetting agents, removes this oil-dirt fiD-m. If the metal surface has grease thereon, this can be removed by treatment in a solvent such as tetra-chloroethylene prior to treatment with the alkaline cleaner.
The following examples are illustrative of practive of the invention.
EXAMPLE 1
All parts and percentages by weight herein unless other wise stated. .
A block copolymer of styrene and butadiene in a ratio of 31/69 exhibiting glass transition
silience according to ASTil D-945 of about 60$ was prepared by first polymerizing butadiene in the presence of butyl lithium catalyst in hexane solven and, following substantially completely polymerizing the butadiene, styrene is added and substantially com-pletely polymerized, and alternating in this manner until sufficient molecular weight is achieved.
The maskant matrix was prepared by dis- · solving 100 parts of the block copolymer in 450 -parts of toluene and addingoC-methyl styrene polymer
(Amoco Resin #18) at 10 parts styrene polymer per 100 parts block copolymer. There was then added to the matrix about 14 parts of nonylphenol~formaldehyde resin (Bakellte CKR 163 ) and 1.4 parts of magnesium oxide per 100 parts of the block copolymer. Clay and' talc were added. in amounts of 75 and 40 parts, respectively per 100 parts of the block copolymer. The resulting mixture was used as a maskant composition. The absence of an accelerator is to be noted.
A 2024 aluminum alloy part was treated in noncorrosive alkaline cleaner and the part rinsed in water. The maskant composition consisting of the above mixture was coated onto the surface of the aluminum alloy part to form a coating about 0.0005 inch thick. A design was cut into the surface of the mask, and the cut portion of the mask vias removed by hand stripping, leaving an exposed surface portion corresponding to the design to be etched.
The part was Immersed, without mask cure, in a ll^ caustic alkali solution at a temperature of
depth in the exposed areas, the part was removed from the solution. It was observed that the mask was still tightly bonded to the part surface and particularly that the edges of the mask were still clean and sharp with no noticeable etching deterioration thereof, and that such edges were tightly bonded to the substrate. The mask was then peeled from the substrate by first inserting a sharp edged instrument beneath an edge of the mask, the mask thereafter being readily peelable from the part surface.
EXAMPLE 2
The same maskant composition is prepared as in Example 1, except 2 parts styrene polymer is used instead of 10 , the difference being made up by increasing the toluene. After application to the parts and treatment as set forth in Example 1, the resulting mask is found to have adequate chemical resistance and to be otheriise satisfactory.
■ EXAMPLE 3
Using the procedures of Example 1, a maskant composition . is prepared but using 20 parts of eC-methyl styrene polymer. Adhesion to the aluminum part is satisfactory and chemical resistance outstanding.
CONTROL 1
Example 1 is duplicated but using a random styrene-butadiene copolymer SBR 1500, having approximately the same monomer ratio as the block copolymer used in Example 1, a resilience of 28% and a single
to the Ingredients recited in Example 1 there is added to a portion of the formulation, denoted "B", ,an accelerator in aldehyde amine known as Accelerator 833 · Formulation B was divided and a portion cured at 225-300° F. The. other portion was air dried. All compositions are coated onto panels and tested for effectiveness. Only the cured portion of formulation B is equivalent in performance to the mask of Example 1 illustrating that the compositions of the present invention are equal to cured versions of the prior art even without cure agents or cure steps and superior to uncured formulations previously known.
EXAMPLE
Example 1 is duplicated employin a 60 0 ratio block copolymer. Resilience is lessened to about % but chemical resistance is. somewhat enhanced in chemical etching tests.
EXAMPLE 5
Example 1 is duplicated employing an 80/20 ratio block copolymer. Adequate adhesion is realized with sufficient cohesive strength to permit peeling before and after immersion in the etching solution.
EXAMPLE 6
Example 1 is duplicated but using various and etched metals as substrates including steel, stainless steel, copper and the like. Good adhesion and chemical resistance with easy peel is obtained from the maskant formulation.
EXAMPLE 7
The formulation of Example 1 is modified by addition of aldehyde amine an accelerator, Accele rator 833 (du Pont) and curing for two hours at 225° F. No difference in performance over the Example 1 formulation, uncured, is noted, showing the lack of cure of the block copolymers taught herein.
Claims (8)
1. A method of chemically etching metal articles including the steps of masking selected portions of the surface of the metal article with an adherent layer of a maskant composition having a matrix consisting essentially of a block copolymer having a resilience of at least 40% in the uncured state com-posed of styrene and butadiene in the, ratio of 40:60 to 20:80 and having at least one polystyrene block of a length sufficient for the block copolymer to exhibit a glass transition temperature about 50° C and at least one polybutadiene block of a length sufficient for the block copolymer to exhibit a glass transition temperature below -50° C the matrix comprising a minor proportion, at least 2 parts by weight per 100 parts of the block copolymer, of -methyl styrene polymer, and sub jecting the masked metal article to a chemical etching solution.
2. A method according to claim 1, wherein masking selected portions of the metal article surface includes the steps of applying to the surface a solution in a liquid hydrocarbon solvent of the maskant matrix, evaporating the solvent therefrom, scribing the desired pattern in the maskant and removing the scribed maskant in surface areas to be Subjected to chemical etching solution.
3. A method according to claim 2, wherein the applied maskant matrix copolymer solution contains 5 to 25% by weight of the block copolymer and the solvent . „ 29897/2
4. ; A method according to claim 1, 2 or 3, including maintaining the maskant uncured following application and through treatment of the metal article with the chemical etching solution.
5. A method according to claim 1 , 2, 3, or 4, wherein, the metal of the article is aluminum and the chemical etching solutio is hot caustic alkali. .
6. A metal article suitable for chemical etching have a surface and adhering thereto on selected portions thereof a maskant composition having a matrix consisting essentially of a block copolymer composed of styrene and butadiene in a ration of 40:60 to 20:80 having a resilience of at least 40%, in the uncured state and having at least one polystyrene block of a length sufficient for the block copolymer to exhibit a glass transition temperature about 50° G and at least one polybutadiene block of a length sufficient for the block copolymer to exhibit a glass transition temperature below -50° C the matrix also comprising a minor proportion, at least 2 parts by weight per 100 parts of the block copolymer, of °( -methyl styrene polymer.
7. An article according to claim 6, wherein the metal is aluminum.
8. A chemical etching maskant composition substantially as herein described in any one of the accompanying Examples 1 to 7. S. HOROWITZ ύ AGENTS FOR APPLICANTS
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IL29897A IL29897A (en) | 1968-04-28 | 1968-04-28 | Method of chemically etching metal articles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IL29897A IL29897A (en) | 1968-04-28 | 1968-04-28 | Method of chemically etching metal articles |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL29897A0 IL29897A0 (en) | 1968-06-20 |
| IL29897A true IL29897A (en) | 1972-01-27 |
Family
ID=11044438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL29897A IL29897A (en) | 1968-04-28 | 1968-04-28 | Method of chemically etching metal articles |
Country Status (1)
| Country | Link |
|---|---|
| IL (1) | IL29897A (en) |
-
1968
- 1968-04-28 IL IL29897A patent/IL29897A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| IL29897A0 (en) | 1968-06-20 |
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