IL43636A - Plastic-metal laminate and a method for its manufacture - Google Patents

Plastic-metal laminate and a method for its manufacture

Info

Publication number: IL43636A
Authority: IL; Israel
Prior art keywords: substrate; solution; metal; silane; organic silicon
Prior art date: 1973-03-23

Application number

IL43636A

Other languages

English (en)

Other versions

IL43636A0 (en

Original Assignee

Macdermid Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1973-03-23

Filing date

1973-11-15

Publication date

1977-05-31

1973-11-15 Application filed by Macdermid Inc filed Critical Macdermid Inc

1974-03-14 Publication of IL43636A0 publication Critical patent/IL43636A0/xx

1977-05-31 Publication of IL43636A publication Critical patent/IL43636A/en

Links

238000000034 method Methods 0.000 title claims description 29
229910052751 metal Inorganic materials 0.000 title claims description 27
239000002184 metal Substances 0.000 title claims description 27
238000004519 manufacturing process Methods 0.000 title description 4
239000000758 substrate Substances 0.000 claims description 47
239000000243 solution Substances 0.000 claims description 22
239000004033 plastic Substances 0.000 claims description 21
239000011888 foil Substances 0.000 claims description 19
BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 16
229910000077 silane Inorganic materials 0.000 claims description 16
238000000151 deposition Methods 0.000 claims description 10
150000003377 silicon compounds Chemical class 0.000 claims description 10
230000008021 deposition Effects 0.000 claims description 7
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
229910052802 copper Inorganic materials 0.000 claims description 5
239000010949 copper Substances 0.000 claims description 5
238000007747 plating Methods 0.000 claims description 5
NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 4
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
230000003213 activating effect Effects 0.000 claims description 4
230000004913 activation Effects 0.000 claims description 4
239000007864 aqueous solution Substances 0.000 claims description 4
229910052710 silicon Inorganic materials 0.000 claims description 4
239000010703 silicon Substances 0.000 claims description 4
125000003277 amino group Chemical group 0.000 claims description 3
230000008569 process Effects 0.000 claims description 3
229910052782 aluminium Inorganic materials 0.000 claims description 2
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
229910017052 cobalt Inorganic materials 0.000 claims description 2
239000010941 cobalt Substances 0.000 claims description 2
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
239000003822 epoxy resin Substances 0.000 claims 3
229920000647 polyepoxide Polymers 0.000 claims 3
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 2
238000011065 in-situ storage Methods 0.000 claims 2
SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims 1
239000002991 molded plastic Substances 0.000 claims 1
PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 claims 1
238000000489 vacuum metal deposition Methods 0.000 claims 1
229910000679 solder Inorganic materials 0.000 description 6
238000005476 soldering Methods 0.000 description 6
150000004756 silanes Chemical class 0.000 description 5
150000003376 silicon Chemical class 0.000 description 5
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
230000035939 shock Effects 0.000 description 3
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
239000004020 conductor Substances 0.000 description 2
238000007772 electroless plating Methods 0.000 description 2
230000006872 improvement Effects 0.000 description 2
239000000203 mixture Substances 0.000 description 2
229910052759 nickel Inorganic materials 0.000 description 2
239000002245 particle Substances 0.000 description 2
239000000126 substance Substances 0.000 description 2
102100028255 Renin Human genes 0.000 description 1
108090000783 Renin Proteins 0.000 description 1
239000002253 acid Substances 0.000 description 1
239000012190 activator Substances 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000000996 additive effect Effects 0.000 description 1
239000002318 adhesion promoter Substances 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
229910001854 alkali hydroxide Inorganic materials 0.000 description 1
150000008044 alkali metal hydroxides Chemical class 0.000 description 1
229910000147 aluminium phosphate Inorganic materials 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
239000002131 composite material Substances 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
230000002349 favourable effect Effects 0.000 description 1
239000000945 filler Substances 0.000 description 1
125000001153 fluoro group Chemical group F* 0.000 description 1
239000003365 glass fiber Substances 0.000 description 1
238000010030 laminating Methods 0.000 description 1
239000000463 material Substances 0.000 description 1
238000002156 mixing Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
238000012986 modification Methods 0.000 description 1
238000000465 moulding Methods 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
239000011347 resin Substances 0.000 description 1
229920005989 resin Polymers 0.000 description 1
239000004576 sand Substances 0.000 description 1
238000000926 separation method Methods 0.000 description 1
239000007787 solid Substances 0.000 description 1
239000002904 solvent Substances 0.000 description 1
238000010561 standard procedure Methods 0.000 description 1
238000012876 topography Methods 0.000 description 1
-1 trimethoxy silane trimethoxy silane silane Chemical compound 0.000 description 1
HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
238000009736 wetting Methods 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0019—Circuit arrangements
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/22—Nickel or cobalt
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2363/00—Epoxy resins

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Chemically Coating (AREA)
Laminated Bodies (AREA)
Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
Manufacture Of Macromolecular Shaped Articles (AREA)
Lining Or Joining Of Plastics Or The Like (AREA)
Manufacturing Of Printed Wiring (AREA)

IL43636A 1973-03-23 1973-11-15 Plastic-metal laminate and a method for its manufacture IL43636A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US34427973A	1973-03-23	1973-03-23

Publications (2)

Publication Number	Publication Date
IL43636A0 IL43636A0 (en)	1974-03-14
IL43636A true IL43636A (en)	1977-05-31

Family

ID=23349833

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IL43636A IL43636A (en)	1973-03-23	1973-11-15	Plastic-metal laminate and a method for its manufacture

Country Status (9)

Country	Link
JP (1)	JPS49122578A (fr)
BE (1)	BE809664A (fr)
DE (1)	DE2405428A1 (fr)
ES (1)	ES421981A1 (fr)
FR (1)	FR2222458B3 (fr)
GB (1)	GB1422885A (fr)
IL (1)	IL43636A (fr)
IT (1)	IT1008131B (fr)
NL (1)	NL7316711A (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4303798A (en) *	1979-04-27	1981-12-01	Kollmorgen Technologies Corporation	Heat shock resistant printed circuit board assemblies

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
IL43087A (en) *	1972-11-03	1976-11-30	Macdermid Inc	Metal-plastic laminates and their manufacture

1973
- 1973-11-15 IL IL43636A patent/IL43636A/en unknown
- 1973-11-21 GB GB5392673A patent/GB1422885A/en not_active Expired
- 1973-12-06 NL NL7316711A patent/NL7316711A/xx unknown
1974
- 1974-01-03 ES ES421981A patent/ES421981A1/es not_active Expired
- 1974-01-04 FR FR7400370A patent/FR2222458B3/fr not_active Expired
- 1974-01-11 BE BE139744A patent/BE809664A/fr unknown
- 1974-01-15 IT IT47723/74A patent/IT1008131B/it active
- 1974-01-24 JP JP49010576A patent/JPS49122578A/ja active Pending
- 1974-02-01 DE DE19742405428 patent/DE2405428A1/de active Pending

Also Published As

Publication number	Publication date
FR2222458A1 (fr)	1974-10-18
FR2222458B3 (fr)	1976-10-22
JPS49122578A (fr)	1974-11-22
BE809664A (fr)	1974-07-11
AU6274573A (en)	1975-05-22
NL7316711A (fr)	1974-09-25
IT1008131B (it)	1976-11-10
GB1422885A (en)	1976-01-28
ES421981A1 (es)	1976-08-01
IL43636A0 (en)	1974-03-14
DE2405428A1 (de)	1974-10-03

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US3978252A (en)	1976-08-31	Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon
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US3698940A (en)	1972-10-17	Method of making additive printed circuit boards and product thereof
US3854973A (en)	1974-12-17	Method of making additive printed circuit boards
EP0053279B1 (fr)	1985-07-24	Procédé de préparation d'un circuit imprimé
US3959523A (en)	1976-05-25	Additive printed circuit boards and method of manufacture
US4774122A (en)	1988-09-27	Resinous product provided with surface coatable with metal layer bonded through an array of microdendrites and metal-clad resinous product thereof
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SU893136A3 (ru)	1981-12-23	Каталитический лак дл изготовлени печатных схем
US4428986A (en)	1984-01-31	Method of preparing a beryllia substrate for subsequent autocatalytic deposition of a metallized film directly thereon
JPS6227393A (ja)	1987-02-05	セラミツク基材に銅膜を形成する方法
KR950005315B1 (ko)	1995-05-23	도금용 폴리페닐렌 설파이드 수지 조성물
US4100312A (en)	1978-07-11	Method of making metal-plastic laminates
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US5342654A (en)	1994-08-30	Surface roughening of resin molded articles for metallizing
US3864147A (en)	1975-02-04	Method of improving the bonding capability of polymer surfaces for subsequently applied coatings, and products thereof
US3668082A (en)	1972-06-06	Method for strongly adhering a metal film on epoxy substrates
JPS6314880A (ja)	1988-01-22	金属メツキ処理方法
US3905877A (en)	1975-09-16	Process for electroplating polyoxymethylene
US4842899A (en)	1989-06-27	Process for forming metallic film on inorganic material
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