IL75877A0 - Lead frame taping method and device - Google Patents

Lead frame taping method and device

Info

Publication number
IL75877A0
IL75877A0 IL75877A IL7587785A IL75877A0 IL 75877 A0 IL75877 A0 IL 75877A0 IL 75877 A IL75877 A IL 75877A IL 7587785 A IL7587785 A IL 7587785A IL 75877 A0 IL75877 A0 IL 75877A0
Authority
IL
Israel
Prior art keywords
lead frame
taping method
frame taping
lead
taping
Prior art date
Application number
IL75877A
Other languages
English (en)
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of IL75877A0 publication Critical patent/IL75877A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/435—Shapes or dispositions of insulating layers on leadframes, e.g. bridging members
IL75877A 1984-07-23 1985-07-22 Lead frame taping method and device IL75877A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US63334484A 1984-07-23 1984-07-23

Publications (1)

Publication Number Publication Date
IL75877A0 true IL75877A0 (en) 1985-11-29

Family

ID=24539266

Family Applications (1)

Application Number Title Priority Date Filing Date
IL75877A IL75877A0 (en) 1984-07-23 1985-07-22 Lead frame taping method and device

Country Status (5)

Country Link
JP (1) JPS6136960A (it)
FR (1) FR2568059A1 (it)
GB (1) GB8518468D0 (it)
IL (1) IL75877A0 (it)
IT (1) IT1185286B (it)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61296749A (ja) * 1985-06-25 1986-12-27 Toray Silicone Co Ltd 半導体装置用リードフレームの製造方法
EP0213014B1 (en) * 1985-07-23 1990-09-19 Fairchild Semiconductor Corporation Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate
US4796080A (en) * 1987-07-23 1989-01-03 Fairchild Camera And Instrument Corporation Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate
JPH0226479Y2 (it) * 1987-08-28 1990-07-18
JPH0341679Y2 (it) * 1988-12-01 1991-09-02
JPH02170457A (ja) * 1988-12-22 1990-07-02 Hitachi Cable Ltd 半導体装置用リードフレームとそれに使用される押えテープ
US5098863A (en) * 1990-11-29 1992-03-24 Intel Corporation Method of stabilizing lead dimensions on high pin count surface mount I.C. packages

Also Published As

Publication number Publication date
JPS6136960A (ja) 1986-02-21
FR2568059A1 (fr) 1986-01-24
IT8521638A0 (it) 1985-07-19
IT1185286B (it) 1987-11-04
GB8518468D0 (en) 1985-08-29

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