IL83901A - Piazzo-electric detector element - Google Patents

Piazzo-electric detector element

Info

Publication number: IL83901A
Authority: IL; Israel
Prior art keywords: gold; piezoelectric; germanium; layers; sensing element
Prior art date: 1986-10-22

Application number

IL8390187A

Other languages

English (en)

Hebrew (he)

Original Assignee

Singer Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-10-22

Filing date

1987-09-15

Publication date

1994-08-26

1987-09-15 Application filed by Singer Co filed Critical Singer Co

1994-08-26 Publication of IL83901A publication Critical patent/IL83901A/en

Links

BYDQGSVXQDOSJJ-UHFFFAOYSA-N [Ge].[Au] Chemical compound [Ge].[Au] BYDQGSVXQDOSJJ-UHFFFAOYSA-N 0.000 claims description 44
238000000034 method Methods 0.000 claims description 20
238000010438 heat treatment Methods 0.000 claims description 13
238000000151 deposition Methods 0.000 claims description 10
238000005452 bending Methods 0.000 claims description 7
238000004544 sputter deposition Methods 0.000 claims description 7
229910052732 germanium Inorganic materials 0.000 claims description 5
238000001514 detection method Methods 0.000 claims description 2
239000011521 glass Substances 0.000 claims description 2
229910052751 metal Inorganic materials 0.000 claims description 2
239000002184 metal Substances 0.000 claims description 2
229910000927 Ge alloy Inorganic materials 0.000 claims 3
238000002844 melting Methods 0.000 claims 3
230000008018 melting Effects 0.000 claims 3
239000000463 material Substances 0.000 description 21
229910045601 alloy Inorganic materials 0.000 description 17
239000000956 alloy Substances 0.000 description 17
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
230000005496 eutectics Effects 0.000 description 6
229910052737 gold Inorganic materials 0.000 description 5
239000010931 gold Substances 0.000 description 5
GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 4
230000010287 polarization Effects 0.000 description 4
239000004593 Epoxy Substances 0.000 description 3
230000008859 change Effects 0.000 description 3
238000005304 joining Methods 0.000 description 3
238000005259 measurement Methods 0.000 description 3
230000035945 sensitivity Effects 0.000 description 3
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
238000006664 bond formation reaction Methods 0.000 description 2
230000006835 compression Effects 0.000 description 2
238000007906 compression Methods 0.000 description 2
239000004020 conductor Substances 0.000 description 2
239000011888 foil Substances 0.000 description 2
229910052709 silver Inorganic materials 0.000 description 2
239000004332 silver Substances 0.000 description 2
235000012431 wafers Nutrition 0.000 description 2
229910000497 Amalgam Inorganic materials 0.000 description 1
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
230000001133 acceleration Effects 0.000 description 1
238000004026 adhesive bonding Methods 0.000 description 1
238000013459 approach Methods 0.000 description 1
239000004568 cement Substances 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
238000001816 cooling Methods 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000010949 copper Substances 0.000 description 1
230000008021 deposition Effects 0.000 description 1
238000010586 diagram Methods 0.000 description 1
238000009792 diffusion process Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
229920006333 epoxy cement Polymers 0.000 description 1
239000007788 liquid Substances 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
229910052753 mercury Inorganic materials 0.000 description 1
CBBVHSHLSCZIHD-UHFFFAOYSA-N mercury silver Chemical compound [Ag].[Hg] CBBVHSHLSCZIHD-UHFFFAOYSA-N 0.000 description 1
239000007769 metal material Substances 0.000 description 1
230000005012 migration Effects 0.000 description 1
238000013508 migration Methods 0.000 description 1
239000000203 mixture Substances 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
238000003825 pressing Methods 0.000 description 1
230000008569 process Effects 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1
239000007787 solid Substances 0.000 description 1
238000006467 substitution reaction Methods 0.000 description 1
229910052715 tantalum Inorganic materials 0.000 description 1
239000013598 vector Substances 0.000 description 1
235000012773 waffles Nutrition 0.000 description 1

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Gyroscopes (AREA)
Measuring Fluid Pressure (AREA)
Transmission And Conversion Of Sensor Element Output (AREA)
Force Measurement Appropriate To Specific Purposes (AREA)
Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

IL8390187A 1986-10-22 1987-09-15 Piazzo-electric detector element IL83901A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US06/921,520 US4769882A (en)	1986-10-22	1986-10-22	Method for making piezoelectric sensing elements with gold-germanium bonding layers

Publications (1)

Publication Number	Publication Date
IL83901A true IL83901A (en)	1994-08-26

Family

ID=25445555

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IL8390187A IL83901A (en)	1986-10-22	1987-09-15	Piazzo-electric detector element

Country Status (8)

Country	Link
US (1)	US4769882A (fr)
EP (1)	EP0265090B1 (fr)
JP (1)	JPS63190391A (fr)
AU (1)	AU595071B2 (fr)
CA (1)	CA1317478C (fr)
DE (1)	DE3771831D1 (fr)
IL (1)	IL83901A (fr)
NO (1)	NO178317C (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
SU1642962A3 (ru) *	1989-06-16	1991-04-15	Е.И.Новиков	Пьезочастотный датчик силы
JP3039971B2 (ja) *	1989-09-19	2000-05-08	株式会社日立製作所	接合型圧電装置及び製造方法並びに接合型圧電素子
FR2693795B1 (fr) *	1992-07-15	1994-08-19	Commissariat Energie Atomique	Jauge de contrainte sur support souple et capteur muni de ladite jauge.
US6484585B1 (en)	1995-02-28	2002-11-26	Rosemount Inc.	Pressure sensor for a pressure transmitter
US5755909A (en) *	1996-06-26	1998-05-26	Spectra, Inc.	Electroding of ceramic piezoelectric transducers
US6164140A (en) *	1998-10-09	2000-12-26	Kalinoski; Richard W.	Solid state transducer for Coriolis flowmeter
US6520020B1 (en)	2000-01-06	2003-02-18	Rosemount Inc.	Method and apparatus for a direct bonded isolated pressure sensor
DE60108217T2 (de)	2000-01-06	2005-12-29	Rosemount Inc., Eden Prairie	Kornwachstumsverfahren zur herstellung einer elektrischen verbindung für mikroelektromechanische systeme (mems)
US6505516B1 (en)	2000-01-06	2003-01-14	Rosemount Inc.	Capacitive pressure sensing with moving dielectric
US6561038B2 (en)	2000-01-06	2003-05-13	Rosemount Inc.	Sensor with fluid isolation barrier
US6508129B1 (en) *	2000-01-06	2003-01-21	Rosemount Inc.	Pressure sensor capsule with improved isolation
JP2002144239A (ja) *	2000-11-08	2002-05-21	Alps Engineering:Kk	ノズル
US6672168B2 (en)	2001-09-24	2004-01-06	Andrew Braugh	Multi-level machine vibration tester marker pen
US6848316B2 (en)	2002-05-08	2005-02-01	Rosemount Inc.	Pressure sensor assembly
WO2004023572A1 (fr) *	2002-08-30	2004-03-18	Usc Corporation	Generateur piezoelectrique
US7548012B2 (en) *	2003-09-17	2009-06-16	Kistler Holding, Ag	Multi-layer piezoelectric measuring element, and pressure sensor or force sensor comprising such a measuring element
JP3866258B2 (ja) *	2004-08-24	2007-01-10	太平洋セメント株式会社	圧電デバイスおよびこれを備える圧電スイッチ
JP2009534651A (ja) *	2006-04-20	2009-09-24	ヴェクトロンインターナショナル，インク	高圧環境用の電気音響センサ
US8073640B2 (en) *	2009-09-18	2011-12-06	Delaware Capital Formation Inc.	Controlled compressional wave components of thickness shear mode multi-measurand sensors
WO2020194026A1 (fr) *	2019-03-23	2020-10-01	Secretary, Department Of Atomic Energy	Liaison par diffusion d'un cristal piézoélectrique à une plaque d'usure métallique
CN110379916B (zh) *	2019-07-05	2020-10-27	中国科学院物理研究所	压电陶瓷元件的制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2709147A (en) *	1951-09-12	1955-05-24	Bell Telephone Labor Inc	Methods for bonding silica bodies
US3179826A (en) *	1961-09-14	1965-04-20	Trott Winfield James	Piezolelectric assembly
AT237930B (de) *	1962-09-12	1965-01-11	Hans Dipl Ing Dr Techn List	Piezoelektrische Einrichtung, insbesondere zur Kraftmessung, und Verfahren zu ihrer Herstellung
US3590467A (en) *	1968-11-15	1971-07-06	Corning Glass Works	Method for bonding a crystal to a solid delay medium
FR2182295A5 (fr) *	1972-04-25	1973-12-07	Thomson Csf
US3897628A (en) *	1973-11-19	1975-08-05	Rca Corp	Method of forming a thin piezoelectric body metallically bonded to a propagation medium crystal
US3986251A (en) *	1974-10-03	1976-10-19	Motorola, Inc.	Germanium doped light emitting diode bonding process
US4042951A (en) *	1975-09-25	1977-08-16	Texas Instruments Incorporated	Gold-germanium alloy contacts for a semiconductor device
US4109031A (en) *	1976-12-27	1978-08-22	United Technologies Corporation	Stress relief of metal-ceramic gas turbine seals
US4078711A (en) *	1977-04-14	1978-03-14	Rockwell International Corporation	Metallurgical method for die attaching silicon on sapphire devices to obtain heat resistant bond
US4295373A (en) *	1980-04-03	1981-10-20	United Technologies Corporation	Fluidic angular rate sensor with integrated impulse jet pump assembly
JPS59145583A (ja) *	1983-02-09	1984-08-21	Matsushita Electric Ind Co Ltd	積層型圧電変位素子

1986
- 1986-10-22 US US06/921,520 patent/US4769882A/en not_active Expired - Lifetime
1987
- 1987-09-15 IL IL8390187A patent/IL83901A/en not_active IP Right Cessation
- 1987-09-23 CA CA000547658A patent/CA1317478C/fr not_active Expired - Fee Related
- 1987-09-25 EP EP87308529A patent/EP0265090B1/fr not_active Expired - Lifetime
- 1987-09-25 DE DE8787308529T patent/DE3771831D1/de not_active Expired - Fee Related
- 1987-10-07 AU AU79440/87A patent/AU595071B2/en not_active Ceased
- 1987-10-21 NO NO874390A patent/NO178317C/no unknown
- 1987-10-22 JP JP62267591A patent/JPS63190391A/ja active Granted

Also Published As

Publication number	Publication date
NO874390L (no)	1988-04-25
DE3771831D1 (de)	1991-09-05
AU595071B2 (en)	1990-03-22
EP0265090A3 (en)	1988-09-21
US4769882A (en)	1988-09-13
JPH0346991B2 (fr)	1991-07-17
CA1317478C (fr)	1993-05-11
EP0265090A2 (fr)	1988-04-27
EP0265090B1 (fr)	1991-07-31
NO178317C (no)	1996-02-28
NO178317B (no)	1995-11-20
JPS63190391A (ja)	1988-08-05
NO874390D0 (no)	1987-10-21
AU7944087A (en)	1988-04-28

Legal Events

Date	Code	Title	Description
1998-09-24	RH	Patent void

Publication	Publication Date	Title
US4769882A (en)	1988-09-13	Method for making piezoelectric sensing elements with gold-germanium bonding layers
JP4890708B2 (ja)	2012-03-07	デュアルウエハー付設法
US6424017B2 (en)	2002-07-23	Silicon-on-sapphire transducer
US3800264A (en)	1974-03-26	High temperature transducers and housing including fabrication methods
EP0580025B1 (fr)	1998-12-30	Résonateur piézoélectrique et son procédé de fabrication
EP0982576B1 (fr)	2010-05-19	Capteur et son procede de production
JPWO1999046570A1 (ja)	2001-01-09	センサおよびその製造方法
EP0667532B1 (fr)	2003-11-26	Détecteur à couche mince et procédé pour sa fabrication
US4848643A (en)	1989-07-18	Process of bonding plates
US3930823A (en)	1976-01-06	High temperature transducers and housing including fabrication methods
US6691581B2 (en)	2004-02-17	Pressure transducer fabricated from beta silicon carbide
US7516668B2 (en)	2009-04-14	Silicon carbide piezoresistive pressure transducer and method of fabrication
US6460416B1 (en)	2002-10-08	Capacitor structure and fabrication process
EP0528251B1 (fr)	1996-12-18	Procédé pour fabriquer un capteur d'écoulement gazeux à semiconducteur
JPS61245502A (ja)	1986-10-31	薄膜サ−ミスタ
US5375034A (en)	1994-12-20	Silicon capacitive pressure sensor having a glass dielectric deposited using ion milling
JP3377874B2 (ja)	2003-02-17	薄膜センサエレメント及びその製造方法
JPH06289049A (ja)	1994-10-18	加速度センサ
JPH0250066B2 (fr)	1990-11-01
JPH04204224A (ja)	1992-07-24	セラミック又は石英ロードセル
JP2000241274A (ja)	2000-09-08	半導体圧力センサの部品、半導体圧力センサおよびその製造方法
JP2010223599A (ja)	2010-10-07	機能素子
JP2000180282A (ja)	2000-06-30	半導体圧力センサ
WO1995011433A1 (fr)	1995-04-27	Fabrication de capteurs comportant une jauge de contraintes
JPH0566537B2 (fr)	1993-09-22