IL94108A - Forming diamond coatings using a silent discharge plasma jet process - Google Patents
Forming diamond coatings using a silent discharge plasma jet processInfo
- Publication number
- IL94108A IL94108A IL9410890A IL9410890A IL94108A IL 94108 A IL94108 A IL 94108A IL 9410890 A IL9410890 A IL 9410890A IL 9410890 A IL9410890 A IL 9410890A IL 94108 A IL94108 A IL 94108A
- Authority
- IL
- Israel
- Prior art keywords
- substrate
- carbon
- discharge
- plasma
- diamond coatings
- Prior art date
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 59
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 title claims abstract description 31
- 230000008569 process Effects 0.000 title claims abstract description 30
- 238000000576 coating method Methods 0.000 title claims abstract description 27
- 239000007789 gas Substances 0.000 claims abstract description 92
- 239000000758 substrate Substances 0.000 claims abstract description 73
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 21
- 239000000203 mixture Substances 0.000 claims abstract description 16
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 32
- 239000001257 hydrogen Substances 0.000 claims description 20
- 229910052739 hydrogen Inorganic materials 0.000 claims description 20
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 17
- 230000008021 deposition Effects 0.000 claims description 12
- 150000002431 hydrogen Chemical class 0.000 claims description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 229930195733 hydrocarbon Natural products 0.000 claims description 4
- 150000002430 hydrocarbons Chemical class 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 4
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims description 3
- 229910002091 carbon monoxide Inorganic materials 0.000 claims description 3
- 239000004215 Carbon black (E152) Substances 0.000 claims 2
- 210000002381 plasma Anatomy 0.000 description 44
- 238000000151 deposition Methods 0.000 description 11
- 239000001307 helium Substances 0.000 description 11
- 229910052734 helium Inorganic materials 0.000 description 11
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 11
- 238000001069 Raman spectroscopy Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 229910002804 graphite Inorganic materials 0.000 description 6
- 239000010439 graphite Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 5
- 238000001237 Raman spectrum Methods 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- 239000011733 molybdenum Substances 0.000 description 5
- 241000894007 species Species 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000010891 electric arc Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910003481 amorphous carbon Inorganic materials 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- -1 carbon ions Chemical class 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000005297 pyrex Substances 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000010494 dissociation reaction Methods 0.000 description 2
- 230000005593 dissociations Effects 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 230000004083 survival effect Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 241001354243 Corona Species 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 229910021387 carbon allotrope Inorganic materials 0.000 description 1
- 150000001723 carbon free-radicals Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910021397 glassy carbon Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- XWHPIFXRKKHEKR-UHFFFAOYSA-N iron silicon Chemical compound [Si].[Fe] XWHPIFXRKKHEKR-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- AHADSRNLHOHMQK-UHFFFAOYSA-N methylidenecopper Chemical compound [Cu].[C] AHADSRNLHOHMQK-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002153 silicon-carbon composite material Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
- C23C16/276—Diamond only using plasma jets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
- C23C16/277—Diamond only using other elements in the gas phase besides carbon and hydrogen; using other elements besides carbon, hydrogen and oxygen in case of use of combustion torches; using other elements besides carbon, hydrogen and inert gas in case of use of plasma jets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Combustion & Propulsion (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/340,995 US5104634A (en) | 1989-04-20 | 1989-04-20 | Process for forming diamond coating using a silent discharge plasma jet process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL94108A0 IL94108A0 (en) | 1991-01-31 |
| IL94108A true IL94108A (en) | 1994-11-11 |
Family
ID=23335820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL9410890A IL94108A (en) | 1989-04-20 | 1990-04-18 | Forming diamond coatings using a silent discharge plasma jet process |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5104634A (fr) |
| EP (1) | EP0394735A3 (fr) |
| JP (1) | JPH02296796A (fr) |
| CA (1) | CA2014367A1 (fr) |
| IL (1) | IL94108A (fr) |
| ZA (1) | ZA903022B (fr) |
Families Citing this family (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5356672A (en) * | 1990-05-09 | 1994-10-18 | Jet Process Corporation | Method for microwave plasma assisted supersonic gas jet deposition of thin films |
| US5256205A (en) * | 1990-05-09 | 1993-10-26 | Jet Process Corporation | Microwave plasma assisted supersonic gas jet deposition of thin film materials |
| DE69125118T2 (de) * | 1990-12-15 | 1997-06-19 | Fujitsu Ltd | Verfahren zur Herstellung eines Diamant-Überzuges |
| US5204144A (en) * | 1991-05-10 | 1993-04-20 | Celestech, Inc. | Method for plasma deposition on apertured substrates |
| US5411758A (en) * | 1991-10-09 | 1995-05-02 | Norton Company | Method of making synthetic diamond wear component |
| US5286331A (en) * | 1991-11-01 | 1994-02-15 | International Business Machines Corporation | Supersonic molecular beam etching of surfaces |
| DE4204650C1 (fr) * | 1992-02-15 | 1993-07-08 | Hoffmeister, Helmut, Dr., 4400 Muenster, De | |
| US5358596A (en) * | 1992-07-02 | 1994-10-25 | The Board Of Trustees Of The Leland Stanford Junior University | Method and apparatus for growing diamond films |
| CA2112308C (fr) * | 1993-01-22 | 2000-08-15 | Louis K. Bigelow | Methode de fabrication d'un film de diamant blanc |
| JPH0794303A (ja) * | 1993-05-04 | 1995-04-07 | Kobe Steel Ltd | 高配向性ダイヤモンド薄膜サーミスタ |
| US5442199A (en) * | 1993-05-14 | 1995-08-15 | Kobe Steel Usa, Inc. | Diamond hetero-junction rectifying element |
| US5560779A (en) * | 1993-07-12 | 1996-10-01 | Olin Corporation | Apparatus for synthesizing diamond films utilizing an arc plasma |
| US5560897A (en) * | 1993-10-07 | 1996-10-01 | The Regents Of The University Of California Office Of Technology Transfer | Plasma-assisted conversion of solid hydrocarbon to diamond |
| US5578901A (en) * | 1994-02-14 | 1996-11-26 | E. I. Du Pont De Nemours And Company | Diamond fiber field emitters |
| AU2239995A (en) * | 1994-04-06 | 1995-10-30 | Regents Of The University Of California, The | Process to produce diamond films |
| US5637950A (en) * | 1994-10-31 | 1997-06-10 | Lucent Technologies Inc. | Field emission devices employing enhanced diamond field emitters |
| US5551983A (en) * | 1994-11-01 | 1996-09-03 | Celestech, Inc. | Method and apparatus for depositing a substance with temperature control |
| US5571332A (en) * | 1995-02-10 | 1996-11-05 | Jet Process Corporation | Electron jet vapor deposition system |
| US5976206A (en) * | 1995-05-19 | 1999-11-02 | Saint-Gobain/Norton Industrial Ceramics Corporation | Method of making white diamond film |
| US5679404A (en) * | 1995-06-07 | 1997-10-21 | Saint-Gobain/Norton Industrial Ceramics Corporation | Method for depositing a substance with temperature control |
| US5776553A (en) * | 1996-02-23 | 1998-07-07 | Saint Gobain/Norton Industrial Ceramics Corp. | Method for depositing diamond films by dielectric barrier discharge |
| US6082294A (en) * | 1996-06-07 | 2000-07-04 | Saint-Gobain Industrial Ceramics, Inc. | Method and apparatus for depositing diamond film |
| US6173672B1 (en) | 1997-06-06 | 2001-01-16 | Celestech, Inc. | Diamond film deposition on substrate arrays |
| US6406760B1 (en) | 1996-06-10 | 2002-06-18 | Celestech, Inc. | Diamond film deposition on substrate arrays |
| US6030506A (en) * | 1997-09-16 | 2000-02-29 | Thermo Power Corporation | Preparation of independently generated highly reactive chemical species |
| US6020677A (en) * | 1996-11-13 | 2000-02-01 | E. I. Du Pont De Nemours And Company | Carbon cone and carbon whisker field emitters |
| DE19718518C2 (de) * | 1997-05-02 | 1999-11-04 | Daimler Chrysler Ag | Verfahren und Vorrichtung zur Abscheidung von Diamant auf einem Substrat und Verwendung |
| DE19718737C1 (de) * | 1997-05-02 | 1998-07-23 | Daimler Benz Ag | Verfahren zur Abscheidung von Diamant auf einem Substrat |
| DE19718516C1 (de) * | 1997-05-02 | 1998-08-20 | Daimler Benz Ag | Verfahren zur Abscheidung von Diamant auf einem Substrat |
| US6110544A (en) * | 1997-06-26 | 2000-08-29 | General Electric Company | Protective coating by high rate arc plasma deposition |
| US6213049B1 (en) * | 1997-06-26 | 2001-04-10 | General Electric Company | Nozzle-injector for arc plasma deposition apparatus |
| US6165554A (en) * | 1997-11-12 | 2000-12-26 | Jet Process Corporation | Method for hydrogen atom assisted jet vapor deposition for parylene N and other polymeric thin films |
| WO2000003566A1 (fr) * | 1998-07-13 | 2000-01-20 | Toshiyuki Takamatsu | Appareil a decharge pour micro-ondes |
| US6230651B1 (en) * | 1998-12-30 | 2001-05-15 | Lam Research Corporation | Gas injection system for plasma processing |
| US6365016B1 (en) * | 1999-03-17 | 2002-04-02 | General Electric Company | Method and apparatus for arc plasma deposition with evaporation of reagents |
| US6617538B1 (en) | 2000-03-31 | 2003-09-09 | Imad Mahawili | Rotating arc plasma jet and method of use for chemical synthesis and chemical by-products abatements |
| EP1296772B1 (fr) * | 2000-06-16 | 2009-09-09 | Ati Properties, Inc. | Procede de formage par pulverisation, atomisation et transfert thermique |
| EP1174526A1 (fr) * | 2000-07-17 | 2002-01-23 | Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO | Dépôt sous vide en continu |
| US8891583B2 (en) * | 2000-11-15 | 2014-11-18 | Ati Properties, Inc. | Refining and casting apparatus and method |
| US6496529B1 (en) * | 2000-11-15 | 2002-12-17 | Ati Properties, Inc. | Refining and casting apparatus and method |
| DE10104615A1 (de) * | 2001-02-02 | 2002-08-14 | Bosch Gmbh Robert | Verfahren zur Erzeugung einer Funktionsbeschichtung mit einer HF-ICP-Plasmastrahlquelle |
| US7288293B2 (en) * | 2001-03-27 | 2007-10-30 | Apit Corp. S.A. | Process for plasma surface treatment and device for realizing the process |
| US20030070620A1 (en) | 2001-10-15 | 2003-04-17 | Cooperberg David J. | Tunable multi-zone gas injection system |
| US8220489B2 (en) | 2002-12-18 | 2012-07-17 | Vapor Technologies Inc. | Faucet with wear-resistant valve component |
| US7866343B2 (en) * | 2002-12-18 | 2011-01-11 | Masco Corporation Of Indiana | Faucet |
| US8555921B2 (en) | 2002-12-18 | 2013-10-15 | Vapor Technologies Inc. | Faucet component with coating |
| US7866342B2 (en) * | 2002-12-18 | 2011-01-11 | Vapor Technologies, Inc. | Valve component for faucet |
| US6904935B2 (en) * | 2002-12-18 | 2005-06-14 | Masco Corporation Of Indiana | Valve component with multiple surface layers |
| US7015415B2 (en) * | 2004-02-18 | 2006-03-21 | Dry Plasma Systems, Inc. | Higher power density downstream plasma |
| US7114548B2 (en) * | 2004-12-09 | 2006-10-03 | Ati Properties, Inc. | Method and apparatus for treating articles during formation |
| DE102005004242B4 (de) * | 2005-01-29 | 2008-11-27 | Mtu Aero Engines Gmbh | Verfahren zur Herstellung von Triebwerkteilen |
| JP2008534290A (ja) * | 2005-03-22 | 2008-08-28 | エルプスロー・アルミニウム・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | ろう付け用表面の部分的又は完全な被覆を持つアルミニウムから成る部材及び被覆を製造する方法 |
| US20070026205A1 (en) | 2005-08-01 | 2007-02-01 | Vapor Technologies Inc. | Article having patterned decorative coating |
| US7803211B2 (en) * | 2005-09-22 | 2010-09-28 | Ati Properties, Inc. | Method and apparatus for producing large diameter superalloy ingots |
| US7578960B2 (en) | 2005-09-22 | 2009-08-25 | Ati Properties, Inc. | Apparatus and method for clean, rapidly solidified alloys |
| US7803212B2 (en) * | 2005-09-22 | 2010-09-28 | Ati Properties, Inc. | Apparatus and method for clean, rapidly solidified alloys |
| US8381047B2 (en) * | 2005-11-30 | 2013-02-19 | Microsoft Corporation | Predicting degradation of a communication channel below a threshold based on data transmission errors |
| DE102006024050B4 (de) * | 2006-05-23 | 2009-08-20 | Daimler Ag | Vorrichtung zum Aufbringen einer Beschichtung auf eine Oberfläche eines Werkstückes |
| WO2008121630A1 (fr) | 2007-03-30 | 2008-10-09 | Ati Properties, Inc. | Four de fusion comprenant un émetteur d'électrons de plasma ionique à décharge à fil |
| US8748773B2 (en) | 2007-03-30 | 2014-06-10 | Ati Properties, Inc. | Ion plasma electron emitters for a melting furnace |
| US8268094B2 (en) * | 2007-05-09 | 2012-09-18 | Air Products And Chemicals, Inc. | Furnace atmosphere activation method and apparatus |
| US7798199B2 (en) | 2007-12-04 | 2010-09-21 | Ati Properties, Inc. | Casting apparatus and method |
| KR101750841B1 (ko) * | 2009-02-05 | 2017-06-26 | 오엘리콘 멧코 아게, 볼렌 | 기재 표면의 코팅 또는 처리를 위한 플라즈마 코팅 시스템 및 그 방법 |
| ITMI20092107A1 (it) * | 2009-11-30 | 2011-06-01 | Milano Politecnico | Metodo e apparato per la deposizione di strati sottili nanostrutturati con morfologia e nanostruttura controllata |
| US8747956B2 (en) | 2011-08-11 | 2014-06-10 | Ati Properties, Inc. | Processes, systems, and apparatus for forming products from atomized metals and alloys |
| FR3011540B1 (fr) * | 2013-10-07 | 2016-01-01 | Centre Nat Rech Scient | Procede et systeme de structuration submicrometrique d'une surface de substrat |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3005762A (en) * | 1958-01-20 | 1961-10-24 | Aero Chem Res Lab Inc | Electric discharge jet stream |
| US3630679A (en) * | 1968-06-26 | 1971-12-28 | Univ Case Western Reserve | Diamond growth process |
| GB1298369A (en) * | 1970-05-01 | 1972-11-29 | Inst Fizicheskoi Khim An Sssr | A method of synthesising diamond |
| US3961103A (en) * | 1972-07-12 | 1976-06-01 | Space Sciences, Inc. | Film deposition |
| DE3014258A1 (de) * | 1980-04-14 | 1981-10-15 | Heinrich Dr. 6236 Eschborn Winter | Verfahren zum aufbringen von metallischen, metalloidischen oder keramischen schichten mit verbesserten strukturellen eigenschaften durch plasmaspruehen |
| JPS6055480B2 (ja) * | 1982-08-23 | 1985-12-05 | 住友電気工業株式会社 | ダイヤモンドの気相合成法 |
| JPS59232991A (ja) * | 1983-06-16 | 1984-12-27 | Sumitomo Electric Ind Ltd | ダイヤモンド薄膜の製造法 |
| JPS60103098A (ja) * | 1983-11-04 | 1985-06-07 | Kyocera Corp | ダイヤモンド膜の製造方法 |
| JPS60122796A (ja) * | 1983-12-06 | 1985-07-01 | Sumitomo Electric Ind Ltd | ダイヤモンドの気相合成法 |
| JPS60145995A (ja) * | 1984-01-10 | 1985-08-01 | Nec Corp | ダイヤモンド状カ−ボンの製造方法 |
| JPS60191097A (ja) * | 1984-03-08 | 1985-09-28 | Mitsubishi Metal Corp | 人工ダイヤモンドの析出生成方法 |
| US4645977A (en) * | 1984-08-31 | 1987-02-24 | Matsushita Electric Industrial Co., Ltd. | Plasma CVD apparatus and method for forming a diamond like carbon film |
| JPS61286299A (ja) * | 1985-06-07 | 1986-12-16 | Asahi Chem Ind Co Ltd | ダイヤモンドの製造方法 |
| DE3690606C2 (de) * | 1985-11-25 | 1995-09-21 | Yoichi Hirose | Verfahren zur Synthese von Diamant |
| JPS62138394A (ja) * | 1985-12-06 | 1987-06-22 | Sumitomo Electric Ind Ltd | ダイヤモンドの製造方法 |
| JPS63107898A (ja) * | 1986-10-23 | 1988-05-12 | Natl Inst For Res In Inorg Mater | プラズマを用いるダイヤモンドの合成法 |
| JPS63107899A (ja) * | 1986-10-24 | 1988-05-12 | Semiconductor Energy Lab Co Ltd | 薄膜形成方法 |
| US4851254A (en) * | 1987-01-13 | 1989-07-25 | Nippon Soken, Inc. | Method and device for forming diamond film |
| JPS63182296A (ja) * | 1987-01-26 | 1988-07-27 | Hitachi Ltd | ダイヤモンドの合成法 |
| US4859493A (en) * | 1987-03-31 | 1989-08-22 | Lemelson Jerome H | Methods of forming synthetic diamond coatings on particles using microwaves |
| JP2670044B2 (ja) * | 1987-03-31 | 1997-10-29 | キヤノン株式会社 | 表示制御装置 |
| EP0286306B1 (fr) * | 1987-04-03 | 1993-10-06 | Fujitsu Limited | Méthode et appareil de déposition en phase gazeuse de diamant |
| JPS63282200A (ja) * | 1987-05-14 | 1988-11-18 | Fujitsu Ltd | ダイヤモンドの化学気相成長方法 |
| US4822466A (en) * | 1987-06-25 | 1989-04-18 | University Of Houston - University Park | Chemically bonded diamond films and method for producing same |
-
1989
- 1989-04-20 US US07/340,995 patent/US5104634A/en not_active Expired - Fee Related
-
1990
- 1990-04-09 EP EP19900106785 patent/EP0394735A3/fr not_active Withdrawn
- 1990-04-11 CA CA002014367A patent/CA2014367A1/fr not_active Abandoned
- 1990-04-18 IL IL9410890A patent/IL94108A/en not_active IP Right Cessation
- 1990-04-20 ZA ZA903022A patent/ZA903022B/xx unknown
- 1990-04-20 JP JP2105148A patent/JPH02296796A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US5104634A (en) | 1992-04-14 |
| EP0394735A2 (fr) | 1990-10-31 |
| CA2014367A1 (fr) | 1990-10-20 |
| ZA903022B (en) | 1990-12-28 |
| JPH02296796A (ja) | 1990-12-07 |
| EP0394735A3 (fr) | 1991-01-23 |
| IL94108A0 (en) | 1991-01-31 |
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