IL96504A - Bond signature analyser - Google Patents

Bond signature analyser

Info

Publication number
IL96504A
IL96504A IL9650490A IL9650490A IL96504A IL 96504 A IL96504 A IL 96504A IL 9650490 A IL9650490 A IL 9650490A IL 9650490 A IL9650490 A IL 9650490A IL 96504 A IL96504 A IL 96504A
Authority
IL
Israel
Prior art keywords
bond
formation
signal
samples
sampling
Prior art date
Application number
IL9650490A
Other languages
English (en)
Other versions
IL96504A0 (en
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of IL96504A0 publication Critical patent/IL96504A0/xx
Publication of IL96504A publication Critical patent/IL96504A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Quality & Reliability (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
IL9650490A 1989-12-22 1990-11-29 Bond signature analyser IL96504A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/455,706 US4998664A (en) 1989-12-22 1989-12-22 Bond signature analyzer

Publications (2)

Publication Number Publication Date
IL96504A0 IL96504A0 (en) 1991-08-16
IL96504A true IL96504A (en) 1995-10-31

Family

ID=23809951

Family Applications (1)

Application Number Title Priority Date Filing Date
IL9650490A IL96504A (en) 1989-12-22 1990-11-29 Bond signature analyser

Country Status (5)

Country Link
US (1) US4998664A (de)
JP (1) JPH07111999B2 (de)
CH (1) CH682597A5 (de)
IL (1) IL96504A (de)
NL (1) NL9002845A (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR930002339B1 (ko) * 1989-04-20 1993-03-29 가부시기가이샤 도시바 짧은 직선 벡터의 곡선 세그멘트에 3차 베지어(Bzxier)곡선을 정합시키는 방법
JP3007195B2 (ja) * 1991-09-18 2000-02-07 株式会社日立製作所 ボンディング装置およびボンディング部検査装置
US5595330A (en) * 1994-08-24 1997-01-21 Verity Instruments, Inc. Power supply
DE4447073C1 (de) * 1994-12-29 1996-07-18 Bosch Gmbh Robert Verfahren zum Prüfen von durch Ultraschalldrahtbonden hergestellten Verbindungen
JP3176580B2 (ja) * 1998-04-09 2001-06-18 太陽誘電株式会社 電子部品の実装方法及び実装装置
DE10020374A1 (de) * 1999-07-02 2001-01-25 Fujitsu Ltd Kopfbaugruppe einer Plattenvorrichtung mit einem Kopf-IC-Chip, der durch Ultraschallbonden an eine Aufhängung montiert ist
US6193134B1 (en) * 2000-06-26 2001-02-27 Advanced Micro Devices, Inc. Determination of quality of bonding between a conductive ball and a conductive pad within an IC package
KR20030066344A (ko) * 2002-02-01 2003-08-09 에섹 트레이딩 에스에이 와이어본더로 접합시에 최적의 접합 파라미터들을결정하기 위한 방법
FR2838517B1 (fr) * 2002-04-15 2004-09-10 Saint Gobain Procede pour evaluer la resistance mecanique d'un intercalaire
US20050029328A1 (en) * 2003-06-18 2005-02-10 Esec Trading Sa Method for checking the quality of a wedge bond
US7845542B2 (en) * 2005-09-22 2010-12-07 Palomar Technologies, Inc. Monitoring deformation and time to logically constrain a bonding process
JP4530984B2 (ja) 2005-12-28 2010-08-25 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
US7896218B2 (en) * 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
DE102007054626A1 (de) * 2007-11-12 2009-05-14 Hesse & Knipps Gmbh Verfahren und Vorrichtung zum Ultraschallbonden
JP2011066191A (ja) * 2009-09-17 2011-03-31 Renesas Electronics Corp 半導体装置の製造方法およびボンディング装置
US11302669B2 (en) * 2015-10-15 2022-04-12 Skyworks Solutions, Inc. Wire bond cleaning method and wire bonding recovery process

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3445750A (en) * 1966-10-17 1969-05-20 Uthe Technology Ultrasonic frequency power supply
US3636456A (en) * 1969-12-29 1972-01-18 Uthe Technology Impedance-measuring network
US3852999A (en) * 1969-12-29 1974-12-10 Uthe Technology Impedance measuring network
US3693158A (en) * 1970-04-01 1972-09-19 Uthe Technology Method and apparatus for ultrasonic weld quality analysis employing plural analysis signals
US3934108A (en) * 1974-09-16 1976-01-20 Uthe Technology, Inc. Lead bonding method and apparatus
JPS61171144A (ja) * 1985-01-25 1986-08-01 Nec Corp 半導体組立装置
JPS61294830A (ja) * 1985-06-21 1986-12-25 Nec Corp 自動ワイヤ−ボンデイング装置
US4815001A (en) * 1986-05-30 1989-03-21 Crestek, Inc. Ultrasonic wire bonding quality monitor and method
US4824005A (en) * 1986-08-13 1989-04-25 Orthodyne Electronics Corporation Dual mode ultrasonic generator in a wire bonding apparatus
JPS62234338A (ja) * 1987-02-09 1987-10-14 Hitachi Ltd ワイヤボンデイング装置
JPH01174930U (de) * 1988-05-30 1989-12-13
JPH056661Y2 (de) * 1988-09-08 1993-02-19

Also Published As

Publication number Publication date
US4998664A (en) 1991-03-12
JPH07111999B2 (ja) 1995-11-29
IL96504A0 (en) 1991-08-16
JPH04120753A (ja) 1992-04-21
CH682597A5 (de) 1993-10-15
NL9002845A (nl) 1991-07-16

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RH Patent void